A 1.8 V RF CMOS Active Inductor with 0.18 um CMOS Technology

A active inductor in CMOS techonology with a supply voltage of 1.8V is presented. The value of the inductance L can be in the range from 0.12nH to 0.25nH in high frequency(HF). The proposed active inductor is designed in TSMC 0.18-um CMOS technology. The power dissipation of this inductor can retain constant at all operating frequency bands and consume around 20mW from 1.8V power supply. Inductors designed by integrated circuit occupy much smaller area, for this reason,attracted researchers attention for more than decade. In this design we used Advanced Designed System (ADS) for simulating cicuit.

Collaborative Design System based on Object-Oriented Modeling of Supply Chain Simulation: A Case Study of Thai Jewelry Industry

The paper proposes a new concept in developing collaborative design system. The concept framework involves applying simulation of supply chain management to collaborative design called – 'SCM–Based Design Tool'. The system is developed particularly to support design activities and to integrate all facilities together. The system is aimed to increase design productivity and creativity. Therefore, designers and customers can collaborate by the system since conceptual design. JAG: Jewelry Art Generator based on artificial intelligence techniques is integrated into the system. Moreover, the proposed system can support users as decision tool and data propagation. The system covers since raw material supply until product delivery. Data management and sharing information are visually supported to designers and customers via user interface. The system is developed on Web–assisted product development environment. The prototype system is presented for Thai jewelry industry as a system prototype demonstration, but applicable for other industry.

Improvement in Silicon on Insulator Devices using Strained Si/SiGe Technology for High Performance in RF Integrated Circuits

RF performance of SOI CMOS device has attracted significant amount of interest recently. In order to improve RF parameters, Strained Si/Relaxed Si0.8Ge0.2 investigated as a replacement for Si technology .Enhancement of carrier mobility associated with strain engineering makes Strained Si a promising candidate for improving RF performance of CMOS technology. From the simulation, the cut-off frequency is estimated to be 224 GHZ, whereas in SOI at similar bias is about 188 GHZ. Therefore, Strained Si exhibits 19% improvement in cut-off frequency over similar Si counterpart. In this paper, Ion/Ioff ratio is studied as one of the key parameters in logic and digital application. Strained Si/SiGe demonstrates better Ion/Ioff characteristic than SOI, in similar channel length of 100 nm.Another important key analog figures of merit such as Early Voltage (VEA) ,transconductance vs drain current (gm /Ids) are studied. They introduce the efficiency of the devices to convert dc power into ac frequency.

Human Body Configuration using Bayesian Model

In this paper we present a novel approach for human Body configuration based on the Silhouette. We propose to address this problem under the Bayesian framework. We use an effective Model based MCMC (Markov Chain Monte Carlo) method to solve the configuration problem, in which the best configuration could be defined as MAP (maximize a posteriori probability) in Bayesian model. This model based MCMC utilizes the human body model to drive the MCMC sampling from the solution space. It converses the original high dimension space into a restricted sub-space constructed by the human model and uses a hybrid sampling algorithm. We choose an explicit human model and carefully select the likelihood functions to represent the best configuration solution. The experiments show that this method could get an accurate configuration and timesaving for different human from multi-views.

Vulnerabilities of IEEE 802.11i Wireless LAN CCMP Protocol

IEEE has recently incorporated CCMP protocol to provide robust security to IEEE 802.11 wireless LANs. It is found that CCMP has been designed with a weak nonce construction and transmission mechanism, which leads to the exposure of initial counter value. This weak construction of nonce renders the protocol vulnerable to attacks by intruders. This paper presents how the initial counter can be pre-computed by the intruder. This vulnerability of counter block value leads to pre-computation attack on the counter mode encryption of CCMP. The failure of the counter mode will result in the collapse of the whole security mechanism of 802.11 WLAN.

An 880 / 1760 MHz Dual Bandwidth Active RC Filter for 60 GHz Applications

An active RC filters with a 880 / 1760 MHz dual bandwidth tuning ability is present for 60 GHz unlicensed band applications. A third order Butterworth low-pass filter utilizes two Cherry-Hooper amplifiers to satisfy the very high bandwidth requirements of an amplifier. The low-pass filter is fabricated in 90nm standard CMOS process. Drawing 6.7 mW from 1.2 V power supply, the low frequency gains of the filter are -2.5 and -4.1 dB, and the output third order intercept points (OIP3) are +2.2 and +1.9 dBm for the single channel and channel bonding conditions, respectively.

Design of a Tube Vent to Enhance the Role of Roof Solar Collector

The objective of this paper was to designing a ventilation system to enhance the performance of roof solar collector (RSC) for reducing heat accumulation inside the house. The RSC has 1.8 m2 surface area made of CPAC monier roof tiles on the upper part and gypsum board on the lower part. The space between CPAC monier and gypsum board was fixed at 14 cm. Ventilation system of modified roof solar collector (modified RSC) consists of 9 tubes of 0.15m diameter and installed in the lower part of RSC. Experimental result showed that the temperature of the room, and attic temperature. The average temperature reduction of room of house used modified RSC is about 2oC. and the percentage of room temperature reduction varied between 0 to 10%. Therefore, modified RSC is an interesting option in the sense that it promotes solar energy and conserve energy.

The Implementation of Good Manufacturing Practice in Polycarbonate Film Industry

This study reports the implementation of Good Manufacturing Practice (GMP) in a polycarbonate film processing plant. The implementation of GMP took place with the creation of a multidisciplinary team. It was carried out in four steps: conduct gap assessment, create gap closure plan, close gaps, and follow up the GMP implementation. The basis for the gap assessment is the guideline for GMP for plastic materials and articles intended for Food Contact Material (FCM), which was edited by Plastic Europe. The effective results of the GMP implementation in this study showed 100% completion of gap assessment. The key success factors for implementing GMP in production process are the commitment, intention and support of top management.

Design of Folded Cascode OTA in Different Regions of Operation through gm/ID Methodology

This paper presents an optimized methodology to folded cascode operational transconductance amplifier (OTA) design. The design is done in different regions of operation, weak inversion, strong inversion and moderate inversion using the gm/ID methodology in order to optimize MOS transistor sizing. Using 0.35μm CMOS process, the designed folded cascode OTA achieves a DC gain of 77.5dB and a unity-gain frequency of 430MHz in strong inversion mode. In moderate inversion mode, it has a 92dB DC gain and provides a gain bandwidth product of around 69MHz. The OTA circuit has a DC gain of 75.5dB and unity-gain frequency limited to 19.14MHZ in weak inversion region.

Role of Personnel Planning in Business Continuity Management

Business continuity management (BCM) identifies potential external and internal threats to an organization and their impacts to business operations. The goal of the article is to identify, based on the analysis of employee turnover in organizations in the Czech Republic, the role of personnel planning in BCM. The article is organized as follows. The first part of the article concentrates on the theoretical background of the topic. The second part of the article is dedicated to the evaluation of the outcomes of the survey conducted (questionnaire survey), focusing on the analysis of employee turnover in organizations in the Czech Republic. The final part of the article underlines the role of personnel planning in BCM, since poor planning of staff needs in an organization can represent a future threat for business continuity ensuring.

A New True RMS-to-DC Converter in CMOS Technology

This paper presents a new true RMS-to-DC converter circuit based on a square-root-domain squarer/divider. The circuit is designed by employing up-down translinear loop and using of MOSFET transistors that operate in strong inversion saturation region. The converter offer advantages of two-quadrant input current, low circuit complexity, low supply voltage (1.2V) and immunity from the body effect. The circuit has been simulated by HSPICE. The simulation results are seen to conform to the theoretical analysis and shows benefits of the proposed circuit.

A Single-chip Proportional to Absolute Temperature Sensor Using CMOS Technology

Nowadays it is a trend for electronic circuit designers to integrate all system components on a single-chip. This paper proposed the design of a single-chip proportional to absolute temperature (PTAT) sensor including a voltage reference circuit using CEDEC 0.18m CMOS Technology. It is a challenge to design asingle-chip wide range linear response temperature sensor for many applications. The channel widths between the compensation transistor and the reference transistor are critical to design the PTAT temperature sensor circuit. The designed temperature sensor shows excellent linearity between -100°C to 200° and the sensitivity is about 0.05mV/°C. The chip is designed to operate with a single voltage source of 1.6V.

An Algorithm of Finite Capacity Material Requirement Planning System for Multi-stage Assembly Flow Shop

This paper aims to develop an algorithm of finite capacity material requirement planning (FCMRP) system for a multistage assembly flow shop. The developed FCMRP system has two main stages. The first stage is to allocate operations to the first and second priority work centers and also determine the sequence of the operations on each work center. The second stage is to determine the optimal start time of each operation by using a linear programming model. Real data from a factory is used to analyze and evaluate the effectiveness of the proposed FCMRP system and also to guarantee a practical solution to the user. There are five performance measures, namely, the total tardiness, the number of tardy orders, the total earliness, the number of early orders, and the average flow-time. The proposed FCMRP system offers an adjustable solution which is a compromised solution among the conflicting performance measures. The user can adjust the weight of each performance measure to obtain the desired performance. The result shows that the combination of FCMRP NP3 and EDD outperforms other combinations in term of overall performance index. The calculation time for the proposed FCMRP system is about 10 minutes which is practical for the planners of the factory.

A Smart-Visio Microphone for Audio-Visual Speech Recognition “Vmike“

The practical implementation of audio-video coupled speech recognition systems is mainly limited by the hardware complexity to integrate two radically different information capturing devices with good temporal synchronisation. In this paper, we propose a solution based on a smart CMOS image sensor in order to simplify the hardware integration difficulties. By using on-chip image processing, this smart sensor can calculate in real time the X/Y projections of the captured image. This on-chip projection reduces considerably the volume of the output data. This data-volume reduction permits a transmission of the condensed visual information via the same audio channel by using a stereophonic input available on most of the standard computation devices such as PC, PDA and mobile phones. A prototype called VMIKE (Visio-Microphone) has been designed and realised by using standard 0.35um CMOS technology. A preliminary experiment gives encouraged results. Its efficiency will be further investigated in a large variety of applications such as biometrics, speech recognition in noisy environments, and vocal control for military or disabled persons, etc.

Low resistivity Hf/Al/Ni/Au Ohmic Contact Scheme to n-Type GaN

The electrical and structural properties of Hf/Al/Ni/Au (20/100/25/50 nm) ohmic contact to n-GaN are reported in this study. Specific contact resistivities of Hf/Al/Ni/Au based contacts have been investigated as a function of annealing temperature and achieve the lowest value of 1.09´10-6 Ω·cm2 after annealing at 650 oC in vacuum. A detailed mechanism of ohmic contact formation is discussed. By using different chemical analyses, it is anticipated that the formation of Hf-Al-N alloy might be responsible to form low temperature ohmic contacts for the Hf-based scheme to n-GaN.

Device Discover: A Component for Network Management System using Simple Network Management Protocol

Virtually all existing networked system management tools use a Manager/Agent paradigm. That is, distributed agents are deployed on managed devices to collect local information and report it back to some management unit. Even those that use standard protocols such as SNMP fall into this model. Using standard protocol has the advantage of interoperability among devices from different vendors. However, it may not be able to provide customized information that is of interest to satisfy specific management needs. In this dissertation work, different approaches are used to collect information regarding the devices attached to a Local Area Network. An SNMP aware application is being developed that will manage the discovery procedure and will be used as data collector.

Quasi-ballistic Transport in Submicron Hg0.8Cd0.2Te Diodes: Hydrodynamic Modeling

In this paper, we analyze the problem of quasiballistic electron transport in ultra small of mercury -cadmiumtelluride (Hg0.8Cd0.2Te -MCT) n+-n- n+ devices from hydrodynamic point view. From our study, we note that, when the size of the active layer is low than 0.1μm and for low bias application( ( ≥ 9mV), the quasi-ballistic transport has an important effect.

Corruption, Economic Growth, and Income Inequality: Evidence from Ten Countries in Asia

This study utilizes the panel vector error correction model (PVECM) to examine the relationship among corruption, economic growth, and income inequality experienced within ten Asian countries over the 1995 to 2010 period. According to the empirical results, we do not support the common perception that corruption decreases economic growth. On the contrary, we found that corruption increases economic growth. Meanwhile, an increase in economic growth will cause an increase in income inequality, although the effect is insignificant. Similarly, an increase in income inequality will cause an increase in economic growth but a decrease in corruption, although the effect is also insignificant.

Image Sensor Matrix High Speed Simulation

This paper presents a new high speed simulation methodology to solve the long simulation time problem of CMOS image sensor matrix. Generally, for integrating the pixel matrix in SOC and simulating the system performance, designers try to model the pixel in various modeling languages such as VHDL-AMS, SystemC or Matlab. We introduce a new alternative method based on spice model in cadence design platform to achieve accuracy and reduce simulation time. The simulation results indicate that the pixel output voltage maximum error is at 0.7812% and time consumption reduces from 2.2 days to 13 minutes achieving about 240X speed-up for the 256x256 pixel matrix.

Simulation of Effect of Current Stressing on Reliability of Solder Joints with Cu-Pillar Bumps

The mechanism behind the electromigration and thermomigration failure in flip-chip solder joints with Cu-pillar bumps was investigated in this paper through using finite element method. Hot spot and the current crowding occurrs in the upper corner of copper column instead of solders of the common solder ball. The simulation results show that the change in thermal gradient is noticeable, which might greatly affect the reliability of solder joints with Cu-pillar bumps under current stressing. When the average applied current density is increased from 1×104 A/cm2 to 3×104 A/cm2 in solders, the thermal gradient would increase from 74 K/cm to 901 K/cm at an ambient temperature of 25°C. The force from thermal gradient of 901 K/cm can nearly induce thermomigration by itself. With the increase in applied current, the thermal gradient is growing. It is proposed that thermomigration likely causes a serious reliability issue for Cu column based interconnects.