Abstract: In this study, we have analyzed the transport of analytes
under a two dimensional steady incompressible flow of power-law
fluids through rectangular nanochannel. A mathematical model
based on the Cauchy momentum-Nernst-Planck-Poisson equations is
considered to study the combined effect of mixed electroosmotic
(EO) and pressure driven (PD) flow. The coupled governing
equations are solved numerically by finite volume method. We
have studied extensively the effect of key parameters, e.g., flow
behavior index, concentration of the electrolyte, surface potential,
imposed pressure gradient and imposed electric field strength on
the net average flow across the channel. In addition to study
the effect of mixed EOF and PD on the analyte distribution
across the channel, we consider a nonlinear model based on
general convective-diffusion-electromigration equation. We have also
presented the retention factor for various values of electrolyte
concentration and flow behavior index.
Abstract: Each new semiconductor technology node
brings smaller transistors and wires. Although this makes
transistors faster, wires get slower. In nano-scale regime, the
standard copper (Cu) interconnect will become a major hurdle
for FPGA interconnect due to their high resistivity and
electromigration. This paper presents the comprehensive
evaluation of mixed CNT bundle interconnects and
investigates their prospects as energy efficient and high speed
interconnect for future FPGA routing architecture. All
HSPICE simulations are carried out at operating frequency of
1GHz and it is found that mixed CNT bundle implemented in
FPGAs as interconnect can potentially provide a substantial
delay and energy reduction over traditional interconnects at
32nm process technology.
Abstract: The mechanism behind the electromigration and
thermomigration failure in flip-chip solder joints with Cu-pillar bumps
was investigated in this paper through using finite element method.
Hot spot and the current crowding occurrs in the upper corner of
copper column instead of solders of the common solder ball. The
simulation results show that the change in thermal gradient is
noticeable, which might greatly affect the reliability of solder joints
with Cu-pillar bumps under current stressing. When the average
applied current density is increased from 1×104 A/cm2 to 3×104 A/cm2
in solders, the thermal gradient would increase from 74 K/cm to 901
K/cm at an ambient temperature of 25°C. The force from thermal
gradient of 901 K/cm can nearly induce thermomigration by itself.
With the increase in applied current, the thermal gradient is growing. It
is proposed that thermomigration likely causes a serious reliability
issue for Cu column based interconnects.