Abstract: In this paper the relationships between professional competences and school curriculain IC design industry are explored. The semi-structured questionnaire survey and focus group interview is the research method. Study participants are graduates of microelectronics engineering professional departments who are currently employed in the IC industry. The IC industries are defined as the electronic component manufacturing industry and optical-electronic component manufacturing industry in the semiconductor industry and optical-electronic material devices, respectively. Study participants selected from IC design industry include IC engineering and electronic & semiconductor engineering. The human training with IC design professional competence in microelectronics engineering professional departments is explored in this research. IC professional competences of human resources in the IC design industry include general intelligence and professional intelligence.
Abstract: Silicon photonics has generated an increasing interest in recent years mainly for optical communications optical interconnects in microelectronic circuits or bio-sensing applications. The development of elementary passive and active components (including detectors and modulators), which are mainly fabricated on the silicon on insulator platform for CMOS-compatible fabrication, has reached such a performance level that the integration challenge of silicon photonics with microelectronic circuits should be addressed. Since crystalline silicon can only be grown from another silicon crystal, making it impossible to deposit in this state, the optical devices are typically limited to a single layer. An alternative approach is to integrate a photonic layer above the CMOS chip using back-end CMOS fabrication process. In this paper, various materials, including silicon nitride, amorphous silicon, and polycrystalline silicon, for this purpose are addressed.
Abstract: Current proposals for E-passport or ID-Card is similar to a regular passport with the addition of tiny contactless integrated circuit (computer chip) inserted in the back cover, which will act as a secure storage device of the same data visually displayed on the photo page of the passport. In addition, it will include a digital photograph that will enable biometric comparison, through the use of facial recognition technology at international borders. Moreover, the e-passport will have a new interface, incorporating additional antifraud and security features. However, its problems are reliability, security and privacy. Privacy is a serious issue since there is no encryption between the readers and the E-passport. However, security issues such as authentication, data protection and control techniques cannot be embedded in one process. In this paper, design and prototype implementation of an improved E-passport reader is presented. The passport holder is authenticated online by using GSM network. The GSM network is the main interface between identification center and the e-passport reader. The communication data is protected between server and e-passport reader by using AES to encrypt data for protection will transferring through GSM network. Performance measurements indicate a 19% improvement in encryption cycles versus previously reported results.
Abstract: There are multiple ways to implement a decimator
filter. This paper addresses usage of CIC (cascaded-integrator-comb)
filter and HB (half band) filter as the decimator filter to reduce the
frequency sample rate by factor of 64 and detail of the
implementation step to realize this design in hardware. Low power
design approach for CIC filter and half band filter will be discussed.
The filter design is implemented through MATLAB system
modeling, ASIC (application specific integrated circuit) design flow
and verified using a FPGA (field programmable gate array) board
and MATLAB analysis.
Abstract: Microstrip lines, widely used for good reason, are
broadband in frequency and provide circuits that are compact and
light in weight. They are generally economical to produce since they
are readily adaptable to hybrid and monolithic integrated circuit (IC)
fabrication technologies at RF and microwave frequencies. Although,
the existing EM simulation models used for the synthesis and
analysis of microstrip lines are reasonably accurate, they are
computationally intensive and time consuming. Neural networks
recently gained attention as fast and flexible vehicles to microwave
modeling, simulation and optimization. After learning and
abstracting from microwave data, through a process called training,
neural network models are used during microwave design to provide
instant answers to the task learned.This paper presents simple and
accurate ANN models for the synthesis and analysis of Microstrip
lines to more accurately compute the characteristic parameters and
the physical dimensions respectively for the required design
specifications.
Abstract: in this paper we modified a simple two-dimensional
photonic crystal waveguide by creating micro cavity resonators in order to increase the output light emission which can be applicable to photonic integrated circuits. The micro cavity resonators are constructed by removing two tubes close to the waveguide output. Coupling emitted light from waveguide with those micro cavities, results increasing intensity of waveguide output light. Inserting a tube
in last row of waveguide, we have improved directionality of output
light beam.
Abstract: When binary decision diagrams are formed from
uniformly distributed Monte Carlo data for a large number of
variables, the complexity of the decision diagrams exhibits a
predictable relationship to the number of variables and minterms. In
the present work, a neural network model has been used to analyze the
pattern of shortest path length for larger number of Monte Carlo data
points. The neural model shows a strong descriptive power for the
ISCAS benchmark data with an RMS error of 0.102 for the shortest
path length complexity. Therefore, the model can be considered as a
method of predicting path length complexities; this is expected to lead
to minimum time complexity of very large-scale integrated circuitries
and related computer-aided design tools that use binary decision
diagrams.
Abstract: Truncated multiplier is a good candidate for digital
signal processing (DSP) applications including finite impulse
response (FIR) and discrete cosine transform (DCT). Through
truncated multiplier a significant reduction in Field Programmable
Gate Array (FPGA) resources can be achieved. This paper presents
for the first time a comparison of resource utilization of Spartan-3AN
and Virtex-5 implementation of standard and truncated multipliers
using Very High Speed Integrated Circuit Hardware Description
Language (VHDL). The Virtex-5 FPGA shows significant
improvement as compared to Spartan-3AN FPGA device. The
Virtex-5 FPGA device shows better performance with a percentage
ratio of number of occupied slices for standard to truncated
multipliers is increased from 40% to 73.86% as compared to Spartan-
3AN is decreased from 68.75% to 58.78%. Results show that the
anomaly in Spartan-3AN FPGA device average connection and
maximum pin delay have been efficiently reduced in Virtex-5 FPGA
device.
Abstract: In this document, we have proposed a robust
conceptual strategy, in order to improve the robustness against the manufacturing defects and thus the reliability of logic CMOS circuits. However, in order to enable the use of future CMOS
technology nodes this strategy combines various types of design:
DFR (Design for Reliability), techniques of tolerance: hardware
redundancy TMR (Triple Modular Redundancy) for hard error
tolerance, the DFT (Design for Testability. The Results on largest ISCAS and ITC benchmark circuits show that our approach improves
considerably the reliability, by reducing the key factors, the area costs and fault tolerance probability.
Abstract: Electronic Systems are the core of everyday lives.
They form an integral part in financial networks, mass transit,
telephone systems, power plants and personal computers. Electronic
systems are increasingly based on complex VLSI (Very Large Scale
Integration) integrated circuits. Initial electronic design automation is
concerned with the design and production of VLSI systems. The next
important step in creating a VLSI circuit is Physical Design. The
input to the physical design is a logical representation of the system
under design. The output of this step is the layout of a physical
package that optimally or near optimally realizes the logical
representation. Physical design problems are combinatorial in nature
and of large problem sizes. Darwin observed that, as variations are
introduced into a population with each new generation, the less-fit
individuals tend to extinct in the competition of basic necessities.
This survival of fittest principle leads to evolution in species. The
objective of the Genetic Algorithms (GA) is to find an optimal
solution to a problem .Since GA-s are heuristic procedures that can
function as optimizers, they are not guaranteed to find the optimum,
but are able to find acceptable solutions for a wide range of
problems. This survey paper aims at a study on Efficient Algorithms
for VLSI Physical design and observes the common traits of the
superior contributions.
Abstract: Present wireless communication demands compact and intelligent devices with multitasking capabilities at affordable cost. The focus in the presented paper is on a dual band antenna for wireless communication with the capability of operating at two frequency bands with same structure. Two resonance frequencies are observed with the second operation band at 4.2GHz approximately three times the first resonance frequency at 1.5GHz. Structure is simple loop of microstrip line with characteristic impedance 50 ohms. The proposed antenna is designed using defective ground structure (DGS) and shows the nearly one third reductions in size as compared to without DGS. This antenna was simulated on electromagnetic (EM) simulation software and fabricated using microwave integrated circuit technique on RT-Duroid dielectric substrate (εr= 2.22) of thickness (H=15 mils). The designed antenna was tested on automatic network analyzer and shows the good agreement with simulated results. The proposed structure is modeled into an equivalent electrical circuit and simulated on circuit simulator. Subsequently, theoretical analysis was carried out and simulated. The simulated, measured, equivalent circuit response, and theoretical results shows good resemblance. The bands of operation draw many potential applications in today’s wireless communication.
Abstract: This article presents a current-mode universal biquadratic filter. The proposed circuit can apparently provide standard functions of the biquad filter: low-pass, high-pass, bandpass, band-reject and all-pass functions. The circuit uses 4 current controlled transconductance amplifiers (CCTAs) and 2 grounded capacitors. In addition, the pole frequency and quality factor can be adjusted by electronic method by adjusting the bias currents of the CCTA. The proposed circuit uses only grounded capacitors without additional external resistors, the proposed circuit is considerably appropriate to further developing into an integrated circuit. The results of PSPICE simulation program are corresponding to the theoretical analysis.
Abstract: In recent years Operational Transconductance Amplifier based high frequency integrated circuits, filters and systems have been widely investigated. The usefulness of OTAs over conventional OP-Amps in the design of both first order and second order active filters are well documented. This paper discusses some of the tunability issues using the Matlab/Simulink® software which are previously unreported for any commercial OTA. Using the simulation results two first order voltage controlled all pass filters with phase tuning capability are proposed.
Abstract: Electronics Products that achieve high levels of integrated communications, computing and entertainment, multimedia features in small, stylish and robust new form factors are winning in the market place. Due to the high costs that an industry may undergo and how a high yield is directly proportional to high profits, IC (Integrated Circuit) manufacturers struggle to maximize yield, but today-s customers demand miniaturization, low costs, high performance and excellent reliability making the yield maximization a never ending research of an enhanced assembly process. With factors such as minimum tolerances, tighter parameter variations a systematic approach is needed in order to predict the assembly process. In order to evaluate the quality of upcoming circuits, yield models are used which not only predict manufacturing costs but also provide vital information in order to ease the process of correction when the yields fall below expectations. For an IC manufacturer to obtain higher assembly yields all factors such as boards, placement, components, the material from which the components are made of and processes must be taken into consideration. Effective placement yield depends heavily on machine accuracy and the vision of the system which needs the ability to recognize the features on the board and component to place the device accurately on the pads and bumps of the PCB. There are currently two methods for accurate positioning, using the edge of the package and using solder ball locations also called footprints. The only assumption that a yield model makes is that all boards and devices are completely functional. This paper will focus on the Monte Carlo method which consists in a class of computational algorithms (information processed algorithms) which depends on repeated random samplings in order to compute the results. This method utilized in order to recreate the simulation of placement and assembly processes within a production line.
Abstract: In CMOS integrated circuit design there is a trade-off between static power consumption and technology scaling. Recently, the power density has increased due to combination of higher clock speeds, greater functional integration, and smaller process geometries. As a result static power consumption is becoming more dominant. This is a challenge for the circuit designers. However, the designers do have a few methods which they can use to reduce this static power consumption. But all of these methods have some drawbacks. In order to achieve lower static power consumption, one has to sacrifice design area and circuit performance. In this paper, we propose a new method to reduce static power in the CMOS VLSI circuit using Variable Body Biasing technique without being penalized in area requirement and circuit performance.
Abstract: In this paper, a novel LVTSCR-based device for
electrostatic discharge (ESD) protection of integrated circuits (ICs) is
designed, fabricated and characterized. The proposed device is similar
to the conventional LVTSCR but it has an embedded PMOSFET in the
anode n-well to enhance the turn on speed, the clamping capability and
the robustness. This is possible because the embedded PMOSFET
provides the sub-path of ESD discharge current. The TLP, HBM and
MM testing are carried out to verify the ESD performance of the
proposed devices, which are fabricated in 0.35um
(Bipolar-CMOS-DMOS) BCDMOS process. The device has the
robustness of 70mA/um that is higher about 60mA/um than the
LVTSCR, approximately.
Abstract: Higher-order Statistics (HOS), also known as
cumulants, cross moments and their frequency domain counterparts,
known as poly spectra have emerged as a powerful signal processing
tool for the synthesis and analysis of signals and systems. Algorithms
used for the computation of cross moments are computationally
intensive and require high computational speed for real-time
applications. For efficiency and high speed, it is often advantageous
to realize computation intensive algorithms in hardware. A promising
solution that combines high flexibility together with the speed of a
traditional hardware is Field Programmable Gate Array (FPGA). In
this paper, we present FPGA-based parallel architecture for the
computation of third-order cross moments. The proposed design is
coded in Very High Speed Integrated Circuit (VHSIC) Hardware
Description Language (VHDL) and functionally verified by
implementing it on Xilinx Spartan-3 XC3S2000FG900-4 FPGA.
Implementation results are presented and it shows that the proposed
design can operate at a maximum frequency of 86.618 MHz.
Abstract: A active inductor in CMOS techonology with a supply voltage of 1.8V is presented. The value of the inductance L can be in the range from 0.12nH to 0.25nH in high frequency(HF). The proposed active inductor is designed in TSMC 0.18-um CMOS technology. The power dissipation of this inductor can retain constant at all operating frequency bands and consume around 20mW from 1.8V power supply. Inductors designed by integrated circuit occupy much smaller area, for this reason,attracted researchers attention for more than decade. In this design we used Advanced Designed System (ADS) for simulating cicuit.
Abstract: RF performance of SOI CMOS device has attracted
significant amount of interest recently. In order to improve RF
parameters, Strained Si/Relaxed Si0.8Ge0.2 investigated as a
replacement for Si technology .Enhancement of carrier mobility
associated with strain engineering makes Strained Si a promising
candidate for improving RF performance of CMOS technology.
From the simulation, the cut-off frequency is estimated to be 224
GHZ, whereas in SOI at similar bias is about 188 GHZ. Therefore,
Strained Si exhibits 19% improvement in cut-off frequency over
similar Si counterpart. In this paper, Ion/Ioff ratio is studied as one of
the key parameters in logic and digital application. Strained Si/SiGe
demonstrates better Ion/Ioff characteristic than SOI, in similar channel
length of 100 nm.Another important key analog figures of merit such
as Early Voltage (VEA) ,transconductance vs drain current (gm /Ids)
are studied. They introduce the efficiency of the devices to convert
dc power into ac frequency.
Abstract: with increasing circuits- complexity and demand to
use portable devices, power consumption is one of the most
important parameters these days. Full adders are the basic block of
many circuits. Therefore reducing power consumption in full adders
is very important in low power circuits. One of the most powerconsuming
modules in full adders is XOR/XNOR circuit. This paper
presents two new full adders based on two new logic approaches. The
proposed logic approaches use one XOR or XNOR gate to implement
a full adder cell. Therefore, delay and power will be decreased. Using
two new approaches and two XOR and XNOR gates, two new full
adders have been implemented in this paper. Simulations are carried
out by HSPICE in 0.18μm bulk technology with 1.8V supply voltage.
The results show that the ten-transistors proposed full adder has 12%
less power consumption and is 5% faster in comparison to MB12T
full adder. 9T is more efficient in area and is 24% better than similar
10T full adder in term of power consumption. The main drawback of
the proposed circuits is output threshold loss problem.