Low Jitter ADPLL based Clock Generator for High Speed SoC Applications

An efficient architecture for low jitter All Digital Phase Locked Loop (ADPLL) suitable for high speed SoC applications is presented in this paper. The ADPLL is designed using standard cells and described by Hardware Description Language (HDL). The ADPLL implemented in a 90 nm CMOS process can operate from 10 to 200 MHz and achieve worst case frequency acquisition in 14 reference clock cycles. The simulation result shows that PLL has cycle to cycle jitter of 164 ps and period jitter of 100 ps at 100MHz. Since the digitally controlled oscillator (DCO) can achieve both high resolution and wide frequency range, it can meet the demands of system-level integration. The proposed ADPLL can easily be ported to different processes in a short time. Thus, it can reduce the design time and design complexity of the ADPLL, making it very suitable for System-on-Chip (SoC) applications.

The Effect of the Tool Geometry and Cutting Conditions on the Tool Deflection and Cutting Forces

In this paper by measuring the cutting forces the effect of the tool shape and qualifications (sharp and worn cutting tools of both vee and knife edge profile) and cutting conditions (depth of cut and cutting speed) in the turning operation on the tool deflection and cutting force is investigated. The workpiece material was mild steel and the cutting tool was made of high speed steel. Cutting forces were measured by a dynamometer (type P.E.I. serial No 154). The dynamometer essentially consisted of a cantilever structure which held the cutting tool. Deflection of the cantilever was measured by an L.V.D.T (Mercer 122) deflection indicator. No cutting fluid was used during the turning operations. A modern CNC lathe machine (Okuma LH35-N) was used for the tests. It was noted that worn vee profile tools tended to produce a greater increase in the vertical force component than the axial component, whereas knife tools tended to show a more pronounced increase in the axial component.

Defect Detection of Tiles Using 2D-Wavelet Transform and Statistical Features

In this article, a method has been offered to classify normal and defective tiles using wavelet transform and artificial neural networks. The proposed algorithm calculates max and min medians as well as the standard deviation and average of detail images obtained from wavelet filters, then comes by feature vectors and attempts to classify the given tile using a Perceptron neural network with a single hidden layer. In this study along with the proposal of using median of optimum points as the basic feature and its comparison with the rest of the statistical features in the wavelet field, the relational advantages of Haar wavelet is investigated. This method has been experimented on a number of various tile designs and in average, it has been valid for over 90% of the cases. Amongst the other advantages, high speed and low calculating load are prominent.

Temperature Control of Industrial Water Cooler using Hot-gas Bypass

In this study, we experiment on precise control outlet temperature of water from the water cooler with hot-gas bypass method based on PI control logic for machine tool. Recently, technical trend for machine tools is focused on enhancement of speed and accuracy. High speedy processing causes thermal and structural deformation of objects from the machine tools. Water cooler has to be applied to machine tools to reduce the thermal negative influence with accurate temperature controlling system. The goal of this study is to minimize temperature error in steady state. In addition, control period of an electronic expansion valve were considered to increment of lifetime of the machine tools and quality of product with a water cooler.

Closed form Delay Model for on-Chip VLSIRLCG Interconnects for Ramp Input for Different Damping Conditions

Fast delay estimation methods, as opposed to simulation techniques, are needed for incremental performance driven layout synthesis. On-chip inductive effects are becoming predominant in deep submicron interconnects due to increasing clock speed and circuit complexity. Inductance causes noise in signal waveforms, which can adversely affect the performance of the circuit and signal integrity. Several approaches have been put forward which consider the inductance for on-chip interconnect modelling. But for even much higher frequency, of the order of few GHz, the shunt dielectric lossy component has become comparable to that of other electrical parameters for high speed VLSI design. In order to cope up with this effect, on-chip interconnect has to be modelled as distributed RLCG line. Elmore delay based methods, although efficient, cannot accurately estimate the delay for RLCG interconnect line. In this paper, an accurate analytical delay model has been derived, based on first and second moments of RLCG interconnection lines. The proposed model considers both the effect of inductance and conductance matrices. We have performed the simulation in 0.18μm technology node and an error of as low as less as 5% has been achieved with the proposed model when compared to SPICE. The importance of the conductance matrices in interconnect modelling has also been discussed and it is shown that if G is neglected for interconnect line modelling, then it will result an delay error of as high as 6% when compared to SPICE.