Abstract: Thermal management of electronic components packaged inside an IP65 rated enclosure is of prime importance in industrial applications. Electrical enclosure protects the multiple board configurations such as inverter, power, controller board components, busbars, and various power dissipating components from harsh environments. Industrial environments often experience relatively warm ambient conditions, and the electronic components housed in the enclosure dissipate heat, due to which the enclosures and the components require thermal management as well as reduction of internal ambient temperatures. Design of Experiments based thermal simulation approach with MOSFET arrangement, Heat sink design, Enclosure Volume, Copper and Aluminum Spreader, Power density, and Printed Circuit Board (PCB) type were considered to optimize air temperature inside the IP65 enclosure to ensure conducive operating temperature for controller board and electronic components through the different modes of heat transfer viz. conduction, natural convection and radiation using Ansys ICEPAK. MOSFET’s with the parallel arrangement, IP65 enclosure molded heat sink with rectangular fins on both enclosures, specific enclosure volume to satisfy the power density, Copper spreader to conduct heat to the enclosure, optimized power density value and selecting Aluminum clad PCB which improves the heat transfer were the contributors towards achieving a conducive operating temperature inside the IP-65 rated Motor Inverter enclosure. A reduction of 52 ℃ was achieved in internal ambient temperature inside the IP65 enclosure between baseline and final design parameters, which met the operative temperature requirements of the electronic components inside the IP-65 rated Motor Inverter.
Abstract: Surface Mount Technology (SMT) is widely used in the area of the electronic assembly in which the electronic components are mounted to the surface of the printed circuit board (PCB). Most of the defects in the SMT process are mainly related to the quality of solder paste printing. These defects lead to considerable manufacturing costs in the electronics assembly industry. Therefore, the solder paste inspection (SPI) machine for controlling and monitoring the amount of solder paste printing has become an important part of the production process. So far, the setting of the SPI threshold is based on statistical analysis and experts’ experiences to determine the appropriate threshold settings. Because the production data are not normal distribution and there are various variations in the production processes, defects related to solder paste printing still occur. In order to solve this problem, this paper proposes an online machine learning algorithm, called the automatic threshold adjustment (ATA) algorithm, and closed-loop architecture in the SMT process to determine the best threshold settings. Simulation experiments prove that our proposed threshold settings improve the accuracy from 99.85% to 100%.
Abstract: This paper describes the design and application of a short in-class project conducted in Algoma University’s Human-Computer Interaction (HCI) course taught at the Bachelor of Computer Science. The project was based on the Maker Movement (people using and reusing electronic components and everyday materials to tinker with technology and make interactive applications), where students applied low-cost and easy-to-use electronic components, the Arduino Uno microcontroller board, software tools, and everyday objects. Students collaborated in small teams by completing hands-on activities with them, making an interactive walking cane for blind people. At the end of the course, students filled out a Technology Acceptance Model version 2 (TAM2) questionnaire where they evaluated microcontroller boards’ applications in HCI classes. We also asked them about applying the Maker Movement in HCI classes. Results showed overall students’ positive opinions and response about using microcontroller boards in HCI classes. We strongly suggest that every HCI course should include practical activities related to tinkering with technology such as applying microcontroller boards, where students actively and constructively participate in teams for achieving learning objectives.
Abstract: The ionizing radiations cause different kinds of damages in electronic components. MOSFETs, most common transistors in today’s digital and analog circuits, are severely sensitive to TID damage. In this work, the threshold voltage shift of CD4007 device, which is an integrated circuit including P-channel and N-channel MOS transistors, was investigated for low dose gamma irradiation under different gate bias voltages. We used linear extrapolation method to extract threshold voltage from ID-VG characteristic curve. The results showed that the threshold voltage shift was approximately 27.5 mV/Gy for N-channel and 3.5 mV/Gy for P-channel transistors at the gate bias of |9 V| after irradiation by Co-60 gamma ray source. Although the sensitivity of the devices under test were strongly dependent to biasing condition and transistor type, the threshold voltage shifted linearly versus accumulated dose in all cases. The overall results show that the application of CD4007 as an electronic buffer in a radiation therapy system is limited by TID damage. However, this integrated circuit can be used as a cheap and sensitive radiation dosimeter for accumulated dose measurement in radiation therapy systems.
Abstract: Due to the higher power loss levels in electronic components, the thermal design of PCBs (Printed Circuit Boards) of an assembled device becomes one of the most important quality factors in electronics. Nonetheless, some of leading causes of the microelectronic component failures are due to higher temperatures, the leakages or thermal-mechanical stress, which is a concern, is the reliability of microelectronic packages. This article presents an experimental approach to measure the junction temperature of exposed pad packages. The implemented solution is in a prototype phase, using a temperature-sensitive parameter (TSP) to measure temperature directly on the die, validating the numeric results provided by the Mechanical APDL (Ansys Parametric Design Language) under same conditions. The physical device-under-test is composed by a Thermal Test Chip (TTC-1002) and assembly in a QFN cavity, soldered to a test-board according to JEDEC Standards. Monitoring the voltage drop across a forward-biased diode, is an indirectly method but accurate to obtain the junction temperature of QFN component with an applied power range between 0,3W to 1.5W. The temperature distributions on the PCB test-board and QFN cavity surface were monitored by an infra-red thermal camera (Goby-384) controlled and images processed by the Xeneth software. The article provides a set-up to monitorize in real-time the junction temperature of ICs, namely devices with the exposed pad package (i.e. QFN). Presenting the PCB layout parameters that the designer should use to improve thermal performance, and evaluate the impact of voids in solder interface in the device junction temperature.
Abstract: The power electronic components within Electric Vehicles (EV) need to operate in several important modes. Some modes directly influence safety, while others influence vehicle performance. Given the variety of functions and operational modes required of the power electronics, it needs to meet efficiency requirements to minimize power losses. Another challenge in the control and construction of such systems is the ability to support bidirectional power flow. This paper considers the construction, operation, and feasibility of available converters for electric vehicles with feasible configurations of electrical buses and loads. This paper describes logic and control signals for the converters for different operations conditions based on the efficiency and energy usage bases.
Abstract: The nickel-manganese (Ni-Mn) alloy coating prepared
from DC electrodeposition process in sulphamate bath was studied.
The effects of process parameters, such as current density and
electrolyte composition, on the cathodic current efficiency,
microstructure, internal stress and mechanical properties were
investigated. Because of its crucial effect on the application to the
electroforming of microelectronic components, the development of
low internal stress coating with high leveling power was emphasized.
It was found that both the coating’s manganese content and the
cathodic current efficiency increased with the raise in current density.
In addition, the internal stress of the deposited coating showed
compressive nature at low current densities while changed to tensile
one at higher current densities. Moreover, the metallographic
observation, X-ray diffraction measurement, and polarization curve
measurement were conducted. It was found that the Ni-Mn coating
consisted of nano-sized columnar grains and the maximum hardness of
the coating was associated with (111) preferred orientation in the
microstructure. The grain size was refined along with the increase in
the manganese content of the coating, which accordingly, raised its
hardness and resistance to annealing softening. In summary, the
Ni-Mn coating prepared at lower current density of 1-2 A/dm2 had low
internal stress, high leveling power, and better corrosion resistance.
Abstract: This paper deals with the theoretical and numerical
investigation of magneto hydrodynamic boundary layer flow of a
nanofluid past a wedge shaped wick in heat pipe used for the cooling
of electronic components and different type of machines. To
incorporate the effect of nanoparticle diameter, concentration of
nanoparticles in the pure fluid, nanothermal layer formed around the
nanoparticle and Brownian motion of nanoparticles etc., appropriate
models are used for the effective thermal and physical properties of
nanofluids. To model the rotation of nanoparticles inside the base
fluid, microfluidics theory is used. In this investigation ethylene
glycol (EG) based nanofluids, are taken into account. The non-linear
equations governing the flow and heat transfer are solved by using a
very effective particle swarm optimization technique along with
Runge-Kutta method. The values of heat transfer coefficient are
found for different parameters involved in the formulation viz.
nanoparticle concentration, nanoparticle size, magnetic field and
wedge angle etc. It is found that, the wedge angle, presence of
magnetic field, nanoparticle size and nanoparticle concentration etc.
have prominent effects on fluid flow and heat transfer characteristics
for the considered configuration.
Abstract: The work presented in this paper was performed for a workstation of an assembly section in a company that manufactures radio modules and air conditioning for cars. After performing a workstation analysis and a questionnaire to the operators it was possible to understand the need to investigate the risk of musculoskeletal disorders originated from both the handling of loads as the incorrect dimensioning of the workstation. Regarding the handling of loads the NIOSH Equation was used and it was verified that there was no risk of musculoskeletal disorders. As the operators expressed their lack of satisfaction regarding back pains due to posture adopted they were established the appropriate dimensions (to satisfy 97.5% of the population and using the table of anthropometric data of the Portuguese population) for the workstation and it was proposed the availability of a chair for the workers.
Abstract: In this work, we made anumerical study of the thermal and dynamic behavior of air in a horizontal channel with electronic components.The influenceto use baffles on the profiles of velocity and temperature is discussed.The finite volume method and the algorithm Simple are used for solving the equations of conservation of mass, momentum and energy.The results found show that baffles improve heat transfer between the cooling air and electronic components. The velocity will increase from 3 times per rapport of the initial velocity.
Abstract: Electrical units are operated by electrical and electronic components. An environmental test sequence is useful for testing electrical units to reduce reliability issues. This study introduces test sequence guidelines based on relevant principles and considerations for electronic testing according to International Standard IEC-60068-1 and the United States Military Standard MIL-STD-810G. Test sequences were then proposed based on the descriptions for each test. Finally, General Motors (GM) specification GMW3172 was interpreted and compared to IEC-60068-1 and MIL-STD-810G.
Abstract: In this study three commercial semiconductor devices
were characterized in the laboratory for computed tomography
dosimetry: one photodiode and two phototransistors. It was evaluated
four responses to the irradiation: dose linearity, energy dependence,
angular dependence and loss of sensitivity after X ray exposure. The
results showed that the three devices have proportional response with
the air kerma; the energy dependence displayed for each device
suggests that some calibration factors would be applied for each one;
the angular dependence showed a similar pattern among the three
electronic components. In respect to the fourth parameter analyzed,
one phototransistor has the highest sensitivity however it also showed
the greatest loss of sensitivity with the accumulated dose. The
photodiode was the device with the smaller sensitivity to radiation,
on the other hand, the loss of sensitivity after irradiation is negligible.
Since high accuracy is a desired feature for a dosimeter, the
photodiode can be the most suitable of the three devices for
dosimetry in tomography. The phototransistors can also be used for
CT dosimetry, however it would be necessary a correction factor due
to loss of sensitivity with accumulated dose.
Abstract: Modern highly automated production systems faces
problems of reliability. Machine function reliability results in
changes of productivity rate and efficiency use of expensive
industrial facilities. Predicting of reliability has become an important
research and involves complex mathematical methods and
calculation. The reliability of high productivity technological
automatic machines that consists of complex mechanical, electrical
and electronic components is important. The failure of these units
results in major economic losses of production systems. The
reliability of transport and feeding systems for automatic
technological machines is also important, because failure of transport
leads to stops of technological machines. This paper presents
reliability engineering on the feeding system and its components for
transporting a complex shape parts to automatic machines. It also
discusses about the calculation of the reliability parameters of the
feeding unit by applying the probability theory. Equations produced
for calculating the limits of the geometrical sizes of feeders and the
probability of sticking the transported parts into the chute represents
the reliability of feeders as a function of its geometrical parameters.
Abstract: This paper presents design and characterization of a
microaccelerometer designated for integration into cataract surgical
probe to detect hardness of different eye tissues during cataract
surgery. Soft posterior lens capsule of eye can be easily damaged in
comparison with hard opaque lens since the surgeon can not see
directly behind cutting needle during the surgery. Presence of
microsensor helps the surgeon to avoid rupturing posterior lens
capsule which if occurs leads to severe complications such as
glaucoma, infection, or even blindness. The microsensor having
overall dimensions of 480 μm x 395 μm is able to deliver significant
capacitance variations during encountered vibration situations which
makes it capable to distinguish between different types of tissue.
Integration of electronic components on chip ensures high level of
reliability and noise immunity while minimizes space and power
requirements. Physical characteristics and results on performance
testing, proves integration of microsensor as an effective tool to aid
the surgeon during this procedure.
Abstract: An experimental study is realized in order to verify the
Mini Heat Pipe (MHP) concept for cooling high power dissipation
electronic components and determines the potential advantages of
constructing mini channels as an integrated part of a flat heat pipe. A
Flat Mini Heat Pipe (FMHP) prototype including a capillary structure
composed of parallel rectangular microchannels is manufactured and
a filling apparatus is developed in order to charge the FMHP. The
heat transfer improvement obtained by comparing the heat pipe
thermal resistance to the heat conduction thermal resistance of a
copper plate having the same dimensions as the tested FMHP is
demonstrated for different heat input flux rates. Moreover, the heat
transfer in the evaporator and condenser sections are analyzed, and
heat transfer laws are proposed. In the theoretical part of this work, a
detailed mathematical model of a FMHP with axial microchannels is
developed in which the fluid flow is considered along with the heat
and mass transfer processes during evaporation and condensation.
The model is based on the equations for the mass, momentum and
energy conservation, which are written for the evaporator, adiabatic,
and condenser zones. The model, which permits to simulate several
shapes of microchannels, can predict the maximum heat transfer
capacity of FMHP, the optimal fluid mass, and the flow and thermal
parameters along the FMHP. The comparison between experimental
and model results shows the good ability of the numerical model to
predict the axial temperature distribution along the FMHP.
Abstract: Abrasive Jet Machining is an Unconventional
machining process in which the metal is removed from brittle and
hard material in the form of micro-chips. With increase in need of
materials like ceramics, composites, in manufacturing of various
Mechanical & Electronic components, AJM has become a useful
technique for micro machining. The present study highlights the
influence of different parameters like Pressure, SOD, Time, Abrasive
grain size, nozzle diameter on the Metal removal of FRP (Fiber
Reinforced Polymer) composite by Abrasive jet machining. The
results of the Experiments conducted were analyzed and optimized
with TAGUCHI method of Optimization and ANOVA for Optimal
Value.
Abstract: A numerical study is presented on convective heat transfer in enclosures. The results are addressed to automotive headlights containing new-age light sources like Light Emitting Diodes (LED). The heat transfer from the heat source (LED) to the enclosure walls is investigated for mixed convection as interaction of the forced convection flow from an inlet and an outlet port and the natural convection at the heat source. Unlike existing studies, inlet and outlet port are thermally coupled and do not serve to remove hot fluid. The input power of the heat source is expressed by the Rayleigh number. The internal position of the heat source, the aspect ratio of the enclosure, and the inclination angle of one wall are varied. The results are given in terms of the global Nusselt number and the enclosure Nusselt number that characterize the heat transfer from the source and from the interior fluid to the enclosure walls, respectively. It is found that the heat transfer from the source to the fluid can be maximized if the source is placed in the main stream from the inlet to the outlet port. In this case, the Reynolds number and heat source position have the major impact on the heat transfer. A disadvantageous position has been found where natural and forced convection compete each other. The overall heat transfer from the source to the wall increases with increasing Reynolds number as well as with increasing aspect ratio and decreasing inclination angle. The heat transfer from the interior fluid to the enclosure wall increases upon decreasing the aspect ratio and increasing the inclination angle. This counteracting behaviour is caused by the variation of the area of the enclosure wall. All mixed convection results are compared to the natural convection limit.