Effect of Baffles on the Cooling of Electronic Components

In this work, we made anumerical study of the thermal and dynamic behavior of air in a horizontal channel with electronic components.The influenceto use baffles on the profiles of velocity and temperature is discussed.The finite volume method and the algorithm Simple are used for solving the equations of conservation of mass, momentum and energy.The results found show that baffles improve heat transfer between the cooling air and electronic components. The velocity will increase from 3 times per rapport of the initial velocity.

• O. Bendermel
• C. Seladji
• M. Khaouani

• Electronic components
• baffles
• cooling.

[1] A. Hamouche, R. Benssaih, "Mixed convection air cooling of protruding heat sources mounted in a horizontal channel”, International Communication in Heat and Mass Transfer.36, 841-849 (2009).
[2] Y.P. Cheng, T.S. Lee, H.T. Low, " Numerical simulation of conjugate heat transfer in electronic cooling and analysis based on field synergy principle”, Applied Thermal Engineering.28, 1826-1833 (2008).
[3] S.M. Kim, I. Mudawar, "Analytical heat diffusion models for different micro-channel heat sink cross-sectional geometries”, International Journal of Heat and Mass Transfer .53, 4002–4016 (2010).
[4] M.R. Sohel, R. Saidur, MohdFaizulMohdSabri, M. Kamalisarvestani,M.M. Elias, A. Ijam,” Investigating the heat transfer performance andthermophysical properties of nanofluids in a circular micro-channel”,International Communications in Heat and Mass Transfer .42, 75–81 (2013).
[5] M. Liu, D. Liu, S. Xu, Y. Chen, "Experimental study on liquid flow andheat transfer in micro square pin fin heat sink”, International Journal of Heat and Mass Transfer.54, 5602–5611 (2011).
[6] G. Xia, Y. Zhai, Z. Cui, "Numerical investigation of thermal enhancement in a micro heat sink with fan-shaped reentrant cavities and internal ribs”,Applied Thermal Engineering.58, 52-60 (2013).
[7] T.C. Hung, W.M. Yan, W.P. Lee, "Analysis of heat transfercharacteristics of double-layered microchannel heat sink”, International Journal of Heat and Mass Transfer.55, 3090–3099 (2012).