Abstract: This paper presents the comparison ageing deterioration of silicone rubber housing material for outdoor polymer insulators by using salt fog ageing test based on IEC 61109 and outdoor exposure test.Four types of high temperature silicone vulcanized silicone rubber sheet with different amount of ATH were used as testing specimen. For salt fog ageing test, the specimens were tested continuously 1000 hours with energized in test chamber. For outdoor exposure test, the specimens were hung continuously 18 months without energized. Physical and chemical analyses were conducted to evaluate degree of ageing deterioration of tested specimens. Slightly surface erosion was observed on specimen surface after salt fog ageing test and no erosion was observed on surface of outdoor exposure specimen. However, comparable degree of ageing deterioration can be seen from surface analysis results.
Abstract: In turning hardened steel, polycrystalline cubic boron
nitride (cBN) compacts are widely used, due to their higher hardness
and higher thermal conductivity. However, in milling hardened steel,
fracture of cBN cutting tools readily occurs because they have poor
fracture toughness. Therefore, coated cemented carbide tools, which
have good fracture toughness and wear resistance, are generally
widely used. In this study, hardened steel (ASTM D2, JIS SKD11,
60HRC) was milled with three physical vapor deposition
(PVD)-coated cemented carbide end mill cutters in order to determine
effective tool materials for cutting hardened steel at high cutting
speeds. The coating films used were (Ti,W)N/(Ti,W,Si)N and
(Ti,W)N/(Ti,W,Si,Al)N coating films. (Ti,W,Si,Al)N is a new type of
coating film. The inner layer of the (Ti,W)N/(Ti,W,Si)N and
(Ti,W)N/(Ti,W,Si,Al)N coating system is (Ti,W)N coating film, and
the outer layer is (Ti,W,Si)N and (Ti,W,Si,Al)N coating films,
respectively. Furthermore, commercial (Ti,Al)N-based coating film
was also used. The following results were obtained: (1) In milling
hardened steel at a cutting speed of 3.33 m/s, the tool wear width of the
(Ti,W)N/(Ti,W,Si,Al)N-coated tool was smaller than that of the
(Ti,W)N/(Ti,W,Si)N-coated tool. And, compared with the commercial
(Ti,Al)N, the tool wear width of the (Ti,W)N/(Ti,W,Si,Al)N-coated
tool was smaller than that of the (Ti,Al)N-coated tool. (2) The tool
wear of the (Ti,W)N/(Ti,W,Si,Al)N-coated tool increased with an
increase in cutting speed. (3) The (Ti,W)N/(Ti,W,Si,Al)N-coated
cemented carbide was an effective tool material for high-speed cutting
below a cutting speed of 3.33 m/s.
Abstract: Average current analysis checking the impact of
current flow is very important to guarantee the reliability of
semiconductor systems. As semiconductor process technologies
improve, the coupling capacitance often become bigger than self
capacitances. In this paper, we propose an analytic technique for
analyzing average current on interconnects in multi-conductor
structures. The proposed technique has shown to yield the acceptable
errors compared to HSPICE results while providing computational
efficiency.
Abstract: In this paper electrical characteristics of various kinds
of multiple-gate silicon nanowire transistors (SNWT) with the
channel length equal to 7 nm are compared. A fully ballistic quantum
mechanical transport approach based on NEGF was employed to
analyses electrical characteristics of rectangular and cylindrical
silicon nanowire transistors as well as a Double gate MOS FET. A
double gate, triple gate, and gate all around nano wires were studied
to investigate the impact of increasing the number of gates on the
control of the short channel effect which is important in nanoscale
devices. Also in the case of triple gate rectangular SNWT inserting
extra gates on the bottom of device can improve the application of
device. The results indicate that by using gate all around structures
short channel effects such as DIBL, subthreshold swing and delay
reduces.
Abstract: C-control chart assumes that process nonconformities follow a Poisson distribution. In actuality, however, this Poisson distribution does not always occur. A process control for semiconductor based on a Poisson distribution always underestimates the true average amount of nonconformities and the process variance. Quality is described more accurately if a compound Poisson process is used for process control at this time. A cumulative sum (CUSUM) control chart is much better than a C control chart when a small shift will be detected. This study calculates one-sided CUSUM ARLs using a Markov chain approach to construct a CUSUM control chart with an underlying Poisson-Gamma compound distribution for the failure mechanism. Moreover, an actual data set from a wafer plant is used to demonstrate the operation of the proposed model. The results show that a CUSUM control chart realizes significantly better performance than EWMA.
Abstract: Recently, the advanced technologies that offer high
precision product, relative easy, economical process and also rapid
production are needed to realize the high demand of ultra precision
micro part. In our research, micromanufacturing based on soft
lithography and nanopowder injection molding was investigated. The
silicone metal pattern with ultra thick and high aspect ratio succeeds to
fabricate Polydimethylsiloxane (PDMS) micro mold. The process
followed by nanopowder injection molding (PIM) by a simple vacuum
hot press. The 17-4ph nanopowder with diameter of 100 nm, succeed
to be injected and it forms green sample microbearing with thickness,
microchannel and aspect ratio is 700μm, 60μm and 12, respectively.
Sintering process was done in 1200 C for 2 hours and heating rate
0.83oC/min. Since low powder load (45% PL) was applied to achieve
green sample fabrication, ~15% shrinkage happen in the 86% relative
density. Several improvements should be done to produce high
accuracy and full density sintered part.
Abstract: We demonstrate a 1×4 coarse wavelength
division-multiplexing (CWDM) planar concave grating
multiplexer/demultiplexer and its application in re-configurable
optical add/drop multiplexer (ROADM) system in silicon-on-insulator
substrate. The wavelengths of the demonstrated concave grating
multiplexer align well with the ITU-T standard. We demonstrate a
prototype of ROADM comprising two such concave gratings and four
wide-band thermo-optical MZI switches. Undercut technology which
removes the underneath silicon substrate is adopted in optical switches
in order to minimize the operation power. For all the thermal heaters,
the operation voltage is smaller than 1.5 V, and the switch power is
~2.4 mW. High throughput pseudorandom binary sequence (PRBS)
data transmission with up to 100 Gb/s is demonstrated, showing the
high-performance ROADM functionality.
Abstract: In the first part of the research work, an electrolyzer (10.16 cm dia and 24.13 cm height) to produce hydrogen and oxygen was constructed for single slice O2/H2 fuel cell using cation exchange membrane. The electrolyzer performance was tested with 23% NaOH, 30% NaOH, 30% KOH and 35% KOH electrolyte solution with current input 4 amp and 2.84 V from the rectifier. Rates of volume of hydrogen produced were 0.159 cm3/sec, 0.155 cm3/sec, 0.169 cm3/sec and 0.163 cm3/sec respectively from 23% NaOH, 30% NaOH, 30% KOH and 35% KOH solution. Rates of volume of oxygen produced were 0.212 cm3/sec, 0.201 cm3/sec, 0.227 cm3/sec and 0.219 cm3/sec respectively from 23% NaOH, 30% NaOH, 30% KOH and 35% KOH solution (1.5 L). In spite of being tested the increased concentration of electrolyte solution, the gas rate does not change significantly. Therefore, inexpensive 23% NaOH electrolyte solution was chosen to use as the electrolyte in the electrolyzer. In the second part of the research work, graphite serpentine flow plates, fiberglass end plates, stainless steel screen electrodes, silicone rubbers were made to assemble the single slice O2/H2 polymer electrolyte membrane fuel cell (PEMFC).
Abstract: This paper presents Cost per Equivalent Wafer Out, which we find useful in wafer fab operational cost monitoring and controlling. It removes the loading and product mix effect in the cost variance analysis. The operation heads, therefore, could immediately focus on identifying areas for cost improvement. Without this, they would have to measure the impact of the loading variance and product mix variance between actual and budgeted prior to make any decision on cost improvement. Cost per Equivalent Wafer Out, thereby, increases efficiency in wafer fab operational cost monitoring and controlling.