Abstract: The yield management system is very important to produce high-quality semiconductor chips in the semiconductor manufacturing process. In order to improve quality of semiconductors, various tests are conducted in the post fabrication (FAB) process. During the test process, large amount of data are collected and the data includes a lot of information about defect. In general, the defect on the wafer is the main causes of yield loss. Therefore, analyzing the defect data is necessary to improve performance of yield prediction. The wafer bin map (WBM) is one of the data collected in the test process and includes defect information such as the fail bit patterns. The fail bit has characteristics of spatial point patterns. Therefore, this paper proposes the feature extraction method using the spatial point pattern analysis. Actual data obtained from the semiconductor process is used for experiments and the experimental result shows that the proposed method is more accurately recognize the fail bit patterns.
Abstract: Depending on the big data analysis becomes important, yield prediction using data from the semiconductor process is essential. In general, yield prediction and analysis of the causes of the failure are closely related. The purpose of this study is to analyze pattern affects the final test results using a die map based clustering. Many researches have been conducted using die data from the semiconductor test process. However, analysis has limitation as the test data is less directly related to the final test results. Therefore, this study proposes a framework for analysis through clustering using more detailed data than existing die data. This study consists of three phases. In the first phase, die map is created through fail bit data in each sub-area of die. In the second phase, clustering using map data is performed. And the third stage is to find patterns that affect final test result. Finally, the proposed three steps are applied to actual industrial data and experimental results showed the potential field application.
Abstract: In manufacturing industries, development of measurement leads to increase the number of monitoring variables and eventually the importance of multivariate control comes to the fore. Statistical process control (SPC) is one of the most widely used as multivariate control chart. Nevertheless, SPC is restricted to apply in processes because its assumption of data as following specific distribution. Unfortunately, process data are composed by the mixture of several processes and it is hard to estimate as one certain distribution. To alternative conventional SPC, therefore, nonparametric control chart come into the picture because of the strength of nonparametric control chart, the absence of parameter estimation. SVDD based control chart is one of the nonparametric control charts having the advantage of flexible control boundary. However,basic concept of SVDD has been an oversight to the important of data characteristic, density distribution. Therefore, we proposed DW-SVDD (Density Weighted SVDD) to cover up the weakness of conventional SVDD. DW-SVDD makes a new attempt to consider dense of data as introducing the notion of density Weight. We extend as control chart using new proposed SVDD and a simulation study of various distributional data is conducted to demonstrate the improvement of performance.
Abstract: It is important to predict yield in semiconductor test process in order to increase yield. In this study, yield prediction means finding out defective die, wafer or lot effectively. Semiconductor test process consists of some test steps and each test includes various test items. In other world, test data has a big and complicated characteristic. It also is disproportionably distributed as the number of data belonging to FAIL class is extremely low. For yield prediction, general data mining techniques have a limitation without any data preprocessing due to eigen properties of test data. Therefore, this study proposes an under-sampling method using support vector machine (SVM) to eliminate an imbalanced characteristic. For evaluating a performance, randomly under-sampling method is compared with the proposed method using actual semiconductor test data. As a result, sampling method using SVM is effective in generating robust model for yield prediction.
Abstract: In the semiconductor manufacturing process, large
amounts of data are collected from various sensors of multiple
facilities. The collected data from sensors have several different characteristics
due to variables such as types of products, former processes
and recipes. In general, Statistical Quality Control (SQC) methods
assume the normality of the data to detect out-of-control states of
processes. Although the collected data have different characteristics,
using the data as inputs of SQC will increase variations of data,
require wide control limits, and decrease performance to detect outof-
control. Therefore, it is necessary to separate similar data groups
from mixed data for more accurate process control. In the paper,
we propose a regression tree using split algorithm based on Pearson
distribution to handle non-normal distribution in parametric method.
The regression tree finds similar properties of data from different
variables. The experiments using real semiconductor manufacturing
process data show improved performance in fault detecting ability.
Abstract: Control chart pattern recognition is one of the most important tools to identify the process state in statistical process control. The abnormal process state could be classified by the recognition of unnatural patterns that arise from assignable causes. In this study, a wavelet based neural network approach is proposed for the recognition of control chart patterns that have various characteristics. The procedure of proposed control chart pattern recognizer comprises three stages. First, multi-resolution wavelet analysis is used to generate time-shape and time-frequency coefficients that have detail information about the patterns. Second, distance based features are extracted by a bi-directional Kohonen network to make reduced and robust information. Third, a back-propagation network classifier is trained by these features. The accuracy of the proposed method is shown by the performance evaluation with numerical results.