Abstract: It is important to predict yield in semiconductor test process in order to increase yield. In this study, yield prediction means finding out defective die, wafer or lot effectively. Semiconductor test process consists of some test steps and each test includes various test items. In other world, test data has a big and complicated characteristic. It also is disproportionably distributed as the number of data belonging to FAIL class is extremely low. For yield prediction, general data mining techniques have a limitation without any data preprocessing due to eigen properties of test data. Therefore, this study proposes an under-sampling method using support vector machine (SVM) to eliminate an imbalanced characteristic. For evaluating a performance, randomly under-sampling method is compared with the proposed method using actual semiconductor test data. As a result, sampling method using SVM is effective in generating robust model for yield prediction.
Abstract: In the semiconductor manufacturing process, large
amounts of data are collected from various sensors of multiple
facilities. The collected data from sensors have several different characteristics
due to variables such as types of products, former processes
and recipes. In general, Statistical Quality Control (SQC) methods
assume the normality of the data to detect out-of-control states of
processes. Although the collected data have different characteristics,
using the data as inputs of SQC will increase variations of data,
require wide control limits, and decrease performance to detect outof-
control. Therefore, it is necessary to separate similar data groups
from mixed data for more accurate process control. In the paper,
we propose a regression tree using split algorithm based on Pearson
distribution to handle non-normal distribution in parametric method.
The regression tree finds similar properties of data from different
variables. The experiments using real semiconductor manufacturing
process data show improved performance in fault detecting ability.
Abstract: Control chart pattern recognition is one of the most important tools to identify the process state in statistical process control. The abnormal process state could be classified by the recognition of unnatural patterns that arise from assignable causes. In this study, a wavelet based neural network approach is proposed for the recognition of control chart patterns that have various characteristics. The procedure of proposed control chart pattern recognizer comprises three stages. First, multi-resolution wavelet analysis is used to generate time-shape and time-frequency coefficients that have detail information about the patterns. Second, distance based features are extracted by a bi-directional Kohonen network to make reduced and robust information. Third, a back-propagation network classifier is trained by these features. The accuracy of the proposed method is shown by the performance evaluation with numerical results.