Abstract: The yield management system is very important to produce high-quality semiconductor chips in the semiconductor manufacturing process. In order to improve quality of semiconductors, various tests are conducted in the post fabrication (FAB) process. During the test process, large amount of data are collected and the data includes a lot of information about defect. In general, the defect on the wafer is the main causes of yield loss. Therefore, analyzing the defect data is necessary to improve performance of yield prediction. The wafer bin map (WBM) is one of the data collected in the test process and includes defect information such as the fail bit patterns. The fail bit has characteristics of spatial point patterns. Therefore, this paper proposes the feature extraction method using the spatial point pattern analysis. Actual data obtained from the semiconductor process is used for experiments and the experimental result shows that the proposed method is more accurately recognize the fail bit patterns.
Abstract: In the semiconductor manufacturing process, large
amounts of data are collected from various sensors of multiple
facilities. The collected data from sensors have several different characteristics
due to variables such as types of products, former processes
and recipes. In general, Statistical Quality Control (SQC) methods
assume the normality of the data to detect out-of-control states of
processes. Although the collected data have different characteristics,
using the data as inputs of SQC will increase variations of data,
require wide control limits, and decrease performance to detect outof-
control. Therefore, it is necessary to separate similar data groups
from mixed data for more accurate process control. In the paper,
we propose a regression tree using split algorithm based on Pearson
distribution to handle non-normal distribution in parametric method.
The regression tree finds similar properties of data from different
variables. The experiments using real semiconductor manufacturing
process data show improved performance in fault detecting ability.
Abstract: Control chart pattern recognition is one of the most important tools to identify the process state in statistical process control. The abnormal process state could be classified by the recognition of unnatural patterns that arise from assignable causes. In this study, a wavelet based neural network approach is proposed for the recognition of control chart patterns that have various characteristics. The procedure of proposed control chart pattern recognizer comprises three stages. First, multi-resolution wavelet analysis is used to generate time-shape and time-frequency coefficients that have detail information about the patterns. Second, distance based features are extracted by a bi-directional Kohonen network to make reduced and robust information. Third, a back-propagation network classifier is trained by these features. The accuracy of the proposed method is shown by the performance evaluation with numerical results.