Development of a Real Time Axial Force Measurement System and IoT-Based Monitoring for Smart Bearing

The purpose of this research is to develop a real time axial force measurement system for a smart bearing through the use of strain-gauges, whereby the data acquisition is performed by an Arduino microcontroller due to its easy manipulation and low-cost. The measured signal is acquired and then discretized using a Wheatstone Bridge and an Analog-Digital Converter (ADC) respectively. For bearing monitoring, a real time monitoring system based on Internet of things (IoT) and Bluetooth were developed. Experimental tests were performed on a bearing within a force range up to 600 kN. The experimental results show that there is a proportional linear relationship between the applied force and the output voltage, and the error R squared is within 0.9878 based on the regression analysis.

Fully Printed Strain Gauges: A Comparison of Aerosoljet-Printing and Micropipette-Dispensing

Strain sensors based on a change in resistance are well established for the measurement of forces, stresses, or material fatigue. Within the scope of this paper, fully additive manufactured strain sensors were produced using an ink of silver nanoparticles. Their behavior was evaluated by periodic tensile tests. Printed strain sensors exhibit two advantages: Their measuring grid is adaptable to the use case and they do not need a carrier-foil, as the measuring structure can be printed directly onto a thin sprayed varnish layer on the aluminum specimen. In order to compare quality characteristics, the sensors have been manufactured using two different technologies, namely aerosoljet-printing and micropipette-dispensing. Both processes produce structures which exhibit continuous features (in contrast to what can be achieved with droplets during inkjet printing). Briefly summarized the results show that aerosoljet-printing is the preferable technology for specimen with non-planar surfaces whereas both technologies are suitable for flat specimen.

Design and Development of a Mechanical Force Gauge for the Square Watermelon Mold

This study aimed at designing and developing a mechanical force gauge for the square watermelon mold for the first time. It also tried to introduce the square watermelon characteristics and its production limitations. The mechanical force gauge performance and the product itself were also described. There are three main designable gauge models: a. hydraulic gauge, b. strain gauge, and c. mechanical gauge. The advantage of the hydraulic model is that it instantly displays the pressure and thus the force exerted by the melon. However, considering the inability to measure forces at all directions, complicated development, high cost, possible hydraulic fluid leak into the fruit chamber and the possible influence of increased ambient temperature on the fluid pressure, the development of this gauge was overruled. The second choice was to calculate pressure using the direct force a strain gauge. The main advantage of these strain gauges over spring types is their high precision in measurements; but with regard to the lack of conformity of strain gauge working range with water melon growth, calculations were faced with problems. Finally the mechanical pressure gauge has advantages, including the ability to measured forces and pressures on the mold surface during melon growth; the ability to display the peak forces; the ability to produce melon growth graph thanks to its continuous force measurements; the conformity of its manufacturing materials with the required physical conditions of melon growth; high air conditioning capability; the ability to permit sunlight reaches the melon rind (no yellowish skin and quality loss); fast and straightforward calibration; no damages to the product during assembling and disassembling; visual check capability of the product within the mold; applicable to all growth environments (field, greenhouses, etc.); simple process; low costs and so forth.

Instrumentation for Studying Real-time Popcorn Effect in Surface Mount Packages during Solder Reflow

Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.