Abstract: The purpose of this research is to develop a real time axial force measurement system for a smart bearing through the use of strain-gauges, whereby the data acquisition is performed by an Arduino microcontroller due to its easy manipulation and low-cost. The measured signal is acquired and then discretized using a Wheatstone Bridge and an Analog-Digital Converter (ADC) respectively. For bearing monitoring, a real time monitoring system based on Internet of things (IoT) and Bluetooth were developed. Experimental tests were performed on a bearing within a force range up to 600 kN. The experimental results show that there is a proportional linear relationship between the applied force and the output voltage, and the error R squared is within 0.9878 based on the regression analysis.
Abstract: Strain sensors based on a change in resistance are
well established for the measurement of forces, stresses, or material
fatigue. Within the scope of this paper, fully additive manufactured
strain sensors were produced using an ink of silver nanoparticles.
Their behavior was evaluated by periodic tensile tests. Printed
strain sensors exhibit two advantages: Their measuring grid is
adaptable to the use case and they do not need a carrier-foil,
as the measuring structure can be printed directly onto a thin
sprayed varnish layer on the aluminum specimen. In order to
compare quality characteristics, the sensors have been manufactured
using two different technologies, namely aerosoljet-printing and
micropipette-dispensing. Both processes produce structures which
exhibit continuous features (in contrast to what can be achieved with
droplets during inkjet printing). Briefly summarized the results show
that aerosoljet-printing is the preferable technology for specimen with
non-planar surfaces whereas both technologies are suitable for flat
specimen.
Abstract: This study aimed at designing and developing a
mechanical force gauge for the square watermelon mold for the first
time. It also tried to introduce the square watermelon characteristics
and its production limitations. The mechanical force gauge
performance and the product itself were also described. There are
three main designable gauge models: a. hydraulic gauge, b. strain
gauge, and c. mechanical gauge. The advantage of the hydraulic
model is that it instantly displays the pressure and thus the force
exerted by the melon. However, considering the inability to measure
forces at all directions, complicated development, high cost, possible
hydraulic fluid leak into the fruit chamber and the possible influence
of increased ambient temperature on the fluid pressure, the
development of this gauge was overruled. The second choice was to
calculate pressure using the direct force a strain gauge. The main
advantage of these strain gauges over spring types is their high
precision in measurements; but with regard to the lack of conformity
of strain gauge working range with water melon growth, calculations
were faced with problems. Finally the mechanical pressure gauge has
advantages, including the ability to measured forces and pressures on
the mold surface during melon growth; the ability to display the peak
forces; the ability to produce melon growth graph thanks to its
continuous force measurements; the conformity of its manufacturing
materials with the required physical conditions of melon growth; high
air conditioning capability; the ability to permit sunlight reaches the
melon rind (no yellowish skin and quality loss); fast and
straightforward calibration; no damages to the product during
assembling and disassembling; visual check capability of the product
within the mold; applicable to all growth environments (field,
greenhouses, etc.); simple process; low costs and so forth.
Abstract: Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.