Abstract: Developing electronic system for detecting low energy impacts using open source hardware such as Arduino is challenging. A highly efficient loadcell is designed and fabricated. A commercial polyvinylidene fluoride (PVDF) piezoelectric film is used as primary sensor for sensing small impacts. Without modifying hardware, the Arduino board is configured by programming to capture the signal from the film sensor with a resolution better than 1.1 mV. By our system, impact energy as low as 1.8 µJ (corresponds to impact force of 39.9 mN) is reliably and monitored. In the linear zone, sensitivity of the system found to be as high as 20.7 kV/J or 3.3 V/N with a measurement frequency of 500 Hz. The various characteristics such as linearity, hysteresis, repeatability and spectrum analysis are discussed. After calibration, measurements of unknown impact energy and impact force are investigated and results are found to agree well.
Abstract: This article describes an interesting and inexpensive laboratory experiment for undergraduate students of electronics, geography and related disciplines. The objective of the proposed experiment is to improve the students’ exposure on the basic principles of instrumentation and to demonstrate an electronic measurement system. A simple electronic curvy length measurement system is presented here. Such a system can be used to measure curvy lengths e.g. length of a river, road or railway line etc. from topographical map. The proposed system is composed of simple functional blocks which are usually demonstrated in laboratory or in theory course of electronics at the undergraduate level. The experiment is assigned to a group of students and it is found that the experiment can fulfill its objectives with high degree of satisfaction.
Abstract: Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.