Abstract: Several situations arise in industrial practice which calls for joining of dissimilar metals. With increasing demand in the application requirements, dissimilar metal joining becomes inevitable in modern engineering industries. The metals employed are the structure for effective and utilization of the special properties of each metal. The purpose of this paper is to present the research and development status of titanium (Ti) and aluminium (Al) dissimilar alloys weldment by the researchers worldwide. The detailed analysis of problems faced during welding of dissimilar metal joint for Ti/Al metal combinations are discussed. Microstructural variations in heat affected zone (HAZ), fusion zone (FZ), Intermetallic compound (IMC) layer and surface fracture of weldments are analysed. Additionally, mechanical property variations and microstructural feature have been studied by the researchers. The paper provides a detailed literature review of Ti/Al dissimilar metal joint microchemistry and property variation across the weldment.
Abstract: Pure metals are not used in most cases for structural applications because of their limited properties. Presently, high entropy alloys (HEAs) are emerging by mixing comparative proportions of metals with the aim of maximizing the entropy leading to enhancement in structural and mechanical properties. Aluminum Silicon Nickel Iron Vanadium (AlSiNiFeV) alloy was developed using stir cast technique and analysed. Results obtained show that the alloy grade G0 contains 44 percentage by weight (wt%) Al, 32 wt% Si, 9 wt% Ni, 4 wt% Fe, 3 wt% V and 8 wt% for minor elements with tensile strength and elongation of 106 Nmm-2 and 2.68%, respectively. X-ray diffraction confirmed intermetallic compounds having hexagonal closed packed (HCP), orthorhombic and cubic structures in cubic dendritic matrix. This affirmed transformation from the cubic structures of elemental constituents of the HEAs to the precipitated structures of the intermetallic compounds. A maximum tensile strength of 188 Nmm-2 with 4% elongation was noticed at 10wt% of silica addition to the G0. An increase in tensile strength with an increment in silica content could be attributed to different phases and crystal geometries characterizing each HEA.
Abstract: The aim of this paper is to study the effectiveness of bismuth addition in the solder alloy to retard the intermetallic compound formation and growth. In this study, three categories of solders such as Sn-4Ag-xCu (x = 0.5, 0.7, 1.0) and Sn-4Ag-0.5Cu-xBi (x = 0.1, 0.2, 0.4) were used. Ni/Au surface finish substrates were dipped into the molten solder at a temperature of 180-190 oC and allowed to cool at room temperature. The intermetallic compound (IMCs) were subjected to the characterization in terms of composition and morphology. The IMC phases were identified by energy dispersive x-ray (EDX), whereas the optical microscope and scanning electron microscopy (SEM) were used to observe microstructure evolution of the solder joint. The results clearly showed that copper concentration dependency was high during the reflow stage. Besides, only Ni3Sn4 and Ni3Sn2 were detected for all copper concentrations. The addition of Bi was found to have no significant effect on the type of IMCs formed, but yet the grain became further refined.
Abstract: Joining of 1mm thick aluminum 6061 to titanium TC4
was conducted using Bypass-current MIG welding-brazed, and stable
welding process and good bead appearance were obtained. The Joint
profile and microstructure of Ti/Al joints were observed by optical
microscopy and SEM and then the structure of the interfacial reaction
layers were analyzed in details. It was found that the intermetallic
compound layer at the interfacial top is in the form of columnar
crystal, which is in short and dense state. A mount of AlTi were
observed at the interfacial layer near the Ti base metal while
intermetallic compound like Al3Ti, TiSi3 were formed near the Al base
metal, and the Al11Ti5 transition phase was found in the center of the
interface layer due to the uneven distribution inside the weld pool
during the welding process. Tensile test results show that the average
tensile strength of joints is up to 182.6 MPa, which reaches about
97.6% of aluminum base metal. Fracture is prone to occur in the base
metal with a certain amount of necking.
Abstract: The effect of Yttrium addition on the microstructure and mechanical properties of Sn-Zn eutectic alloy, which has been attracting intensive focus as a Pb-free solder material, was investigated in this study. Phase equilibrium has been calculated by using FactSage® to evaluate the composition and fraction of equilibrium intermetallic compounds and construct a phase diagram. In the case of Sn-8.8Zn eutectic alloy, the as-cast microstructure was typical lamellar. With addition of 0.25wt.%Y, a large amount of pro-eutectic a phase have been observed and various YZnx intermetallic compounds were expected to successively form during cooling. Hardness of Sn-8.8Zn alloy was not affected by Y-addition and both alloys could be rolled by 90% at room temperature.
Abstract: Al/Cu clad sheet has been fabricated by using differential speed rolling (DSR) process, which caused severe shear deformation between Al and Cu plate to easily bond to each other. Rolling was carried out at 100 and 150oC with speed ratios from 1.4 to 2.2, in which the total thickness reduction was in the range between 14 and 46%. Interfacial microstructure and mechanical properties of Al/Cu clad were investigated by scanning electron microscope equipped with energy dispersive X-ray detector, and tension tests. The DSR process was very effective to provide a good interface for atoms diffusion during subsequent annealing. The strength of bonding was higher with the increasing speed ratio. Post heat treatment enhanced the mechanical properties of clad sheet by forming intermetallic compounds in the interface area.
Abstract: Pyritisation halos are identified in weathering crusts and unconsolidated formations at five locations within large fault structure of the Urals’ eastern slope. Electron microscopy reveals the presence of inclusions and growths on pyrite faces – normally on cubic pyrite with striations, or combinations of cubes and other forms. Following neogenesis types are established: native elements and intermetallic compounds (including gold and silver), halogenides, sulphides, sulfosalts, tellurides, sulphotellurides,
selenides, tungstates, sulphates, phosphates, carbon-based substances. Direct relationship is noted between amount and diversity of such mineral phases, and proximity to and scale of ore-grade mineralization. Gold and silver, both in native form and within tellurides, presence of lead (galena, native lead), native tungsten, and, possibly, molybdenite and sulfosalts can indicate gold-bearing formations. First find of native tungsten in the Urals is for the first time – in crystallised and druse-like form. Link is suggested between unusual mineralization and “reducing” hydrothermal fluids from deep-seated faults at later stages of Urals’ reactivation.
Abstract: Studies have shown that the SnAgCu solder family has been widely used as a replacement for conventional Sn-Pb solders. An attractive approach is by introducing alloying additives (rare earth elements (RE), Zn, Co, Fe, Ni, Sb) into the SnAgCu solder, which helps in refining the microstructure also improving the mechanical and wetting properties of the solder. The present work focuses on the effect of additions of 0.5% Ce and Fe into Sn-3.0Ag-0.5Cu solder, in attempt to reduce the intermetallic compound (IMC) growth and reflow properties of the solder on Cu and Ni (P) surface finish, as well as effects thermal aging on the formation of intermetallic compound (IMC) on different surface finish. Excessive intermetallic compound growth may effect the interface and solder joint due to the brittle nature of the intermetallic compounds. Thus, by introducing alloying elements, IMC layer thickness can be decrease, resulting in better joint and solder reliability.
Abstract: Wetting characteristics of reactive (Sn–0.7Cu solder)
and non– reactive (castor oil) wetting of liquids on Cu and Ag plated
Al substrates have been investigated. Solder spreading exhibited
capillary, gravity and viscous regimes. Oils did not exhibit noticeable
spreading regimes. Solder alloy showed better wettability on Ag
coated Al substrate compared to Cu plating. In the case of castor oil,
Cu coated Al substrate exhibited good wettability as compared to Ag
coated Al substrates. The difference in wettability during reactive
wetting of solder and non–reactive wetting of oils is attributed to the
change in the surface energies of Al substrates brought about by the
formation of intermetallic compounds (IMCs).