Abstract: Several situations arise in industrial practice which calls for joining of dissimilar metals. With increasing demand in the application requirements, dissimilar metal joining becomes inevitable in modern engineering industries. The metals employed are the structure for effective and utilization of the special properties of each metal. The purpose of this paper is to present the research and development status of titanium (Ti) and aluminium (Al) dissimilar alloys weldment by the researchers worldwide. The detailed analysis of problems faced during welding of dissimilar metal joint for Ti/Al metal combinations are discussed. Microstructural variations in heat affected zone (HAZ), fusion zone (FZ), Intermetallic compound (IMC) layer and surface fracture of weldments are analysed. Additionally, mechanical property variations and microstructural feature have been studied by the researchers. The paper provides a detailed literature review of Ti/Al dissimilar metal joint microchemistry and property variation across the weldment.
Abstract: Studies have shown that the SnAgCu solder family has been widely used as a replacement for conventional Sn-Pb solders. An attractive approach is by introducing alloying additives (rare earth elements (RE), Zn, Co, Fe, Ni, Sb) into the SnAgCu solder, which helps in refining the microstructure also improving the mechanical and wetting properties of the solder. The present work focuses on the effect of additions of 0.5% Ce and Fe into Sn-3.0Ag-0.5Cu solder, in attempt to reduce the intermetallic compound (IMC) growth and reflow properties of the solder on Cu and Ni (P) surface finish, as well as effects thermal aging on the formation of intermetallic compound (IMC) on different surface finish. Excessive intermetallic compound growth may effect the interface and solder joint due to the brittle nature of the intermetallic compounds. Thus, by introducing alloying elements, IMC layer thickness can be decrease, resulting in better joint and solder reliability.