Abstract: Thermal management of electronic components packaged inside an IP65 rated enclosure is of prime importance in industrial applications. Electrical enclosure protects the multiple board configurations such as inverter, power, controller board components, busbars, and various power dissipating components from harsh environments. Industrial environments often experience relatively warm ambient conditions, and the electronic components housed in the enclosure dissipate heat, due to which the enclosures and the components require thermal management as well as reduction of internal ambient temperatures. Design of Experiments based thermal simulation approach with MOSFET arrangement, Heat sink design, Enclosure Volume, Copper and Aluminum Spreader, Power density, and Printed Circuit Board (PCB) type were considered to optimize air temperature inside the IP65 enclosure to ensure conducive operating temperature for controller board and electronic components through the different modes of heat transfer viz. conduction, natural convection and radiation using Ansys ICEPAK. MOSFET’s with the parallel arrangement, IP65 enclosure molded heat sink with rectangular fins on both enclosures, specific enclosure volume to satisfy the power density, Copper spreader to conduct heat to the enclosure, optimized power density value and selecting Aluminum clad PCB which improves the heat transfer were the contributors towards achieving a conducive operating temperature inside the IP-65 rated Motor Inverter enclosure. A reduction of 52 ℃ was achieved in internal ambient temperature inside the IP65 enclosure between baseline and final design parameters, which met the operative temperature requirements of the electronic components inside the IP-65 rated Motor Inverter.
Abstract: Electromagnetic Interference (EMI) shielded doors made from brass extruded channels need to be welded with shielded enclosures to attain optimum shielding performance. Control of welding induced distortion is a problem in welding dissimilar metals like steel and brass. In this research, soldering of the steel-brass joint has been proposed to avoid weld distortion. The material used for brass channel is UNS C36000. The thickness of brass is defined by the manufacturing process, i.e. extrusion. The thickness of shielded enclosure material (ASTM A36) can be varied to produce joint between the dissimilar metals. Steel sections of different gauges are soldered using (91% tin, 9% zinc) solder to the brass, and strength of joint is measured by standard test procedures. It is observed that thin steel sheets produce a stronger bond with brass. The steel sections further require to be welded with shielded enclosure steel sheets through TIG welding process. Stresses and deformation in the vicinity of soldered portion is calculated through FE simulation. Crack formation in soldered area is also studied through experimental work. It has been found that in thin sheets deformation produced due to applied force is localized and has no effect on soldered joint area whereas in thick sheets profound cracks have been observed in soldered joint. The shielding effectiveness of EMI shielded door is compromised due to these cracks. The shielding effectiveness of the specimens is tested and results are compared.
Abstract: Rayleigh-B´enard convection of a nanoliquid in shallow, square and tall enclosures is studied using the Khanafer-Vafai-Lightstone single-phase model. The thermophysical properties of water, copper, copper-oxide, alumina, silver and titania at 3000 K under stagnant conditions that are collected from literature are used in calculating thermophysical properties of water-based nanoliquids. Phenomenological laws and mixture theory are used for calculating thermophysical properties. Free-free, rigid-rigid and rigid-free boundary conditions are considered in the study. Intractable Lorenz model for each boundary combination is derived and then reduced to the tractable Ginzburg-Landau model. The amplitude thus obtained is used to quantify the heat transport in terms of Nusselt number. Addition of nanoparticles is shown not to alter the influence of the nature of boundaries on the onset of convection as well as on heat transport. Amongst the three enclosures considered, it is found that tall and shallow enclosures transport maximum and minimum energy respectively. Enhancement of heat transport due to nanoparticles in the three enclosures is found to be in the range 3% - 11%. Comparison of results in the case of rigid-rigid boundaries is made with those of an earlier work and good agreement is found. The study has limitations in the sense that thermophysical properties are calculated by using various quantities modelled for static condition.
Abstract: A Rice Sheller is used for obtaining polished white
rice from paddy. There are about 3000 Rice Shellers in Punjab and
50000 in India. During the process of shelling lot of dust is emitted
from different unit operations like paddy silo, paddy shaker, bucket
elevators, huskers, paddy separator etc. These dust emissions have
adverse effect on the health of the workers and the wear and tear of
the shelling machinery is fast. All the dust emissions spewing out of
these unit operations of a rice Sheller were contained by providing
suitable hoods and enclosures while ensuring their workability. These
were sucked by providing an induced draft fan followed by a high
efficiency cyclone separator that has got an overall dust collection
efficiency of more than 90%. This cyclone separator replaced two
cyclone separators and a filter bag house, which the Rice Sheller was
already having. The dust concentration in the stack after the
installation of cyclone separator is well within the stipulated
standards. Besides controlling pollution, there is improvement in the
quality of products like bran and the life of shelling machinery has
enhanced. The payback period of this technology is less than four
shelling months.
Abstract: Meeting the growth in demand for digital services
such as social media, telecommunications, and business and cloud
services requires large scale data centres, which has led to an increase
in their end use energy demand. Generally, over 30% of data centre
power is consumed by the necessary cooling overhead. Thus energy
can be reduced by improving the cooling efficiency. Air and liquid
can both be used as cooling media for the data centre. Traditional
data centre cooling systems use air, however liquid is recognised as a
promising method that can handle the more densely packed data
centres. Liquid cooling can be classified into three methods; rack heat
exchanger, on-chip heat exchanger and full immersion of the
microelectronics. This study quantifies the improvements of heat
transfer specifically for the case of immersed microelectronics by
varying the CPU and heat sink location. Immersion of the server is
achieved by filling the gap between the microelectronics and a water
jacket with a dielectric liquid which convects the heat from the CPU
to the water jacket on the opposite side. Heat transfer is governed by
two physical mechanisms, which is natural convection for the fixed
enclosure filled with dielectric liquid and forced convection for the
water that is pumped through the water jacket. The model in this
study is validated with published numerical and experimental work
and shows good agreement with previous work. The results show that
the heat transfer performance and Nusselt number (Nu) is improved
by 89% by placing the CPU and heat sink on the bottom of the
microelectronics enclosure.
Abstract: The Lattice Boltzmann Method (LBM) with double populations is applied to solve the steady-state laminar natural convective heat transfer in a triangular cavity filled with water. The bottom wall is heated, the vertical wall is cooled, and the inclined wall is kept adiabatic. The buoyancy effect was modeled by applying the Boussinesq approximation to the momentum equation. The fluid velocity is determined by D2Q9 LBM and the energy equation is discritized by D2Q4 LBM to compute the temperature field. Comparisons with previously published work are performed and found to be in excellent agreement. Numerical results are obtained for a wide range of parameters: the Rayleigh number from to and the inclination angle from 0° to 360°. Flow and thermal fields were exhibited by means of streamlines and isotherms. It is observed that inclination angle can be used as a relevant parameter to control heat transfer in right-angled triangular enclosures.
Abstract: In this study, noise characteristics of structure were analyzed in an effort to reduce noise passing through an opening of an
enclosure surrounding the structure that generates noise. Enclosures
are essential measure to protect noise propagation from operating machinery. Access openings of the enclosures are important path of noise leakage. First, noise characteristics of structure were analyzed
and feed-forward noise control was performed using simulation in
order to reduce noise passing through the opening of enclosure, which
surrounds a structure generating noise. We then implemented a
feed-forward controller to actively control the acoustic power through
the opening. Finally, we conducted optimization of placement of the
reference sensors for several cases of the number of sensors. Good
control performances were achieved using the minimum number of microphones arranged an optimal placement.
Abstract: Sound pathways in the enclosures of small earphones
are very narrow. In such narrow pathways, the speed of sound
propagation and the phase of sound waves change because of the air
viscosity. We have developed a new finite element method that
includes the effects of damping due to air viscosity for modeling the
sound pathway. This method is developed as an extension of the
existing finite element method for porous sound-absorbing materials.
The numerical calculation results using the proposed finite element
method are validated against the existing calculation methods.
Abstract: A numerical study is presented on convective heat transfer in enclosures. The results are addressed to automotive headlights containing new-age light sources like Light Emitting Diodes (LED). The heat transfer from the heat source (LED) to the enclosure walls is investigated for mixed convection as interaction of the forced convection flow from an inlet and an outlet port and the natural convection at the heat source. Unlike existing studies, inlet and outlet port are thermally coupled and do not serve to remove hot fluid. The input power of the heat source is expressed by the Rayleigh number. The internal position of the heat source, the aspect ratio of the enclosure, and the inclination angle of one wall are varied. The results are given in terms of the global Nusselt number and the enclosure Nusselt number that characterize the heat transfer from the source and from the interior fluid to the enclosure walls, respectively. It is found that the heat transfer from the source to the fluid can be maximized if the source is placed in the main stream from the inlet to the outlet port. In this case, the Reynolds number and heat source position have the major impact on the heat transfer. A disadvantageous position has been found where natural and forced convection compete each other. The overall heat transfer from the source to the wall increases with increasing Reynolds number as well as with increasing aspect ratio and decreasing inclination angle. The heat transfer from the interior fluid to the enclosure wall increases upon decreasing the aspect ratio and increasing the inclination angle. This counteracting behaviour is caused by the variation of the area of the enclosure wall. All mixed convection results are compared to the natural convection limit.