Abstract: The effectiveness of microchannels in enhancing heat
transfer has been demonstrated in the semiconductor industry. In
order to tap the microscale heat transfer effects into macro
geometries, overcoming the cost and technological constraints,
microscale passages were created in macro geometries machined
using conventional fabrication methods. A cylindrical insert was
placed within a pipe, and geometrical profiles were created on the
outer surface of the insert to enhance heat transfer under steady-state
single-phase liquid flow conditions. However, while heat transfer
coefficient values of above 10 kW/m2·K were achieved, the heat
transfer enhancement was accompanied by undesirable pressure drop
increment. Therefore, this study aims to address the high pressure
drop issue using Constructal theory, a universal design law for both
animate and inanimate systems. Two designs based on Constructal theory were developed to study
the effectiveness of Constructal features in reducing the pressure drop
increment as compared to parallel channels, which are commonly
found in microchannel fabrication. The hydrodynamic and heat
transfer performance for the Tree insert and Constructal fin (Cfin)
insert were studied using experimental methods, and the underlying
mechanisms were substantiated by numerical results. In technical
terms, the objective is to achieve at least comparable increment in
both heat transfer coefficient and pressure drop, if not higher
increment in the former parameter. Results show that the Tree insert improved the heat transfer
performance by more than 16 percent at low flow rates, as compared
to the Tree-parallel insert. However, the heat transfer enhancement
reduced to less than 5 percent at high Reynolds numbers. On the
other hand, the pressure drop increment stayed almost constant at 20
percent. This suggests that the Tree insert has better heat transfer
performance in the low Reynolds number region. More importantly,
the Cfin insert displayed improved heat transfer performance along
with favourable hydrodynamic performance, as compared to Cfinparallel
insert, at all flow rates in this study. At 2 L/min, the
enhancement of heat transfer was more than 30 percent, with 20
percent pressure drop increment, as compared to Cfin-parallel insert.
Furthermore, comparable increment in both heat transfer coefficient
and pressure drop was observed at 8 L/min. In other words, the Cfin
insert successfully achieved the objective of this study. Analysis of the results suggests that bifurcation of flows is
effective in reducing the increment in pressure drop relative to heat
transfer enhancement. Optimising the geometries of the Constructal
fins is therefore the potential future study in achieving a bigger stride
in energy efficiency at much lower costs.
Abstract: Developing a supply chain management (SCM) system is costly, but important. However, because of its complicated nature, not many of such projects are considered successful. Few research publications directly relate to key success factors (KSFs) for implementing a SCM system. Motivated by the above, this research proposes a hierarchy of KSFs for SCM system implementation in the semiconductor industry by using a two-step approach. First, the literature review indicates the initial hierarchy. The second step includes a focus group approach to finalize the proposed KSF hierarchy by extracting valuable experiences from executives and managers that actively participated in a project, which successfully establish a seamless SCM integration between the world's largest semiconductor foundry manufacturing company and the world's largest assembly and testing company. Future project executives may refer the resulting KSF hierarchy as a checklist for SCM system implementation in semiconductor or related industries.