Abstract: As the Silicon oxide scaled down in MOSFET
technology to few nanometers, gate Direct Tunneling (DT) in
Floating gate (FGMOSFET) devices has become a major concern for
analog designers. FGMOSFET has been used in many low-voltage
and low-power applications, however, there is no accurate model that
account for DT gate leakage in nano-scale. This paper studied and
analyzed different simulation models for FGMOSFET using TSMC
90-nm technology. The simulation results for FGMOSFET cascade
current mirror shows the impact of DT on circuit performance in
terms of current and voltage without the need for fabrication. This
works shows the significance of using an accurate model for
FGMOSFET in nan-scale technologies.