Abstract: In this study, we report calculations of gate capacitance of AlGaN/GaN HEMTs with nextnano device simulation software. We have used a physical gate capacitance model for III-V FETs that incorporates quantum capacitance and centroid capacitance in the channel. These simulations explore various device structures with different values of barrier thickness and channel thickness. A detailed understanding of the impact of gate capacitance in HEMTs will allow us to determine their role in future 10 nm physical gate length node.
Abstract: The objective of this paper is to simulate static I-V and dynamic characteristics of an appropriated and recessed n-GaN/AlxGa1-xN/GaN high electron mobility (HEMT). Using SILVACO TCAD device simulation, and optimized technological parameters; we calculate the drain-source current (lDS) as a function of the drain-source voltage (VDS) for different values of the gate-source voltage (VGS), and the drain-source current (lDS) depending on the gate-source voltage (VGS) for a drain-source voltage (VDS) of 20 V, for various temperatures. Then, we calculate the cut-off frequency and the maximum oscillation frequency for different temperatures.
We obtain a high drain-current equal to 60 mA, a low knee voltage (Vknee) of 2 V, a high pinch-off voltage (VGS0) of 53.5 V, a transconductance greater than 600 mS/mm, a cut-off frequency (fT) of about 330 GHz, and a maximum oscillation frequency (fmax) of about 1 THz.
Abstract: This paper presents device simulations on the vertical silicon nanowire tunneling FET (VSiNW TFET). Simulations show that a narrow nanowire and thin gate oxide is required for good performance, which is expected even for conventional MOSFETs. The gate length also needs to be more than the nanowire diameter to prevent short channel effects. An effect more unique to TFET is the need for abrupt source to channel junction, which is shown to improve the performance. The ambipolar effect suppression by reducing drain doping concentration is also explored and shown to have little or no effect on performance.
Abstract: In this paper, for the first time, a two-dimensional
(2D) analytical drain current model for sub-100 nm multi-layered
gate material engineered trapezoidal recessed channel (MLGMETRC)
MOSFET: a novel design is presented and investigated using
ATLAS and DEVEDIT device simulators, to mitigate the large gate
leakages and increased standby power consumption that arise due to
continued scaling of SiO2-based gate dielectrics. The twodimensional
(2D) analytical model based on solution of Poisson-s
equation in cylindrical coordinates, utilizing the cylindrical
approximation, has been developed which evaluate the surface
potential, electric field, drain current, switching metric: ION/IOFF
ratio and transconductance for the proposed design. A good
agreement between the model predictions and device simulation
results is obtained, verifying the accuracy of the proposed analytical
model.