Computation and Validation of the Stress Distribution around a Circular Hole in a Slab Undergoing Plastic Deformation

The aim of the current work was to employ the finite element method to model a slab, with a small hole across its width, undergoing plastic plane strain deformation. The computational model had, however, to be validated by comparing its results with those obtained experimentally. Since they were in good agreement, the finite element method can therefore be considered a reliable tool that can help gain better understanding of the mechanism of ductile failure in structural members having stress raisers. The finite element software used was ANSYS, and the PLANE183 element was utilized. It is a higher order 2-D, 8-node or 6-node element with quadratic displacement behavior. A bilinear stress-strain relationship was used to define the material properties, with constants similar to those of the material used in the experimental study. The model was run for several tensile loads in order to observe the progression of the plastic deformation region, and the stress concentration factor was determined in each case. The experimental study involved employing the visioplasticity technique, where a circular mesh (each circle was 0.5 mm in diameter, with 0.05 mm line thickness) was initially printed on the side of an aluminum slab having a small hole across its width. Tensile loading was then applied to produce a small increment of plastic deformation. Circles in the plastic region became ellipses, where the directions of the principal strains and stresses coincided with the major and minor axes of the ellipses. Next, we were able to determine the directions of the maximum and minimum shear stresses at the center of each ellipse, and the slip-line field was then constructed. We were then able to determine the stress at any point in the plastic deformation zone, and hence the stress concentration factor. The experimental results were found to be in good agreement with the analytical ones.

Effect of Out-of-Plane Deformation on Relaxation Method of Stress Concentration in a Plate with a Circular Hole

In structures, stress concentration is a factor of fatigue fracture. Basically, the stress concentration is a phenomenon that should be avoided. However, it is difficult to avoid the stress concentration. Therefore, relaxation of the stress concentration is important. The stress concentration arises from notches and circular holes. There is a relaxation method that a composite patch covers a notch and a circular hole. This relaxation method is used to repair aerial wings, but it is not systematized. Composites are more expensive than single materials. Accordingly, we propose the relaxation method that a single material patch covers a notch and a circular hole, and aim to systematize this relaxation method. We performed FEA (Finite Element Analysis) about an object by using a three-dimensional FEA model. The object was that a patch adheres to a plate with a circular hole. And, a uniaxial tensile load acts on the patched plate with a circular hole. In the three-dimensional FEA model, it is not easy to model the adhesion layer. Basically, the yield stress of the adhesive is smaller than that of adherents. Accordingly, the adhesion layer gets to plastic deformation earlier than the adherents under the yield load of adherents. Therefore, we propose the three-dimensional FEA model which is applied a nonlinear elastic region to the adhesion layer. The nonlinear elastic region was calculated by a bilinear approximation. We compared the analysis results with the tensile test results to confirm whether the analysis model has usefulness. As a result, the analysis results agreed with the tensile test results. And, we confirmed that the analysis model has usefulness. As a result that the three-dimensional FEA model was used to the analysis, it was confirmed that an out-of-plane deformation occurred to the patched plate with a circular hole. The out-of-plane deformation causes stress increase of the patched plate with a circular hole. Therefore, we investigated that the out-of-plane deformation affects relaxation of the stress concentration in the plate with a circular hole on this relaxation method. As a result, it was confirmed that the out-of-plane deformation inhibits relaxation of the stress concentration on the plate with a circular hole.

Stress Variation around a Circular Hole in Functionally Graded Plate under Bending

The influence of material property variation on stress concentration factor (SCF) due to the presence of a circular hole in a functionally graded material (FGM) plate is studied in this paper. A numerical method based on complex variable theory of elasticity is used to investigate the problem. To achieve the material property, variation plate is decomposed into a number of rings. In this research work, Young’s modulus is assumed to be varying exponentially and it is found that stress concentration factor can be reduced by increasing Young’s modulus progressively away from the hole.

Finite Element Modeling of two-dimensional Nanoscale Structures with Surface Effects

Nanomaterials have attracted considerable attention during the last two decades, due to their unusual electrical, mechanical and other physical properties as compared with their bulky counterparts. The mechanical properties of nanostructured materials show strong size dependency, which has been explained within the framework of continuum mechanics by including the effects of surface stress. The size-dependent deformations of two-dimensional nanosized structures with surface effects are investigated in the paper by the finite element method. Truss element is used to evaluate the contribution of surface stress to the total potential energy and the Gurtin and Murdoch surface stress model is implemented with ANSYS through its user programmable features. The proposed approach is used to investigate size-dependent stress concentration around a nanosized circular hole and the size-dependent effective moduli of nanoporous materials. Numerical results are compared with available analytical results to validate the proposed modeling approach.

Analysis of Stress Concentration and Deflectionin Isotropic and Orthotropic Rectangular Plates with Central Circular Hole under Transverse Static Loading

The distributions of stresses and deflection in rectangular isotropic and orthotropic plates with central circular hole under transverse static loading have been studied using finite element method. The aim of author is to analyze the effect of D/A ratio (where D is hole diameter and A is plate width) upon stress concentration factor (SCF) and deflection in isotropic and orthotropic plates under transverse static loading. The D/A ratio is varied from 0.01 to 0.9. The analysis is done for plates of isotropic and two different orthotropic materials. The results are obtained for three different boundary conditions. The variations of SCF and deflection with respect to D/A ratio are presented in graphical form and discussed. The finite element formulation is carried out in the analysis section of the ANSYS package.