Using Stresses Obtained from a Low Detailed FE Model and Located at a Reference Point to Quickly Calculate the Free-edge Stress Intensity Factors of Bonded Joints

The present study focuses on methods allowing a convenient and quick calculation of the SIFs in order to predict the static adhesive strength of bonded joints. A new SIF calculation method is proposed, based on the stresses obtained from a FE model at a reference point located in the adhesive layer at equal distance of the free-edge and of the two interfaces. It is shown that, even limiting ourselves to the two main modes, i.e. the opening and the shearing modes, and using the values of the stresses resulting from a low detailed FE model, an efficient calculation of the peeling stress at adhesive-substrate corners can be obtained by this way. The proposed method is interesting in that it can be the basis of a prediction tool that will allow the designer to quickly evaluate the SIFs characterizing a particular application without developing a detailed analysis.

The Influence of Substrate Bias on the Mechanical Properties of a W- and S-containing DLC-based Solid-lubricant Film

A diamond-like carbon (DLC) based solid-lubricant film was designed and DLC films were successfully prepared using a microwave plasma enhanced magnetron sputtering deposition technology. Post-test characterizations including Raman spectrometry, X-ray diffraction, nano-indentation test, adhesion test, friction coefficient test were performed to study the influence of substrate bias voltage on the mechanical properties of the W- and S-doped DLC films. The results indicated that the W- and S-doped DLC films also had the typical structure of DLC films and a better mechanical performance achieved by the application of a substrate bias of -200V.