Abstract: Chatter vibrations and process instabilities are the
most important factors limiting the productivity of the milling
process. Chatter can leads to damage of the tool, the part or the
machine tool. Therefore, the estimation and prediction of the process
stability is very important. The process stability depends on the
spindle speed, the depth of cut and the width of cut. In milling, the
process conditions are defined in the NC-program. While the spindle
speed is directly coded in the NC-program, the depth and width of cut
are unknown. This paper presents a new simulation based approach
for the prediction of the depth and width of cut of a milling process.
The prediction is based on a material removal simulation with an
analytically represented tool shape and a multi-dexel approach for the
workpiece. The new calculation method allows the direct estimation
of the depth and width of cut, which are the influencing parameters of
the process stability, instead of the removed volume as existing
approaches do. The knowledge can be used to predict the stability of
new, unknown parts. Moreover with an additional vibration sensor,
the stability lobe diagram of a milling process can be estimated and
improved based on the estimated depth and width of cut.
Abstract: In a state-of-the-art industrial production line of
photovoltaic products the handling and automation processes are of
particular importance and implication. While processing a fully
functional crystalline solar cell an as-cut photovoltaic wafer is subject
to numerous repeated handling steps. With respect to stronger
requirements in productivity and decreasing rejections due to defects
the mechanical stress on the thin wafers has to be reduced to a
minimum as the fragility increases by decreasing wafer thicknesses.
In relation to the increasing wafer fragility, researches at the
Fraunhofer Institutes IPA and CSP showed a negative correlation
between multiple handling processes and the wafer integrity. Recent
work therefore focused on the analysis and optimization of the dry
wafer stack separation process with compressed air. The achievement
of a wafer sensitive process capability and a high production
throughput rate is the basic motivation in this research.