Development and Optimization of Automated Dry-Wafer Separation
In a state-of-the-art industrial production line of
photovoltaic products the handling and automation processes are of
particular importance and implication. While processing a fully
functional crystalline solar cell an as-cut photovoltaic wafer is subject
to numerous repeated handling steps. With respect to stronger
requirements in productivity and decreasing rejections due to defects
the mechanical stress on the thin wafers has to be reduced to a
minimum as the fragility increases by decreasing wafer thicknesses.
In relation to the increasing wafer fragility, researches at the
Fraunhofer Institutes IPA and CSP showed a negative correlation
between multiple handling processes and the wafer integrity. Recent
work therefore focused on the analysis and optimization of the dry
wafer stack separation process with compressed air. The achievement
of a wafer sensitive process capability and a high production
throughput rate is the basic motivation in this research.
[1] EPIA-European Photovoltaic Industry Association, PhotoVoltaic-
Technology Platform: "Solar Europe Industry Initiative, Implementation
Plan 2010-2012", May 2010.
[2] K. Reddig, "Overview of automation in the photovoltaic industry". In
Photovoltaics International, no. 4, pp. 18-29, 2009.
[3] CTM Group (Crystalline Cell Technology and Manufacturing): CTM
Group: "PV Roadmap for Crystalline Silicon". March, 2010.
[4] P. A.Wang, "Industrial challenges for thin wafer manufacturing" in:
Fourth World Conference on Photovoltaic Energy Conversion (1),
vol. 1, pp. 1179-1182, 2006.
[5] C. Fischmann et al., "Analysis and Evaluation of Thin-Wafer Handling
Methods" in: Proceedings of the 24th European Photovoltaic Solar
Energy Conference 2009, pp. 1352 - 1355.
[6] X. F Brun, "Analysis of stresses and breakage of crystalline silicon
wafers during handling and transport." In: Solar Energy Materials &
Solar Cells, pp. 1238-1247, 2009.
[7] R. Koepge, S. Schoenfelder, T. Giesen, C. Fischmann, A. Verl and J.
Bagdahn, "The Influence of Transport Operations on the Wafer Strength
and Breakage Rate", in Proceedings of the 26th European Photovoltaic
Solar Energy Conference 2011, submitted for publication.
[1] EPIA-European Photovoltaic Industry Association, PhotoVoltaic-
Technology Platform: "Solar Europe Industry Initiative, Implementation
Plan 2010-2012", May 2010.
[2] K. Reddig, "Overview of automation in the photovoltaic industry". In
Photovoltaics International, no. 4, pp. 18-29, 2009.
[3] CTM Group (Crystalline Cell Technology and Manufacturing): CTM
Group: "PV Roadmap for Crystalline Silicon". March, 2010.
[4] P. A.Wang, "Industrial challenges for thin wafer manufacturing" in:
Fourth World Conference on Photovoltaic Energy Conversion (1),
vol. 1, pp. 1179-1182, 2006.
[5] C. Fischmann et al., "Analysis and Evaluation of Thin-Wafer Handling
Methods" in: Proceedings of the 24th European Photovoltaic Solar
Energy Conference 2009, pp. 1352 - 1355.
[6] X. F Brun, "Analysis of stresses and breakage of crystalline silicon
wafers during handling and transport." In: Solar Energy Materials &
Solar Cells, pp. 1238-1247, 2009.
[7] R. Koepge, S. Schoenfelder, T. Giesen, C. Fischmann, A. Verl and J.
Bagdahn, "The Influence of Transport Operations on the Wafer Strength
and Breakage Rate", in Proceedings of the 26th European Photovoltaic
Solar Energy Conference 2011, submitted for publication.
@article{"International Journal of Mechanical, Industrial and Aerospace Sciences:53453", author = "Tim Giesen and Christian Fischmann and Fabian Böttinger and Alexander Ehm and Alexander Verl", title = "Development and Optimization of Automated Dry-Wafer Separation", abstract = "In a state-of-the-art industrial production line of
photovoltaic products the handling and automation processes are of
particular importance and implication. While processing a fully
functional crystalline solar cell an as-cut photovoltaic wafer is subject
to numerous repeated handling steps. With respect to stronger
requirements in productivity and decreasing rejections due to defects
the mechanical stress on the thin wafers has to be reduced to a
minimum as the fragility increases by decreasing wafer thicknesses.
In relation to the increasing wafer fragility, researches at the
Fraunhofer Institutes IPA and CSP showed a negative correlation
between multiple handling processes and the wafer integrity. Recent
work therefore focused on the analysis and optimization of the dry
wafer stack separation process with compressed air. The achievement
of a wafer sensitive process capability and a high production
throughput rate is the basic motivation in this research.", keywords = "Automation, Photovoltaic Manufacturing, Thin
Wafer, Material Handling", volume = "6", number = "1", pages = "77-7", }