Transient Hydrodynamic and Thermal Behaviors of Fluid Flow in a Vertical Porous Microchannel under the Effect of Hyperbolic Heat Conduction Model

The transient hydrodynamics and thermal behaviors of fluid flow in open-ended vertical parallel-plate porous microchannel are investigated semi-analytically under the effect of the hyperbolic heat conduction model. The model that combines both the continuum approach and the possibility of slip at the boundary is adopted in the study. The Effects of Knudsen number , Darcy number , and thermal relaxation time  on the microchannel hydrodynamics and thermal behaviors are investigated using the hyperbolic heat conduction models. It is found that as  increases the slip in the hydrodynamic and thermal boundary condition increases. This slip in the hydrodynamic boundary condition increases as  increases. Also, the slip in the thermal boundary condition increases as  decreases especially the early stage of time.

Control of Thermal Flow in Machine Tools Using Shape Memory Alloys

In this paper the authors propose and verify an approach to control heat flow in machine tool components. Thermal deformations are a main aspect that affects the accuracy of machining. Due to goals of energy efficiency, thermal basic loads should be reduced. This leads to inhomogeneous and time variant temperature profiles. To counteract these negative consequences, material with high melting enthalpy is used as a method for thermal stabilization. The increased thermal capacity slows down the transient thermal behavior. To account for the delayed thermal equilibrium, a control mechanism for thermal flow is introduced. By varying a gap in a heat flow path the thermal resistance of an assembly can be controlled. This mechanism is evaluated in two experimental setups. First to validate the ability to control the thermal resistance and second to prove the possibility of a self-sufficient option based on the selfsensing abilities of thermal shape memory alloys.

Heat Transfer Modeling in Multi-Layer Cookware using Finite Element Method

The high temperature degree and uniform Temperature Distribution (TD) on surface of cookware which contact with food are effective factors for improving cookware application. Additionally, the ability of pan material in retaining the heat and nonreactivity with foods are other significant properties. It is difficult for single material to meet a wide variety of demands such as superior thermal and chemical properties. Multi-Layer Plate (MLP) makes more regular TD. In this study the main objectives are to find the best structure (single or multi-layer) and materials to provide maximum temperature degree and uniform TD up side surface of pan. And also heat retaining of used metals with goal of improving the thermal quality of pan to economize the energy. To achieve this aim were employed Finite Element Method (FEM) for analyzing transient thermal behavior of applied materials. The analysis has been extended for different metals, we achieved the best temperature profile and heat retaining in Copper/ Stainless Steel MLP.