Abstract: In this paper we present modeling and simulation for
physical vapor deposition for metallic bipolar plates. In the models
we discuss the application of different models to simulate the
transport of chemical reactions of the gas species in the gas chamber.
The so called sputter process is an extremely sensitive process to
deposit thin layers to metallic plates. We have taken into account
lower order models to obtain first results with respect to the gas
fluxes and the kinetics in the chamber.
The model equations can be treated analytically in some
circumstances and complicated multi-dimensional models are solved
numerically with a software-package (UG unstructed grids, see [1]).
Because of multi-scaling and multi-physical behavior of the models,
we discuss adapted schemes to solve more accurate in the different
domains and scales. The results are discussed with physical
experiments to give a valid model for the assumed growth of thin
layers.