Unified Gas-Kinetic Scheme for Gas-Particle Flow in Shock-Induced Fluidization of Particles Bed

In this paper, a unified-gas kinetic scheme (UGKS) for the gas-particle flow is constructed. UGKS is a direct modeling method for both continuum and rarefied flow computations. The dynamics of particle and gas are described as rarefied and continuum flow, respectively. Therefore, we use the Bhatnagar-Gross-Krook (BGK) equation for the particle distribution function. For the gas phase, the gas kinetic scheme for Navier-Stokes equation is solved. The momentum transfer between gas and particle is achieved by the acceleration term added to the BGK equation. The new scheme is tested by a 2cm-in-thickness dense bed comprised of glass particles with 1.5mm in diameter, and reasonable agreement is achieved.

Effects of Catalyst Tubes Characteristics on a Steam Reforming Process in Ammonia

The tubes in an Ammonia primary reformer furnace operate close to the limits of materials technology in terms of the stress induced as a result of very high temperatures, combined with large differential pressures across the tube wall. Operation at tube wall temperatures significantly above design can result in a rapid increase in the number of tube failures, since tube life is very sensitive to the absolute operating temperature of the tube. Clearly it is important to measure tube wall temperatures accurately in order to prevent premature tube failure by overheating.. In the present study, the catalyst tubes in an Ammonia primary reformer has been modeled taking into consideration heat, mass and momentum transfer as well as reformer characteristics.. The investigations concern the effects of tube characteristics and superficial tube wall temperatures on of the percentage of heat flux, unconverted methane and production of Hydrogen for various values of steam to carbon ratios. The results show the impact of catalyst tubes length and diameters on the performance of operating parameters in ammonia primary reformers.

Energetic Considerations for Sputter Deposition Processes

Sputter deposition processes, especially for sputtering from metal targets, are well investigated. For practical reasons, i.e. for industrial processes, energetic considerations for sputter deposition are useful in order to optimize the sputtering process. In particular, for substrates at floating conditions it is required to obtain energetic conditions during film growth that enables sufficient dense metal films of good quality. The influence of ion energies, energy density and momentum transfer is thus examined both for sputtering at the target as well as during film growth. Different regimes dominated by ion energy, energy density and momentum transfer were identified by using different plasma sources and by varying power input, pressure and bias voltage.