Abstract: Power plane noise is the most significant source of signal integrity (SI) issues in a high-speed digital design. In this paper, power integrity (PI) analysis of multiple power planes in a power delivery system of a 12-layer high-speed FPGA board is presented. All 10 power planes of HSD board are analyzed separately by using 3D Electromagnetic based PI solver, then the transient simulation is performed on combined PI data of all planes along with voltage regulator modules (VRMs) and 70 current drawing chips to get the board level power noise coupling on different high-speed signals. De-coupling capacitors are placed between power planes and ground to reduce power noise coupling with signals.
Abstract: Today-s Voltage Regulator Modules (VRMs) face increasing design challenges as the number of transistors in microprocessors increases per Moore-s Law. These challenges have recently become even more demanding as microprocessors operate at sub voltage range at significantly high current. This paper presents a new multiphase topology with cell configuration for improved performance in low voltage and high current applications. A lab scale hardware prototype of the new topology was design and constructed. Laboratory tests were performed on the proposed converter and compared with a commercially available VRM. Results from the proposed topology exhibit improved performance compared to the commercially available counterpart.