Abstract: In this study, a three dimensional numerical heat
transfer model has been used to simulate the laser structuring of
polymer substrate material in the Three-Dimensional Molded
Interconnect Device (3D MID) which is used in the advanced multifunctional
applications. A finite element method (FEM) transient
thermal analysis is performed using APDL (ANSYS Parametric
Design Language) provided by ANSYS. In this model, the effect of
surface heat source was modeled with Gaussian distribution, also the
effect of the mixed boundary conditions which consist of convection
and radiation heat transfers have been considered in this analysis. The
model provides a full description of the temperature distribution, as
well as calculates the depth and the width of the groove upon material
removal at different set of laser parameters such as laser power and
laser speed. This study also includes the experimental procedure to
study the effect of laser parameters on the depth and width of the
removal groove metal as verification to the modeled results. Good
agreement between the experimental and the model results is
achieved for a wide range of laser powers. It is found that the quality
of the laser structure process is affected by the laser scan speed and
laser power. For a high laser structured quality, it is suggested to use
laser with high speed and moderate to high laser power.