Design and Fabrication of Stent with Negative Poisson’s Ratio

The negative Poisson’s ratios can be described in terms of models based on the geometry of the system and the way this geometry changes due to applied loads. As the Poisson’s ratio does not depend on scale hence deformation can take place at the nano to macro level the only requirement is the right combination of the geometry. Our thrust in this paper is to combine our knowledge of tailored enhanced mechanical properties of the materials having negative Poisson’s ratio with the micromachining and electrospining technology to develop a novel stent carrying a drug delivery system. Therefore, the objective of this paper includes (i) fabrication of a micromachined metal sheet tailored with structure having negative Poisson’s ratio through rotating solid squares geometry using femtosecond laser ablation; (ii) rolling fabricated structure and welding to make a tubular structure (iii) wrapping it with nanofibers of biocompatible polymer PCL (polycaprolactone) for drug delivery (iv) analysis of the functional and mechanical performance of fabricated structure analytically and experimentally. Further, as the applications concerned, tubular structures have potential in biomedical for example hollow tubes called stents are placed inside to provide mechanical support to a damaged artery or diseased region and to open a blocked esophagus thus allowing feeding capacity and improving quality of life.

Application of Femtosecond Laser pulses for Nanometer Accuracy Profiling of Quartz and Diamond Substrates and for Multi-Layered Targets and Thin-Film Conductors Processing

Research results and optimal parameters investigation of laser cut and profiling of diamond and quartz substrates by femtosecond laser pulses are presented. Profiles 10 μm in width, ~25 μm in depth and several millimeters long were made. Investigation of boundaries quality has been carried out with the use of AFM «Vecco». Possibility of technological formation of profiles and micro-holes in diamond and quartz substrates with nanometer-scale boundaries is shown. Experimental results of multilayer dielectric cover treatment are also presented. Possibility of precise upper layer (thickness of 70–140 nm) removal is demonstrated. Processes of thin metal film (60 nm and 350 nm thick) treatment are considered. Isolation tracks (conductance ~ 10-11 S) 1.6–2.5 μm in width in conductive metal layers are formed.