Abstract: Heat pipes are used to control the thermal problem for
electronic cooling. It is especially difficult to dissipate heat to a heat
sink in an environment in space compared to earth. For solving this
problem, in this study, the Poiseuille (Po) number, which is the main
measure of the performance of a heat pipe, is studied by CFD; then, the
heat pipe performance is verified with experimental results. A heat
pipe is then fabricated for a spatial environment, and an in-house code
is developed. Further, a heat pipe subsystem, which consists of a heat
pipe, MLI (Multi Layer Insulator), SSM (Second Surface Mirror), and
radiator, is tested and correlated with the TMM (Thermal
Mathematical Model) through a commercial code. The correlation
results satisfy the 3K requirement, and the generated thermal model is
verified for application to a spatial environment.