Abstract: At present, a number of modern semiconductor devices based on SiGe alloys have been created in which the latest achievements of high technologies are used. These devices might cause significant changes to networking, computing, and space technology. In the nearest future new materials based on SiGe will be able to restrict the A3B5 and Si technologies and firmly establish themselves in medium frequency electronics. Effective realization of these prospects requires the solution of prediction and controlling of structural state and dynamical physical –mechanical properties of new SiGe materials. Based on these circumstances, a complex investigation of structural defects and structural-sensitive dynamic mechanical characteristics of SiGe alloys under different external impacts (deformation, radiation, thermal cycling) acquires great importance. Internal friction (IF) and shear modulus temperature and amplitude dependences of the monocrystalline boron-doped Si1-xGex(x≤0.05) alloys grown by Czochralski technique is studied in initial and 60Co gamma-irradiated states. In the initial samples, a set of dislocation origin relaxation processes and accompanying modulus defects are revealed in a temperature interval of 400-800 ⁰C. It is shown that after gamma-irradiation intensity of relaxation internal friction in the vicinity of 280 ⁰C increases and simultaneously activation parameters of high temperature relaxation processes reveal clear rising. It is proposed that these changes of dynamical mechanical characteristics might be caused by a decrease of the dislocation mobility in the Cottrell atmosphere enriched by the radiation defects.
Abstract: The impact of boron doping on the internal friction (IF) and shear modulus temperature spectra of Si1-xGex(x≤0,02) monocrsytals has been investigated by reverse torsional pendulum oscillations characteristics testing. At room temperatures, microhardness and indentation modulus of the same specimens have been measured by dynamic ultra microhardness tester. It is shown that boron doping causes two kinds effect: At low boron concentration (~1015 cm-3) significant strengthening is revealed, while at the high boron concentration (~1019 cm-3) strengthening effect and activation characteristics of relaxation origin IF processes are reduced.
Abstract: Si-Ge solid solutions (bulk poly- and mono-crystalline
samples, thin films) are characterized by high perspectives for
application in semiconductor devices, in particular, optoelectronics
and microelectronics. From this point of view, complex studying of
structural state of the defects and structural-sensitive physical
properties of Si-Ge solid solutions depending on the contents of Si
and Ge components is very important. Present work deals with the
investigations of microstructure, microhardness, internal friction and
shear modulus of Si1-xGex(x≤0,02) bulk monocrystals conducted at
room temperature. Si-Ge bulk crystals were obtained by Czochralski
method in [111] crystallographic direction. Investigated
monocrystalline Si-Ge samples are characterized by p-type
conductivity and carriers’ concentration 5.1014-1.1015cm-3.
Microhardness was studied on Dynamic Ultra Micro hardness Tester
DUH-201S with Berkovich indenter. Investigate samples are characterized with 0,5x0,5x(10-15)mm3
sizes, oriented along [111] direction at torsion oscillations ≈1Hz,
multistage changing of internal friction and shear modulus has been
revealed in an interval of strain amplitude of 10-5-5.10-3. Critical
values of strain amplitude have been determined at which hysteretic
changes of inelastic characteristics and microplasticity are observed. The critical strain amplitude and elasticity limit values are also
determined. Dynamic mechanical characteristics decreasing trend is
shown with increasing Ge content in Si-Ge solid solutions. Observed
changes are discussed from the point of view of interaction of various
dislocations with point defects and their complexes in a real structure
of Si-Ge solid solutions.