Specification Requirements for a Combined Dehumidifier/Cooling Panel: A Global Scale Analysis

The use of a radiant cooling solution would enable to lower cooling needs which is of great interest when the demand is initially high (hot climate). But, radiant systems are not naturally compatibles with humid climates since a low-temperature surface leads to condensation risks as soon as the surface temperature is close to or lower than the dew point temperature. A radiant cooling system combined to a dehumidification system would enable to remove humidity for the space, thereby lowering the dew point temperature. The humidity removal needs to be especially effective near the cooled surface. This requirement could be fulfilled by a system using a single desiccant fluid for the removal of both excessive heat and moisture. This task aims at providing an estimation of the specification requirements of such system in terms of cooling power and dehumidification rate required to fulfill comfort issues and to prevent any condensation risk on the cool panel surface. The present paper develops a preliminary study on the specification requirements, performances and behavior of a combined dehumidifier/cooling ceiling panel for different operating conditions. This study has been carried using the TRNSYS software which allows nodal calculations of thermal systems. It consists of the dynamic modeling of heat and vapor balances of a 5m x 3m x 2.7m office space. In a first design estimation, this room is equipped with an ideal heating, cooling, humidification and dehumidification system so that the room temperature is always maintained in between 21◦C and 25◦C with a relative humidity in between 40% and 60%. The room is also equipped with a ventilation system that includes a heat recovery heat exchanger and another heat exchanger connected to a heat sink. Main results show that the system should be designed to meet a cooling power of 42W.m−2 and a desiccant rate of 45 gH2O.h−1. In a second time, a parametric study of comfort issues and system performances has been achieved on a more realistic system (that includes a chilled ceiling) under different operating conditions. It enables an estimation of an acceptable range of operating conditions. This preliminary study is intended to provide useful information for the system design.

Transient Free Laminar Convection in the Vicinity of a Thermal Conductive Vertical Plate

In this paper the influence of a vertical plate’s thermal capacity is numerically investigated in order to evaluate the evolution of the thermal boundary layer structure, as well as the convective heat transfer coefficient and the velocity and temperature profiles. Whereas the heat flux of the heated vertical plate is evaluated under time depending boundary conditions. The main important feature of this problem is the unsteadiness of the physical phenomena. A 2D CFD model is developed with the Ansys Fluent 14.0 environment and is validated using unsteady data obtained for plasterboard studied under a dynamic temperature evolution. All the phenomena produced in the vicinity of the thermal conductive vertical plate (plasterboard) are analyzed and discussed. This work is the first stage of a holistic research on transient free convection that aims, in the future, to study the natural convection in the vicinity of a vertical plate containing Phase Change Materials (PCM).