Transient Hydrodynamic and Thermal Behaviors of Fluid Flow in a Vertical Porous Microchannel under the Effect of Hyperbolic Heat Conduction Model

The transient hydrodynamics and thermal behaviors of fluid flow in open-ended vertical parallel-plate porous microchannel are investigated semi-analytically under the effect of the hyperbolic heat conduction model. The model that combines both the continuum approach and the possibility of slip at the boundary is adopted in the study. The Effects of Knudsen number , Darcy number , and thermal relaxation time  on the microchannel hydrodynamics and thermal behaviors are investigated using the hyperbolic heat conduction models. It is found that as  increases the slip in the hydrodynamic and thermal boundary condition increases. This slip in the hydrodynamic boundary condition increases as  increases. Also, the slip in the thermal boundary condition increases as  decreases especially the early stage of time.

Thermoelastic Waves in Anisotropic Platesusing Normal Mode Expansion Method with Thermal Relaxation Time

Analysis for the generalized thermoelastic Lamb waves, which propagates in anisotropic thin plates in generalized thermoelasticity, is presented employing normal mode expansion method. The displacement and temperature fields are expressed by a summation of the symmetric and antisymmetric thermoelastic modes in the surface thermal stresses and thermal gradient free orthotropic plate, therefore the theory is particularly appropriate for waveform analyses of Lamb waves in thin anisotropic plates. The transient waveforms excited by the thermoelastic expansion are analyzed for an orthotropic thin plate. The obtained results show that the theory provides a quantitative analysis to characterize anisotropic thermoelastic stiffness properties of plates by wave detection. Finally numerical calculations have been presented for a NaF crystal, and the dispersion curves for the lowest modes of the symmetric and antisymmetric vibrations are represented graphically at different values of thermal relaxation time. However, the methods can be used for other materials as well