Thermal Management of Space Power Electronics using TLM-3D

When designing satellites, one of the major issues aside for designing its primary subsystems is to devise its thermal. The thermal management of satellites requires solving different sets of issues with regards to modelling. If the satellite is well conditioned all other parts of the satellite will have higher temperature no matter what. The main issue of thermal modelling for satellite design is really making sure that all the other points of the satellite will be within the temperature limits they are designed. The insertion of power electronics in aerospace technologies is becoming widespread and the modern electronic systems used in space must be reliable and efficient with thermal management unaffected by outer space constraints. Many advanced thermal management techniques have been developed in recent years that have application in high power electronic systems. This paper presents a Three-Dimensional Modal Transmission Line Matrix (3D-TLM) implementation of transient heat flow in space power electronics. In such kind of components heat dissipation and good thermal management are essential. Simulation provides the cheapest tool to investigate all aspects of power handling. The 3DTLM has been successful in modeling heat diffusion problems and has proven to be efficient in terms of stability and complex geometry. The results show a three-dimensional visualisation of self-heating phenomena in the device affected by outer space constraints, and will presents possible approaches for increasing the heat dissipation capability of the power modules.





References:
[1] Ohadi, M., Qi, J., Thermal Management of Harsh-Environment
Electronics. Semiconductor Thermal Measurement and Management
Symposium, 2004
[2] M. Bekhti, MN Sweeting, W. Sun, Alsat-1: The first step into Space for
Algeria, Proceedings of the 53rd IAC and World Space Congress, 2002,
pp.10-19 /Houston, Texas
[3] A. N. Hammoud, E. D. Baumann, I. T. Myers, and E.Overton, "High
Temperature Power Electronics for Space," NASA Technical
Memorandum I043 75, 1991.
[4] Wibawa Chou, "Power Electronics Technology", August 2008,
www.powerelectronics.com.
[5] Mohan, N., Underland, T.M., Robbins, W.P., "Power Electronics:
Converters, Applications, and Design," Book, John Wiley & Sons,
1989.
[6] P.W.Webb and I. A. D. Russell" Application of the TLM Method to
Transient Thermal Simulation of Microwave Power Transistors ", IEEE
Transactions on Electron Devices, Vol.42, N┬░4, 1995.
[7] C.Christopoulos , " The Transmission Line Modelling Method ",
IEEE/OUP Series On Electromagnetic Wave Theory, Oxford University
Press, Chapter 7, pp.167-176, 1995.
[8] R.Hocine, D.Lim S.H.Pulko, A.Boudghene and A.Saidane, "A Three-
Dimensional Transmission Line (TLM) Simulation Method for Thermal
Effect in High Power Insulated Gate Bipolar Transistors", Circuit
World, Emerald Vol. 29, N┬░3, pp 27-32, 2003.
[9] R. Hocine, A. Boudghene and A. Saidane "A Three-Dimensional TLM
Simulation Method for Thermal Effect in High Power Insulate Gate
Bipolar Transistors", Microelectronic Engineering Journal, Vol. 65, pp
293-306, Elsevier Science, 2003.
[10] X. Gui, P. W.Webb, and G. B-Gao, "Use of the three-dimensional TLM
Method in the Thermal Simulation and Design of Semiconductor
Devices", IEEE transactions on electron devices, 39(6), (1992) 1295-
1301.
[11] R. Hocine, S.H.Pulko, A. Boudghene Stambouli, A. Saidane," TLM
Method for Thermal Investigation of IGBT Modules in PWM Mode",
Microelectronic Engineering Journal, Elsevier Science, 2009.
[12] A.E.Kronberg, A.H.Benneker, "Notes on Wave theory in Heat
Conduction: A new boundary condition", International journal Heat
Mass Transfer, pp 127-137, 1998.
[13] M. D.Kankam and M.Elbuluk, "A Survey of Power Electronics
Applications in Aerospace Technologies », 36th Intersociety Energy
Conversion Engineering Conference cosponsored by the ASME, IEEE,
AIChE, ANS, SAE, and AIAA.
[14] Bose, B.K., "Power Electronics: An Emerging Technology," IEEE
Trans. on Ind. Electronics, Vol. 36,
[15] No. 3, Aug. 1989.C.Zweben, "High performance thermal management
materials", Electronics Cooling, Vol 5, N┬░3, pp 36-42, September 1999.
[16] Khatir, Z. and Lefebvre, S. (2001); Seventeenth IEEE SEMI-THERM,
pp 27-34.
[17] Jerry G. Baetz, "Metal Matrix Composites: Their Time Has Come,"
Aerospace America (November 1998), pp. 14-16.