Abstract: Thermal management of electronic components packaged inside an IP65 rated enclosure is of prime importance in industrial applications. Electrical enclosure protects the multiple board configurations such as inverter, power, controller board components, busbars, and various power dissipating components from harsh environments. Industrial environments often experience relatively warm ambient conditions, and the electronic components housed in the enclosure dissipate heat, due to which the enclosures and the components require thermal management as well as reduction of internal ambient temperatures. Design of Experiments based thermal simulation approach with MOSFET arrangement, Heat sink design, Enclosure Volume, Copper and Aluminum Spreader, Power density, and Printed Circuit Board (PCB) type were considered to optimize air temperature inside the IP65 enclosure to ensure conducive operating temperature for controller board and electronic components through the different modes of heat transfer viz. conduction, natural convection and radiation using Ansys ICEPAK. MOSFET’s with the parallel arrangement, IP65 enclosure molded heat sink with rectangular fins on both enclosures, specific enclosure volume to satisfy the power density, Copper spreader to conduct heat to the enclosure, optimized power density value and selecting Aluminum clad PCB which improves the heat transfer were the contributors towards achieving a conducive operating temperature inside the IP-65 rated Motor Inverter enclosure. A reduction of 52 ℃ was achieved in internal ambient temperature inside the IP65 enclosure between baseline and final design parameters, which met the operative temperature requirements of the electronic components inside the IP-65 rated Motor Inverter.
Abstract: This article presents the application of the semi-analytic method (SAM) in the thermal management solution (TMS) of the energy storage system (ESS). The TMS studied in this work is fluid cooling. In fluid cooling, both effective heat conduction and heat convection are indispensable due to the heat transfer from solid to fluid. Correspondingly, an efficient TMS requires a design investigation of the following parameters: fluid inlet temperature, ESS initial temperature, fluid flow rate, working c rate, continuous working time, and materials properties. Their variation induces a change of thermal performance in the battery module, which is usually evaluated by numerical simulation. Compared to complicated computation resources and long computation time in simulation, the SAM is developed in this article to predict the thermal influence within a few seconds. In SAM, a fast prediction model is reckoned by combining numerical simulation with theoretical/empirical equations. The SAM can explore the thermal effect of boundary parameters in both steady-state and transient heat transfer scenarios within a short time. Therefore, the SAM developed in this work can simplify the design cycle of TMS and inspire more possibilities in TMS design.
Abstract: Modern day electric vehicles require compact high torque/power density motors for electric propulsion. This necessitates proper thermal management of the electric motors. The main focus of this paper is to compare the steady state thermal analysis of a conventional 20 kW 8/6 Switched Reluctance Motor (SRM) with that of an Induction Motor and Inset Permanent Magnet (IPM) motor of the same rating. The goal is to develop a proper thermal model of the three types of models for Finite Element Thermal Analysis. JMAG software is used for the development and simulation of the thermal models. The results show that the induction motor is subjected to more heating when used for electric vehicle application constantly, compared to the SRM and IPM.
Abstract: Due to the higher power loss levels in electronic components, the thermal design of PCBs (Printed Circuit Boards) of an assembled device becomes one of the most important quality factors in electronics. Nonetheless, some of leading causes of the microelectronic component failures are due to higher temperatures, the leakages or thermal-mechanical stress, which is a concern, is the reliability of microelectronic packages. This article presents an experimental approach to measure the junction temperature of exposed pad packages. The implemented solution is in a prototype phase, using a temperature-sensitive parameter (TSP) to measure temperature directly on the die, validating the numeric results provided by the Mechanical APDL (Ansys Parametric Design Language) under same conditions. The physical device-under-test is composed by a Thermal Test Chip (TTC-1002) and assembly in a QFN cavity, soldered to a test-board according to JEDEC Standards. Monitoring the voltage drop across a forward-biased diode, is an indirectly method but accurate to obtain the junction temperature of QFN component with an applied power range between 0,3W to 1.5W. The temperature distributions on the PCB test-board and QFN cavity surface were monitored by an infra-red thermal camera (Goby-384) controlled and images processed by the Xeneth software. The article provides a set-up to monitorize in real-time the junction temperature of ICs, namely devices with the exposed pad package (i.e. QFN). Presenting the PCB layout parameters that the designer should use to improve thermal performance, and evaluate the impact of voids in solder interface in the device junction temperature.
Abstract: Quad Flat No-Lead (QFN) packages have become very popular for turners, converters and audio amplifiers, among others applications, needing efficient power dissipation in small footprints. Since semiconductor junction temperature (TJ) is a critical parameter in the product quality. And to ensure that die temperature does not exceed the maximum allowable TJ, a thermal analysis conducted in an earlier development phase is essential to avoid repeated re-designs process with huge losses in cost and time. A simulation tool capable to estimate die temperature of components with QFN package was developed. Allow establish a non-empirical way to define an acceptance criterion for amount of voids in solder interface between its exposed pad and Printed Circuit Board (PCB) to be applied during industrialization process, and evaluate the impact of PCB designs parameters. Targeting PCB layout designer as an end user for the application, a user-friendly interface (GUI) was implemented allowing user to introduce design parameters in a convenient and secure way and hiding all the complexity of finite element simulation process. This cost effective tool turns transparent a simulating process and provides useful outputs after acceptable time, which can be adopted by PCB designers, preventing potential risks during the design stage and make product economically efficient by not oversizing it. This article gathers relevant information related to the design and implementation of the developed tool, presenting a parametric study conducted with it. The simulation tool was experimentally validated using a Thermal-Test-Chip (TTC) in a QFN open-cavity, in order to measure junction temperature (TJ) directly on the die under controlled and knowing conditions. Providing a short overview about standard thermal solutions and impacts in exposed pad packages (i.e. QFN), accurately describe the methods and techniques that the system designer should use to achieve optimum thermal performance, and demonstrate the effect of system-level constraints on the thermal performance of the design.
Abstract: This paper investigates the thermal issue of permanent
magnet synchronous generator which is frequently used in direct
drive gearless small-scale wind turbine applications. Permanent
Magnet Synchronous Generator (PMSG) is designed with 2.5 kW
continuous and 6 kW peak power. Then considering generator
geometry, mechanical design of wind turbine is performed. Thermal
analysis and optimization is carried out considering all wind turbine
components to reach realistic results. This issue is extremely
important in research and development (R&D) process for wind
turbine applications.
Abstract: The development of electric vehicle batteries have
resulted in very high energy density lithium-ion batteries. However,
this progress is accompanied by the risk of thermal runaway, which
can result in serious accidents. Heat pipes are heat exchangers that
are suitable to be applied in electric vehicle battery thermal
management for their lightweight, compact size and do not require
external power supply. This paper aims to examine experimentally a
Flat Plate Loop Heat Pipe (FPLHP) performance as a heat exchanger
in thermal management system of lithium-ion battery for electric
vehicle application. The heat generation of the battery was simulated
using a cartridge heater. Stainless steel screen mesh was used as the
capillary wick. Distilled water, alcohol and acetone were used as
working fluids with a filling ratio of 60%. It was found that acetone
gives the best performance that produces thermal resistance of 0.22
W/°C with 50°C evaporator temperature at heat flux load of 1.61
W/cm2.
Abstract: In recent years Li-Ion batteries getting more attention among the Electrical Vehicles (EV) and Hybrid Electrical Vehicles (HEV) energy storage. Li-Ion has shown extended power density and light weight compared to other batteries readily available in the market. One of the major drawbacks in Li-Ion batteries is their sensitivity to the temperature. If the working temperature is beyond the limit, that could affect seriously on the durability and performance of Li-Ion battery. Thus Battery Thermal Management (BTM) is the most essential in adapting Li-Ion battery to the EVs and HEVs.
Abstract: When designing satellites, one of the major issues aside for designing its primary subsystems is to devise its thermal. The thermal management of satellites requires solving different sets of issues with regards to modelling. If the satellite is well conditioned all other parts of the satellite will have higher temperature no matter what. The main issue of thermal modelling for satellite design is really making sure that all the other points of the satellite will be within the temperature limits they are designed. The insertion of power electronics in aerospace technologies is becoming widespread and the modern electronic systems used in space must be reliable and efficient with thermal management unaffected by outer space constraints. Many advanced thermal management techniques have been developed in recent years that have application in high power electronic systems. This paper presents a Three-Dimensional Modal Transmission Line Matrix (3D-TLM) implementation of transient heat flow in space power electronics. In such kind of components heat dissipation and good thermal management are essential. Simulation provides the cheapest tool to investigate all aspects of power handling. The 3DTLM has been successful in modeling heat diffusion problems and has proven to be efficient in terms of stability and complex geometry. The results show a three-dimensional visualisation of self-heating phenomena in the device affected by outer space constraints, and will presents possible approaches for increasing the heat dissipation capability of the power modules.
Abstract: To study the impact of the inter-module ventilation (IMV) on the space station, the Computational Fluid Dynamic (CFD) model under the influence of IMV, the mathematical model, boundary conditions and calculation method are established and determined to analyze the influence of IMV on cabin air flow characteristics and velocity distribution firstly; and then an integrated overall thermal mathematical model of the space station is used to consider the impact of IMV on thermal management. The results show that: the IMV has a significant influence on the cabin air flow, the flowrate of IMV within a certain range can effectively improve the air velocity distribution in cabin, if too much may lead to its deterioration; IMV can affect the heat deployment of the different modules in space station, thus affecting its thermal management, the use of IMV can effectively maintain the temperature levels of the different modules and help the space station to dissipate the waste heat.