Abstract: An experimental study is realized in order to verify the
Mini Heat Pipe (MHP) concept for cooling high power dissipation
electronic components and determines the potential advantages of
constructing mini channels as an integrated part of a flat heat pipe. A
Flat Mini Heat Pipe (FMHP) prototype including a capillary structure
composed of parallel rectangular microchannels is manufactured and
a filling apparatus is developed in order to charge the FMHP. The
heat transfer improvement obtained by comparing the heat pipe
thermal resistance to the heat conduction thermal resistance of a
copper plate having the same dimensions as the tested FMHP is
demonstrated for different heat input flux rates. Moreover, the heat
transfer in the evaporator and condenser sections are analyzed, and
heat transfer laws are proposed. In the theoretical part of this work, a
detailed mathematical model of a FMHP with axial microchannels is
developed in which the fluid flow is considered along with the heat
and mass transfer processes during evaporation and condensation.
The model is based on the equations for the mass, momentum and
energy conservation, which are written for the evaporator, adiabatic,
and condenser zones. The model, which permits to simulate several
shapes of microchannels, can predict the maximum heat transfer
capacity of FMHP, the optimal fluid mass, and the flow and thermal
parameters along the FMHP. The comparison between experimental
and model results shows the good ability of the numerical model to
predict the axial temperature distribution along the FMHP.
Abstract: When designing satellites, one of the major issues aside for designing its primary subsystems is to devise its thermal. The thermal management of satellites requires solving different sets of issues with regards to modelling. If the satellite is well conditioned all other parts of the satellite will have higher temperature no matter what. The main issue of thermal modelling for satellite design is really making sure that all the other points of the satellite will be within the temperature limits they are designed. The insertion of power electronics in aerospace technologies is becoming widespread and the modern electronic systems used in space must be reliable and efficient with thermal management unaffected by outer space constraints. Many advanced thermal management techniques have been developed in recent years that have application in high power electronic systems. This paper presents a Three-Dimensional Modal Transmission Line Matrix (3D-TLM) implementation of transient heat flow in space power electronics. In such kind of components heat dissipation and good thermal management are essential. Simulation provides the cheapest tool to investigate all aspects of power handling. The 3DTLM has been successful in modeling heat diffusion problems and has proven to be efficient in terms of stability and complex geometry. The results show a three-dimensional visualisation of self-heating phenomena in the device affected by outer space constraints, and will presents possible approaches for increasing the heat dissipation capability of the power modules.