Combining Molecular Statics with Heat Transfer Finite Difference Method for Analysis of Nanoscale Orthogonal Cutting of Single-Crystal Silicon Temperature Field
This paper uses quasi-steady molecular statics model
and diamond tool to carry out simulation temperature rise of nanoscale
orthogonal cutting single-crystal silicon. It further qualitatively
analyzes temperature field of silicon workpiece without considering
heat transfer and considering heat transfer. This paper supposes that
the temperature rise of workpiece is mainly caused by two heat sources:
plastic deformation heat and friction heat. Then, this paper develops a
theoretical model about production of the plastic deformation heat and
friction heat during nanoscale orthogonal cutting. After the increased
temperature produced by these two heat sources are added up, the
acquired total temperature rise at each atom of the workpiece is
substituted in heat transfer finite difference equation to carry out heat
transfer and calculates the temperature field in each step and makes
related analysis.
<p>[1] S. Shimada, “Molecular Dynamics Analysis as Compared with
Experimental Results of Micromachining,” Ann. CIRP, vol.41, no. 1,
pp.117-120, 1990.
[2] T. H. C. Childs and K. Maewaka, “Computer-aided Simulation and
Experimental Studies of Chip Flow and Tool Wear in the Turning of Flow
Alloy Steels by Cemented Carbide Tools” ,Wear, vol. 139, no.2,
pp.235-250, 1990.
[3] J. Belak, and I. F. Stowers, “A Molecular Dynamics Model of the
Orthogonal Cutting Process,” Proc. Am. Soc., Precision Eng., pp.76-79,
1990.
[4] Q. X. Pei, C. Lu, F. Z. Fang and H. Wu, “Nanometric Cutting of Copper:
A Molecular Dynamics Study,” Computational Materials Science,
pp.434-441, 2006.
[5] T. Inamura, N. Takezawa and, Y. Kumaki, “Mechanics and Energy
Dissipation in Nanoscale Cutting”, Annals. CIRP, vol.42, no.1,
pp.79-82,1993.
[6] M. B. Cai, X. P. Li, M. Rahman, “ Study of the Mechanism of Nanoscale
Ductile Mode Cutting of Silicon Using Molecular Dynamics
Simulation” ,International Journal of Machine Tool & Manufacture
pp.75-80, 2007.
[7] S. Shimada, “Molecular Dynamics Analysis of Nanometric Cutting
Process”, Ann. CIRP, vol.29, no.283, pp.6, 1995.
[8] H. Tanaka1, S. Shimada, “Requirements for Ductile-mode Machining
Based on Deformation Analysis of Mono-crystalline Silicon by
Molecular Dynamics Simulation”, Annals of the CIRP, vol.56, p53-56,
2007.
[9] Q. H. Tang, “MD Simulation of Dislocation Mobility During Cutting with
Diamond Tip on Silicon”, Materials Science in Semiconductor
Processing, vol.10 , pp.270-275, 2007.
[10] M. B. Cai, X. P. Li, M. Rahman, “Study of the Temperature and Stress in
Nanoscale Ductile Mode Cutting of Silicon Using Molecular Dynamics
Simulation”, Journal of Materials Processing Technology, 192–193
pp.607–612, 2007.
[11] L. A. Girifalco and V. G. Weizer, “Application of the Morse Potential
Function to Cubic Metals,” Phys. Rev., vol. 114, pp. 687-690, 1959.
[12] J. H. L. The and R. F. Scrutton, “A Theoretical Analysis of Temperature
Distributions in the Hight Speed Forging of Hot Steel, “ Trans. ASME, J.
Enging. Materials and Technology, vol.114, pp.218-226, 1992.
[13] Z. C. Lin, and J. C. Huang , “3D Nano-scale Cutting Model for Nickel
Material,” Journal of Materials Processing Technology, pp.27–36 , 2007.
[14] M. F. Aly, E. Ng, , S. C. Veldhuis, and M. A. Elbestawi, , “Prediction of
Cutting Forces in the Micro-machining of Silicon Using a Hybrid
Molecular Dynamic-finite Element Analysis Force Model,” International
Journal of Machine Tool & Manufacture, pp.1729-1737, 2007.
[15] Z. C. Lin, W. C.Pan, and S. P. Lo, “A Study of Orthogonal Cutting with
Tool Flank Wear and Sticking Behavior on the Chip-Tool Interface,”
Journal of Materials Processing Technology, vol.52, no.2-4, pp.524-538,
1995.</p>
<p>[1] S. Shimada, “Molecular Dynamics Analysis as Compared with
Experimental Results of Micromachining,” Ann. CIRP, vol.41, no. 1,
pp.117-120, 1990.
[2] T. H. C. Childs and K. Maewaka, “Computer-aided Simulation and
Experimental Studies of Chip Flow and Tool Wear in the Turning of Flow
Alloy Steels by Cemented Carbide Tools” ,Wear, vol. 139, no.2,
pp.235-250, 1990.
[3] J. Belak, and I. F. Stowers, “A Molecular Dynamics Model of the
Orthogonal Cutting Process,” Proc. Am. Soc., Precision Eng., pp.76-79,
1990.
[4] Q. X. Pei, C. Lu, F. Z. Fang and H. Wu, “Nanometric Cutting of Copper:
A Molecular Dynamics Study,” Computational Materials Science,
pp.434-441, 2006.
[5] T. Inamura, N. Takezawa and, Y. Kumaki, “Mechanics and Energy
Dissipation in Nanoscale Cutting”, Annals. CIRP, vol.42, no.1,
pp.79-82,1993.
[6] M. B. Cai, X. P. Li, M. Rahman, “ Study of the Mechanism of Nanoscale
Ductile Mode Cutting of Silicon Using Molecular Dynamics
Simulation” ,International Journal of Machine Tool & Manufacture
pp.75-80, 2007.
[7] S. Shimada, “Molecular Dynamics Analysis of Nanometric Cutting
Process”, Ann. CIRP, vol.29, no.283, pp.6, 1995.
[8] H. Tanaka1, S. Shimada, “Requirements for Ductile-mode Machining
Based on Deformation Analysis of Mono-crystalline Silicon by
Molecular Dynamics Simulation”, Annals of the CIRP, vol.56, p53-56,
2007.
[9] Q. H. Tang, “MD Simulation of Dislocation Mobility During Cutting with
Diamond Tip on Silicon”, Materials Science in Semiconductor
Processing, vol.10 , pp.270-275, 2007.
[10] M. B. Cai, X. P. Li, M. Rahman, “Study of the Temperature and Stress in
Nanoscale Ductile Mode Cutting of Silicon Using Molecular Dynamics
Simulation”, Journal of Materials Processing Technology, 192–193
pp.607–612, 2007.
[11] L. A. Girifalco and V. G. Weizer, “Application of the Morse Potential
Function to Cubic Metals,” Phys. Rev., vol. 114, pp. 687-690, 1959.
[12] J. H. L. The and R. F. Scrutton, “A Theoretical Analysis of Temperature
Distributions in the Hight Speed Forging of Hot Steel, “ Trans. ASME, J.
Enging. Materials and Technology, vol.114, pp.218-226, 1992.
[13] Z. C. Lin, and J. C. Huang , “3D Nano-scale Cutting Model for Nickel
Material,” Journal of Materials Processing Technology, pp.27–36 , 2007.
[14] M. F. Aly, E. Ng, , S. C. Veldhuis, and M. A. Elbestawi, , “Prediction of
Cutting Forces in the Micro-machining of Silicon Using a Hybrid
Molecular Dynamic-finite Element Analysis Force Model,” International
Journal of Machine Tool & Manufacture, pp.1729-1737, 2007.
[15] Z. C. Lin, W. C.Pan, and S. P. Lo, “A Study of Orthogonal Cutting with
Tool Flank Wear and Sticking Behavior on the Chip-Tool Interface,”
Journal of Materials Processing Technology, vol.52, no.2-4, pp.524-538,
1995.</p>
@article{"International Journal of Mechanical, Industrial and Aerospace Sciences:53505", author = "Zone-Ching Lin and Meng-Hua Lin and Ying-Chih Hsu", title = "Combining Molecular Statics with Heat Transfer Finite Difference Method for Analysis of Nanoscale Orthogonal Cutting of Single-Crystal Silicon Temperature Field", abstract = "This paper uses quasi-steady molecular statics model
and diamond tool to carry out simulation temperature rise of nanoscale
orthogonal cutting single-crystal silicon. It further qualitatively
analyzes temperature field of silicon workpiece without considering
heat transfer and considering heat transfer. This paper supposes that
the temperature rise of workpiece is mainly caused by two heat sources:
plastic deformation heat and friction heat. Then, this paper develops a
theoretical model about production of the plastic deformation heat and
friction heat during nanoscale orthogonal cutting. After the increased
temperature produced by these two heat sources are added up, the
acquired total temperature rise at each atom of the workpiece is
substituted in heat transfer finite difference equation to carry out heat
transfer and calculates the temperature field in each step and makes
related analysis.
", keywords = "Quasi-steady molecular statics, Nanoscale orthogonal
cutting, Finite difference, Temperature.", volume = "7", number = "7", pages = "1426-10", }
