Packaging and Interconnection Technologies of Power Devices, Challenges and Future Trends
Standard packaging and interconnection technologies
of power devices have difficulties meeting the increasing thermal
demands of new application fields of power electronics devices.
Main restrictions are the decreasing reliability of bond-wires and
solder layers with increasing junction temperature. In the last few
years intensive efforts have been invested in developing new
packaging and interconnection solutions which may open a path to
future application of power devices. In this paper, the main failure
mechanisms of power devices are described and principle of new
packaging and interconnection concepts and their power cycling
reliability are presented.
[1] M. HELD; P. JACOB; G. NICOLETTI; P. SCACCO; M.H. POECH:
Fast Power Cycling Test for IGBT Modules in Traction Application.
Proc. Power Conversion and Drive Systems 1997, pp.425-430.
[2] AUERBACH; SCHWARZBAUER; LAMMERS; LENNIGER:
Zuverlässigkeit von Al-Dickdraht-Bondverbindungen. ISHM Konferenz,
M├╝nchen 1996.
[3] M. RODRIGUES; N. SHAMMAS; N. PLUMPTON; D. NEWCOMBE;
D. CREES: Static and Dynamic Finite Element Modelling of Thermal
Fatigue Effects in IGBT Modules. Microelectronics Reliability 40(2000),
pp. 455-463. B. Smith, "An approach to graphs of linear forms
(Unpublished work style)," unpublished.
[4] M.-H. POECH: Sch├ñdigungsmechanismen in Lötverbindungen bei
erhöhter Temperatur. VTE 14 (2002), Heft1, S. 12-18.
[5] H. SCHWARZBAUER; R. KUHNERT: Novel Large Area Joining
Technique for Improved Power Device Performance. IEEE Transactions
on Industry Applications, Vol.27, pp. 93-95, 1991.
[6] C. PANZER; T. PASSE; T. STOLZE; Z. LIANG: Clamping Technique
improves IGBT Installation. PET magazine, Oct. Issue 56(2002).
[1] M. HELD; P. JACOB; G. NICOLETTI; P. SCACCO; M.H. POECH:
Fast Power Cycling Test for IGBT Modules in Traction Application.
Proc. Power Conversion and Drive Systems 1997, pp.425-430.
[2] AUERBACH; SCHWARZBAUER; LAMMERS; LENNIGER:
Zuverlässigkeit von Al-Dickdraht-Bondverbindungen. ISHM Konferenz,
M├╝nchen 1996.
[3] M. RODRIGUES; N. SHAMMAS; N. PLUMPTON; D. NEWCOMBE;
D. CREES: Static and Dynamic Finite Element Modelling of Thermal
Fatigue Effects in IGBT Modules. Microelectronics Reliability 40(2000),
pp. 455-463. B. Smith, "An approach to graphs of linear forms
(Unpublished work style)," unpublished.
[4] M.-H. POECH: Sch├ñdigungsmechanismen in Lötverbindungen bei
erhöhter Temperatur. VTE 14 (2002), Heft1, S. 12-18.
[5] H. SCHWARZBAUER; R. KUHNERT: Novel Large Area Joining
Technique for Improved Power Device Performance. IEEE Transactions
on Industry Applications, Vol.27, pp. 93-95, 1991.
[6] C. PANZER; T. PASSE; T. STOLZE; Z. LIANG: Clamping Technique
improves IGBT Installation. PET magazine, Oct. Issue 56(2002).
@article{"International Journal of Electrical, Electronic and Communication Sciences:52066", author = "Raed A. Amro", title = "Packaging and Interconnection Technologies of Power Devices, Challenges and Future Trends", abstract = "Standard packaging and interconnection technologies
of power devices have difficulties meeting the increasing thermal
demands of new application fields of power electronics devices.
Main restrictions are the decreasing reliability of bond-wires and
solder layers with increasing junction temperature. In the last few
years intensive efforts have been invested in developing new
packaging and interconnection solutions which may open a path to
future application of power devices. In this paper, the main failure
mechanisms of power devices are described and principle of new
packaging and interconnection concepts and their power cycling
reliability are presented.", keywords = "Power electronics devices, Reliability, Power
Cycling, Low-temperature joining technique (LTJT)", volume = "3", number = "1", pages = "20-4", }