Preparation of Metallic Copper Nanoparticles by Reduction of Copper Ions in Aqueous Solution and Their Metal-Metal Bonding Properties

This paper describes a method for preparing metallic Cu nanoparticles in aqueous solution, and a metal-metal bonding technique using the Cu particles.Preparation of the Cu particle colloid solution was performed in water at room temperature in air using a copper source (0.01 M Cu(NO₃)₂), a reducing reagent (0.2 - 1.0 M hydrazine), and stabilizers (0.5×10^-3 M citric acid and 5.0×10^-3 M cetyltrimethylammonium bromide). The metallic Cu nanoparticles with sizes of ca. 60nm were prepared at all the hydrazine concentrations examined. A stage and a plate of metallic Cu were successfully bonded under annealing at 400^oC and pressurizing at 1.2 MPa for 5min in H₂ gas with help of the metallic Cu particles. A shear strength required for separating the bonded Cu substrates reached the maximum value at a hydrazine concentration of 0.8M, and it decreased beyond the concentration. Consequently, the largest shear strength of 22.9 MPa was achieved at the 0.8 M hydrazine concentration.

• Y. Kobayashi
• T. Shirochi
• Y. Yasuda
• T. Morita

• Aqueous solution
• Bonding
• Colloid
• Copper
• Nanoparticle.

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