Effect of Surface-Modification of Indium Tin Oxide Particles on Their Electrical Conductivity

The present work reports an effect of surface- modification of indium tin oxide (ITO) particles with chemicals on their electronic conductivity properties. Examined chemicals were polyvinyl alcohol (nonionic polymer), poly(diallyl dimethyl ammonium chloride) (cationic polymer), poly(sodium 4-styrene-sulfonate) (anionic polymer), (2-aminopropyl) trimethoxy silane (APMS) (silane coupling agent with amino group), and (3-mercaptopropyl) trimethoxy silane (MPS) (silane coupling agent with thiol group). For all the examined chemicals, volume resistivities of surface-modified ITO particles did not increase much when they were aged in air at 80 oC, compared to a volume resistivity of un-surface-modified ITO particles. Increases in volume resistivities of ITO particles surface-modified with the silane coupling agents were smaller than those with the polymers, since hydrolysis of the silane coupling agents and condensation of generated silanol and OH groups on ITO particles took place to provide efficient immobilization of them on particles. The APMS gave an increase in volume resistivity smaller than the MPS, since a larger solubility in water of APMS providing a larger amount of APMS immobilized on particles.

Preparation of Metallic Copper Nanoparticles by Reduction of Copper Ions in Aqueous Solution and Their Metal-Metal Bonding Properties

This paper describes a method for preparing metallic Cu nanoparticles in aqueous solution, and a metal-metal bonding technique using the Cu particles.Preparation of the Cu particle colloid solution was performed in water at room temperature in air using a copper source (0.01 M Cu(NO3)2), a reducing reagent (0.2 - 1.0 M hydrazine), and stabilizers (0.5×10-3 M citric acid and 5.0×10-3 M cetyltrimethylammonium bromide). The metallic Cu nanoparticles with sizes of ca. 60nm were prepared at all the hydrazine concentrations examined. A stage and a plate of metallic Cu were successfully bonded under annealing at 400oC and pressurizing at 1.2 MPa for 5min in H2 gas with help of the metallic Cu particles. A shear strength required for separating the bonded Cu substrates reached the maximum value at a hydrazine concentration of 0.8M, and it decreased beyond the concentration. Consequently, the largest shear strength of 22.9 MPa was achieved at the 0.8 M hydrazine concentration.