Methods for Manufacture of Corrugated Wire Mesh Laminates
Corrugated wire mesh laminates (CWML) are a class
of engineered open cell structures that have potential for applications
in many areas including aerospace and biomedical engineering. Two
different methods of fabricating corrugated wire mesh laminates from
stainless steel, one using a high temperature Lithobraze alloy and the
other using a low temperature Eutectic solder for joining the
corrugated wire meshes are described herein. Their implementation is
demonstrated by manufacturing CWML samples of 304 and 316
stainless steel (SST). It is seen that due to the facility of employing
wire meshes of different densities and wire diameters, it is possible to
create CWML laminates with a wide range of effective densities. The
fabricated laminates are tested under uniaxial compression. The
variation of the compressive yield strength with relative density of the
CWML is compared to the theory developed by Gibson and Ashby for
open cell structures [22]. It is shown that the compressive strength of
the corrugated wire mesh laminates can be described using the same
equations by using an appropriate value for the linear coefficient in the
Gibson-Ashby model.
[1] Ho-Sung Lee, Jong-Hoon Yoon, Yeong-Moo Yi, Oxidation behavior of
Titanium alloy under diffusion bonding, Thermochimica Acta 455, 2007,
pp.105-108
[2] TWI, UK (http://www.twi.co.uk/content/kssbd003.html)
[3] Thomas Studnitzky, Rainer Schmid-fetzer,, Phase formation and
diffusion soldering in Pt/In, Pd/In, and Zr/Sn thin-film systems, Journal
of electronic materials, vol.32, No.2., 2003, pp. 70-80
[4] G.He, M.Hagiwara, Ti alloy design strategy for biomedical applications,
Materials Science and Engineering C, 26, 2006, pp. 14-19
[5] G.He, M.Hagiwara, Ti-Cu-Ni (Fe,Cr,Co)-Sn-Ta(Nb) alloys with
potential for biomedical applications, Materials Transactions, vol.45,
No.4, 2004, pp.1120-1123
[6] G.A. Lopez, Kinetic behaviour of diffusion-soldered Ni/Al/Ni
interconnections, Materials Chemistry and Physics 78, 2002, pp.459-463
[7] M. J. Kim, R. W. Carpenter, M. J. Cox, J. Xu, Controlled planar
interface synthesis by ultrahigh vacuum diffusion bonding/deposition,
J.Mater.Res.,Vol.15,No.4,Apr 2000, pp.1008-1016
[8] M.Eroglu, T.I.Khan, N.Orhan, Diffusion bonding between Ti-6Al-4V
alloy and microduplex stainless steel with copper interlayer, Material
Science and Technology, vol.18, Jan 2002, pp.68-72
[9] Carles L. Bauer, Metal-joining methods, Annu.Rev.Mater.Sci., 6, 1976,
pp. 361-387
[10]E.Lugscheider, K.Bobzin, M.K.Lake, Deposition of solder for
micro-joining on M.E.M.S. components by means of magnetron
sputtering, Surface and Coatings Technology, 142-144, 2001,
pp.813-816
[11]W.D.MacDonald,T.W.Eagar, Transient liquid phase bonding,
Annu.Rew.Mater.Sci. 1992, 22:23-46
[12]Mitsuo Niinomi, Recent research and development in Titanium alloys for
biomedical applications and healthcare goods, Science and Technology
of Advanced Materials 4, 2003, pp. 445-454
[13]E.Lugscheider, S.Ferrara, H.Janssen, A.Reimann,B.Wildpanner,
Progress and developments in the field of materials for transient liquid
phase bonding and active soldering process, Micro system technologies
10, 2004, pp.233-236
[14]C. Kanchanomai and Y. Mutoh, Effect of temperature on isothermal low
cycle fatigue properties of Sn-Ag eutectic solder, Materials Science
andEngeering A 381, 2004, pp. 113-120
[15]John Chisholm, Method of making a crimped wire mesh heat
exchanger/sink, U.S.Patent, No. 4,843,693, July 4, 1989
[16]David Sypeck, Hayen N.G. Wadley, Multifunctional periodic cellular
solids and the method of making same, U.S. Patent,
No.US2004/0154252A1, Aug.12, 2004
[17]D.J. Sypeck, H.N.G. Wadley, Multifunctional microtruss laminates:
Textile synthesis and properties, J. Mater. Res, Vol. 16, No. 3, March
2001, pp 890-897
[18]M.F. Ashby, A.Evans, N.A.Fleck, L.J.Gibson, J.W.Hutchinson,
H.N.G.Wadly, Metal foams-a design guide, Butterworth-Heinemann,
Elsevier, 2000
[19]Lucas-Milhaupt, Inc., VTG/High purity silver, gold, palladium, accessed
May 20, 2004.
(http://www.lucasmilhaupt.com/htmdocs/brazing_products/brazing_fill
er_metals/high_purity.html)
[20]Choi, J.H., Fabrication and compressive yield strength of open cell
corrugated cellular solids, master thesis, Embry-Riddle Aeronautical
University, Daytona Beach, Florida, U.S.A., 2005
[21]Eutectic Australia Pty Ltd, Product data guide, 2006
[22]L. J. Gibson, M. F. Ashby (1997). Cellular solids Structure and
Properties, 2nd ed., United Kingdom : Cambridge University Press,
Cambridge
[23]Ashby. M.F., Materials Selection in Mechanical Design, Pergamon
Press, UK, 1992
[24]Fleck, N.A. and Khang, K.J. and Ashby, M.F., The cyclic properties of
engineering materials, Acta Metallurgica et Materialia, 42 (2), 1994,
pp. 365-381. ISSN 0956-7151
[25]Mills, N.J. and Gilchrist, A., The Effectiveness of Foams in Bicycle and
Motorcycle Helmets, Accid. Anal. and Preview, 23, pp153-163, 1991
[1] Ho-Sung Lee, Jong-Hoon Yoon, Yeong-Moo Yi, Oxidation behavior of
Titanium alloy under diffusion bonding, Thermochimica Acta 455, 2007,
pp.105-108
[2] TWI, UK (http://www.twi.co.uk/content/kssbd003.html)
[3] Thomas Studnitzky, Rainer Schmid-fetzer,, Phase formation and
diffusion soldering in Pt/In, Pd/In, and Zr/Sn thin-film systems, Journal
of electronic materials, vol.32, No.2., 2003, pp. 70-80
[4] G.He, M.Hagiwara, Ti alloy design strategy for biomedical applications,
Materials Science and Engineering C, 26, 2006, pp. 14-19
[5] G.He, M.Hagiwara, Ti-Cu-Ni (Fe,Cr,Co)-Sn-Ta(Nb) alloys with
potential for biomedical applications, Materials Transactions, vol.45,
No.4, 2004, pp.1120-1123
[6] G.A. Lopez, Kinetic behaviour of diffusion-soldered Ni/Al/Ni
interconnections, Materials Chemistry and Physics 78, 2002, pp.459-463
[7] M. J. Kim, R. W. Carpenter, M. J. Cox, J. Xu, Controlled planar
interface synthesis by ultrahigh vacuum diffusion bonding/deposition,
J.Mater.Res.,Vol.15,No.4,Apr 2000, pp.1008-1016
[8] M.Eroglu, T.I.Khan, N.Orhan, Diffusion bonding between Ti-6Al-4V
alloy and microduplex stainless steel with copper interlayer, Material
Science and Technology, vol.18, Jan 2002, pp.68-72
[9] Carles L. Bauer, Metal-joining methods, Annu.Rev.Mater.Sci., 6, 1976,
pp. 361-387
[10]E.Lugscheider, K.Bobzin, M.K.Lake, Deposition of solder for
micro-joining on M.E.M.S. components by means of magnetron
sputtering, Surface and Coatings Technology, 142-144, 2001,
pp.813-816
[11]W.D.MacDonald,T.W.Eagar, Transient liquid phase bonding,
Annu.Rew.Mater.Sci. 1992, 22:23-46
[12]Mitsuo Niinomi, Recent research and development in Titanium alloys for
biomedical applications and healthcare goods, Science and Technology
of Advanced Materials 4, 2003, pp. 445-454
[13]E.Lugscheider, S.Ferrara, H.Janssen, A.Reimann,B.Wildpanner,
Progress and developments in the field of materials for transient liquid
phase bonding and active soldering process, Micro system technologies
10, 2004, pp.233-236
[14]C. Kanchanomai and Y. Mutoh, Effect of temperature on isothermal low
cycle fatigue properties of Sn-Ag eutectic solder, Materials Science
andEngeering A 381, 2004, pp. 113-120
[15]John Chisholm, Method of making a crimped wire mesh heat
exchanger/sink, U.S.Patent, No. 4,843,693, July 4, 1989
[16]David Sypeck, Hayen N.G. Wadley, Multifunctional periodic cellular
solids and the method of making same, U.S. Patent,
No.US2004/0154252A1, Aug.12, 2004
[17]D.J. Sypeck, H.N.G. Wadley, Multifunctional microtruss laminates:
Textile synthesis and properties, J. Mater. Res, Vol. 16, No. 3, March
2001, pp 890-897
[18]M.F. Ashby, A.Evans, N.A.Fleck, L.J.Gibson, J.W.Hutchinson,
H.N.G.Wadly, Metal foams-a design guide, Butterworth-Heinemann,
Elsevier, 2000
[19]Lucas-Milhaupt, Inc., VTG/High purity silver, gold, palladium, accessed
May 20, 2004.
(http://www.lucasmilhaupt.com/htmdocs/brazing_products/brazing_fill
er_metals/high_purity.html)
[20]Choi, J.H., Fabrication and compressive yield strength of open cell
corrugated cellular solids, master thesis, Embry-Riddle Aeronautical
University, Daytona Beach, Florida, U.S.A., 2005
[21]Eutectic Australia Pty Ltd, Product data guide, 2006
[22]L. J. Gibson, M. F. Ashby (1997). Cellular solids Structure and
Properties, 2nd ed., United Kingdom : Cambridge University Press,
Cambridge
[23]Ashby. M.F., Materials Selection in Mechanical Design, Pergamon
Press, UK, 1992
[24]Fleck, N.A. and Khang, K.J. and Ashby, M.F., The cyclic properties of
engineering materials, Acta Metallurgica et Materialia, 42 (2), 1994,
pp. 365-381. ISSN 0956-7151
[25]Mills, N.J. and Gilchrist, A., The Effectiveness of Foams in Bicycle and
Motorcycle Helmets, Accid. Anal. and Preview, 23, pp153-163, 1991
@article{"International Journal of Mechanical, Industrial and Aerospace Sciences:63077", author = "Jeongho Choi and Krishna Shankar and Alan Fien and Andrew Neely", title = "Methods for Manufacture of Corrugated Wire Mesh Laminates", abstract = "Corrugated wire mesh laminates (CWML) are a class
of engineered open cell structures that have potential for applications
in many areas including aerospace and biomedical engineering. Two
different methods of fabricating corrugated wire mesh laminates from
stainless steel, one using a high temperature Lithobraze alloy and the
other using a low temperature Eutectic solder for joining the
corrugated wire meshes are described herein. Their implementation is
demonstrated by manufacturing CWML samples of 304 and 316
stainless steel (SST). It is seen that due to the facility of employing
wire meshes of different densities and wire diameters, it is possible to
create CWML laminates with a wide range of effective densities. The
fabricated laminates are tested under uniaxial compression. The
variation of the compressive yield strength with relative density of the
CWML is compared to the theory developed by Gibson and Ashby for
open cell structures [22]. It is shown that the compressive strength of
the corrugated wire mesh laminates can be described using the same
equations by using an appropriate value for the linear coefficient in the
Gibson-Ashby model.", keywords = "cellular solids, corrugation, foam, open-cell, metal
mesh, laminate, stainless steel", volume = "3", number = "5", pages = "654-7", }
