Integration of CMOS Biosensor into a Polymeric Lab-on-a-Chip System
We present an integration approach of a CMOS biosensor into a polymer based microfluidic environment suitable for mass production. It consists of a wafer-level-package for the silicon die and laser bonding process promoted by an intermediate hot melt foil to attach the sensor package to the microfluidic chip, without the need for dispensing of glues or underfiller. A very good condition of the sensing area was obtained after introducing a protection layer during packaging. A microfluidic flow cell was fabricated and shown to withstand pressures up to Δp = 780 kPa without leakage. The employed biosensors were electrically characterized in a dry environment.
<p>[1] D. Mark, S. Häberle, G. Roth, F. von Stetten and R. Zengerle, “Microfluidic lab-on-a-chip platforms: Requirements, characteristics and applications”, Chem. Soc. Rev., vol. 39, pp. 1153-1182, 2010. [2] X. Weng, H. Jiang and D. Li, “Microfluidic DNA hybridization assays”, Microfluid. Nanofluid., vol. 11, pp. 367-383, 2011. [3] H. Becker and L. E. Locascio, “Polymer microfluidic devices”, Talanta, vol. 56, pp. 267-287, 2002. [4] A. Wu, L. Wang, E. Jensen, R. Mathies and B. Boser, “Modular integration of electronics and microfluidic systems using flexible printed circuit boards”, Lab Chip, vol. 10, pp. 519-521. [5] R. Wimberger-Friedl et al., “Packaging of silicon sensors for microfluidic bio-analytical applications”, J. Micromech. Microeng., vol. 19, pp. 015015, 2009. [6] T. Velten et al., “Packaging of bio-MEMS: Strategies, technologies, and applications”, IEEE Trans. Adv. Pack., vol. 28, pp. 533-546, 2005. [7] T. Brettschneider, C. Dorrer, M. Bründel, R. Zengerle and M. Daub, “Wafer-level packaging and laser bonding as an approach for siliconinto- lab-on-chip integration”, J. Micromech. Microeng., vol. 23, pp. 055005, 2013. [8] F. Frederix et al., “A novel advanced electrical CMOS biosensor technology for measuring biological affinity reactions”, in Proc. 14th Int. Conf. Miniaturized Systems for Chemistry and Life Sciences, Groningen, 2010, pp. 971-973. [9] M. Bründel, U. Scholz, F. Haag, E. Graf, T. Braun, K.-F. Becker; Substrateless sensor packaging using wafer level fan-out technology; Proc. of EPTC, 2012, Singapore. [10] T. Braun et al., Large Area Embedding for Heterogeneous System Integration; Proc. of ECTC 2010, Las Vegas, USA. [11] J. Rupp et al., “Rapid microarray processing using a disposable hybridization chamber with an integrated micropump”, Lab Chip, vol. 12, pp. 1384-1388, 2012. [12] E. Haberstroh, W.M. Hoffmann, R. Poprawe and F. Sari, “Laser transmission joining in microtechnology”, Microsyst. Technol., vol. 12, pp. 632-639, 2006.</p>
<p>[1] D. Mark, S. Häberle, G. Roth, F. von Stetten and R. Zengerle, “Microfluidic lab-on-a-chip platforms: Requirements, characteristics and applications”, Chem. Soc. Rev., vol. 39, pp. 1153-1182, 2010. [2] X. Weng, H. Jiang and D. Li, “Microfluidic DNA hybridization assays”, Microfluid. Nanofluid., vol. 11, pp. 367-383, 2011. [3] H. Becker and L. E. Locascio, “Polymer microfluidic devices”, Talanta, vol. 56, pp. 267-287, 2002. [4] A. Wu, L. Wang, E. Jensen, R. Mathies and B. Boser, “Modular integration of electronics and microfluidic systems using flexible printed circuit boards”, Lab Chip, vol. 10, pp. 519-521. [5] R. Wimberger-Friedl et al., “Packaging of silicon sensors for microfluidic bio-analytical applications”, J. Micromech. Microeng., vol. 19, pp. 015015, 2009. [6] T. Velten et al., “Packaging of bio-MEMS: Strategies, technologies, and applications”, IEEE Trans. Adv. Pack., vol. 28, pp. 533-546, 2005. [7] T. Brettschneider, C. Dorrer, M. Bründel, R. Zengerle and M. Daub, “Wafer-level packaging and laser bonding as an approach for siliconinto- lab-on-chip integration”, J. Micromech. Microeng., vol. 23, pp. 055005, 2013. [8] F. Frederix et al., “A novel advanced electrical CMOS biosensor technology for measuring biological affinity reactions”, in Proc. 14th Int. Conf. Miniaturized Systems for Chemistry and Life Sciences, Groningen, 2010, pp. 971-973. [9] M. Bründel, U. Scholz, F. Haag, E. Graf, T. Braun, K.-F. Becker; Substrateless sensor packaging using wafer level fan-out technology; Proc. of EPTC, 2012, Singapore. [10] T. Braun et al., Large Area Embedding for Heterogeneous System Integration; Proc. of ECTC 2010, Las Vegas, USA. [11] J. Rupp et al., “Rapid microarray processing using a disposable hybridization chamber with an integrated micropump”, Lab Chip, vol. 12, pp. 1384-1388, 2012. [12] E. Haberstroh, W.M. Hoffmann, R. Poprawe and F. Sari, “Laser transmission joining in microtechnology”, Microsyst. Technol., vol. 12, pp. 632-639, 2006.</p>
@article{"International Journal of Electrical, Electronic and Communication Sciences:63677", author = "T. Brettschneider and C. Dorrer and H. Suy and T. Braun and E. Jung and R. Hoofman and M. Bründel and R. Zengerle and F. Lärmer", title = "Integration of CMOS Biosensor into a Polymeric Lab-on-a-Chip System", abstract = "We present an integration approach of a CMOS biosensor into a polymer based microfluidic environment suitable for mass production. It consists of a wafer-level-package for the silicon die and laser bonding process promoted by an intermediate hot melt foil to attach the sensor package to the microfluidic chip, without the need for dispensing of glues or underfiller. A very good condition of the sensing area was obtained after introducing a protection layer during packaging. A microfluidic flow cell was fabricated and shown to withstand pressures up to Δp = 780 kPa without leakage. The employed biosensors were electrically characterized in a dry environment.
", keywords = " CMOS biosensor, laser bonding, silicon polymer integration, wafer level packaging.", volume = "7", number = "8", pages = "1063-5", }
