Effects of Various Substrate Openings for Electronic Cooling under Forced and Natural Convection
This study experimentally investigates the heat transfer effects of forced convection and natural convection under different substrate openings design. A computational fluid dynamics (CFD) model was established and implemented to verify and explain the experimental results and heat transfer behavior. It is found that different opening position will destroy the growth of the boundary layer on substrates to alter the cooling ability for both forced under low Reynolds number and natural convection. Nevertheless, having too many opening may reduce heat conduction and affect the overall heat transfer performance. This study provides future researchers with a guideline on designing and electronic package manufacturing.
[1] A. Bar-Cohen, A. D. Kraus, and S. F. Davidson, "Thermal Frontiers in the Design and Packaging of Microelectronic Equipment," Eng., vol. 105, no.
6, 1983, pp. 53-59.
[2] L. T. Yeh, "Review of Heat Transfer Technologies in Electronic Equipment," ASME J. Electron. Packaging, vol. 117, 1995, pp. 333-339.
[3] F. P. Incropera, "Convection Heat Transfer in electronic equipment,"
ASME J. Heat Transfer, vol. 110, 1988, pp. 1097-1107.
[4] E. M. Sparrow, J. E. Niethammaer and A. Chaboki, "Heat transfer and
pressure drop characteristics of arrays of rectangular modules
encountered in electronics equipment," International J. Heat and Mass
Transfer, vol. 25, no. 7, 1982, pp. 961-973.
[5] E. M. Sparrow, S. B. Verumi and D. S. Kadle, "Enhanced and local heat
transfer, pressure drop, and flow visualization for arrays of block-like
electronic components," International J. Heat and Mass Transfer, vol. 26,
no. 5, 1983, pp. 689-699.
[6] E. M. Sparrow, A. A. Yanezmoreno and D. R. Otis, "Convective heat
transfer response to height difference in an array of block-like electronic
equipment," International J. Heat and Mass Transfer, vol. 27, no. 3, 1984,
pp. 469-473.
[7] R. J. Moffat, A. Ortega and D. E. Arvizu, "Cooling electronic components:
forced convection experiments with an air cooled array," Heat Transfer in
Electronic Equipment, ASME HTD, vol. 48, 1985, pp. 15.
[8] Y. Asako and M. Faghri, "Three-dimensional heat transfer and fluid flow
analysis of rectangular blocks encountered in electronic equipment,"
Numer. Heat Transfer, vol.13, 1988, pp. 481.
[9] T. C. Hung, S. K. Wang and F. P. Tsai, "Simulation of passively
conjugate heat transfer across an array of volumetric heat sources," J.
Communications in Numerical Methods in Engineering, vol. 13, 1997, pp.
855-866.
[10] T. C. Hung and C. S. Fu, "Conjugate heat transfer analysis for the passive
enhancement of electronic cooling through geometric modification in a
mixed convection domain," Numer. Heat Transfer-Part A, vol. 35, no. 5,
1999, pp. 519-535.
[11] T. C. Hung, "A conceptual desing of thermal modeling for efficiently
cooling an array of heated devices under low Reynolds numbers," Numer.
Heat Transfer-Part A, vol. 39, 2001, pp. 361-382.
[12] Y. S. Tseng, B. S. Bai and T.C. Hung, "Effects of thermal radiation on
modified PCB Geometry under natural convection," Numer. Heat
Transfer-Part A, vol. 51, 2007, pp. 195-210.
[13] Y. S. Tseng, T. C. Hung and B. S. Bai, "Enhancement of cooling
characteristics for electronic cooling by modifying substrate under natural
convection," ASME J. Electronic Packing, vol. 130, no. 1, 2008, pp.
11006.1-11006.8.
[14] Y. S. Tseng, H. H. Fu, T. C. Hung and B. S. Bai, "An optimal parametric
design to improve chip cooling," International J. Applied Thermal
Engineering, vol. 27, 2007, pp. 1823-1831.
[15] ANSYS Inc., FLUENTV12 User's Guide. 2009.
[16] Incropera, F. P., Dewitt, D. P., Bergman, T. L., Lavine, A. S.,
Introduction to heat transfer, 5th ed., New York:Wiley, 2005, ch. 13, pp.
773 and 785.
[17] Chui, E. H., Raithby, G. D., "Computation of radiant heat transfer on a
non-orthogonal mesh using the finite-volume method," Numer. Heat
Transfer-Part B, vol. 23, 1993, pp. 269-288.
[18] Chai, J.C., Lee, H.S., patanker, S. V., "Finite volume radiative heat transfer procedure for irregular geometries," J. Thermophys. Heat
Transfer, vol. 19, no. 3, 1995, pp. 410-415.
[19] Kim, M.Y., Baek, S.W., "Numerical Analysis of conduction, convection, and radiation in a gradually expanding channel," Numer. Heat
Transfer-Part A, vol 29, 1996, pp. 725-740.
[20] Baek, S.W., Kim, M.Y., "Nonorthogonal finite-volume solutions of
radiative heat transfer in a three-dimensional enclosure," Numer. Heat
Transfer-Part B, vol 34, pp. 419-437.
[21] Liu, J.S., Shang, H.M., Chen, Y.S., Wang, T.S., "Prediction of radiative transfer in general body-fitted coordinates," Numer. Heat Transfer-Part B,
vol. 31, 1997, pp. 423-439.
[22] Byun, D. Y. Baek, S. W., Kim, M. Y., "Thermal radiation in a discretely
heated irregular geometry using the Monte-Carlo, finite volume, and
modified discrete ordinates interpolation method," Numer. Heat transfer-
Part A, vol. 37, 2000, pp. 1-18.
[23] R. I. Issa, A. D. Gosman, and A. P. Watkins," The Computation of
Compressible and incompressible recirculating flows by a non-iterative Implicit Scheme," J. Comput. Phys., vol. 62, 1986, pp. 66-82.
[24] R. I. Issa, B. Ahmadi-Befrui, K. R. Beshay, and A. D. Gosman,
" Solution of the Implicit Discretized Reacting Flow Equations by
Operator--Splitting," J. Comput. Phys., vol. 93, 1991, pp. 388-410.
[1] A. Bar-Cohen, A. D. Kraus, and S. F. Davidson, "Thermal Frontiers in the Design and Packaging of Microelectronic Equipment," Eng., vol. 105, no.
6, 1983, pp. 53-59.
[2] L. T. Yeh, "Review of Heat Transfer Technologies in Electronic Equipment," ASME J. Electron. Packaging, vol. 117, 1995, pp. 333-339.
[3] F. P. Incropera, "Convection Heat Transfer in electronic equipment,"
ASME J. Heat Transfer, vol. 110, 1988, pp. 1097-1107.
[4] E. M. Sparrow, J. E. Niethammaer and A. Chaboki, "Heat transfer and
pressure drop characteristics of arrays of rectangular modules
encountered in electronics equipment," International J. Heat and Mass
Transfer, vol. 25, no. 7, 1982, pp. 961-973.
[5] E. M. Sparrow, S. B. Verumi and D. S. Kadle, "Enhanced and local heat
transfer, pressure drop, and flow visualization for arrays of block-like
electronic components," International J. Heat and Mass Transfer, vol. 26,
no. 5, 1983, pp. 689-699.
[6] E. M. Sparrow, A. A. Yanezmoreno and D. R. Otis, "Convective heat
transfer response to height difference in an array of block-like electronic
equipment," International J. Heat and Mass Transfer, vol. 27, no. 3, 1984,
pp. 469-473.
[7] R. J. Moffat, A. Ortega and D. E. Arvizu, "Cooling electronic components:
forced convection experiments with an air cooled array," Heat Transfer in
Electronic Equipment, ASME HTD, vol. 48, 1985, pp. 15.
[8] Y. Asako and M. Faghri, "Three-dimensional heat transfer and fluid flow
analysis of rectangular blocks encountered in electronic equipment,"
Numer. Heat Transfer, vol.13, 1988, pp. 481.
[9] T. C. Hung, S. K. Wang and F. P. Tsai, "Simulation of passively
conjugate heat transfer across an array of volumetric heat sources," J.
Communications in Numerical Methods in Engineering, vol. 13, 1997, pp.
855-866.
[10] T. C. Hung and C. S. Fu, "Conjugate heat transfer analysis for the passive
enhancement of electronic cooling through geometric modification in a
mixed convection domain," Numer. Heat Transfer-Part A, vol. 35, no. 5,
1999, pp. 519-535.
[11] T. C. Hung, "A conceptual desing of thermal modeling for efficiently
cooling an array of heated devices under low Reynolds numbers," Numer.
Heat Transfer-Part A, vol. 39, 2001, pp. 361-382.
[12] Y. S. Tseng, B. S. Bai and T.C. Hung, "Effects of thermal radiation on
modified PCB Geometry under natural convection," Numer. Heat
Transfer-Part A, vol. 51, 2007, pp. 195-210.
[13] Y. S. Tseng, T. C. Hung and B. S. Bai, "Enhancement of cooling
characteristics for electronic cooling by modifying substrate under natural
convection," ASME J. Electronic Packing, vol. 130, no. 1, 2008, pp.
11006.1-11006.8.
[14] Y. S. Tseng, H. H. Fu, T. C. Hung and B. S. Bai, "An optimal parametric
design to improve chip cooling," International J. Applied Thermal
Engineering, vol. 27, 2007, pp. 1823-1831.
[15] ANSYS Inc., FLUENTV12 User's Guide. 2009.
[16] Incropera, F. P., Dewitt, D. P., Bergman, T. L., Lavine, A. S.,
Introduction to heat transfer, 5th ed., New York:Wiley, 2005, ch. 13, pp.
773 and 785.
[17] Chui, E. H., Raithby, G. D., "Computation of radiant heat transfer on a
non-orthogonal mesh using the finite-volume method," Numer. Heat
Transfer-Part B, vol. 23, 1993, pp. 269-288.
[18] Chai, J.C., Lee, H.S., patanker, S. V., "Finite volume radiative heat transfer procedure for irregular geometries," J. Thermophys. Heat
Transfer, vol. 19, no. 3, 1995, pp. 410-415.
[19] Kim, M.Y., Baek, S.W., "Numerical Analysis of conduction, convection, and radiation in a gradually expanding channel," Numer. Heat
Transfer-Part A, vol 29, 1996, pp. 725-740.
[20] Baek, S.W., Kim, M.Y., "Nonorthogonal finite-volume solutions of
radiative heat transfer in a three-dimensional enclosure," Numer. Heat
Transfer-Part B, vol 34, pp. 419-437.
[21] Liu, J.S., Shang, H.M., Chen, Y.S., Wang, T.S., "Prediction of radiative transfer in general body-fitted coordinates," Numer. Heat Transfer-Part B,
vol. 31, 1997, pp. 423-439.
[22] Byun, D. Y. Baek, S. W., Kim, M. Y., "Thermal radiation in a discretely
heated irregular geometry using the Monte-Carlo, finite volume, and
modified discrete ordinates interpolation method," Numer. Heat transfer-
Part A, vol. 37, 2000, pp. 1-18.
[23] R. I. Issa, A. D. Gosman, and A. P. Watkins," The Computation of
Compressible and incompressible recirculating flows by a non-iterative Implicit Scheme," J. Comput. Phys., vol. 62, 1986, pp. 66-82.
[24] R. I. Issa, B. Ahmadi-Befrui, K. R. Beshay, and A. D. Gosman,
" Solution of the Implicit Discretized Reacting Flow Equations by
Operator--Splitting," J. Comput. Phys., vol. 93, 1991, pp. 388-410.
@article{"International Journal of Mechanical, Industrial and Aerospace Sciences:61425", author = "Shen-Kuei Du and Jen-Chieh Chang and Chia-Hong Kao and Tzu-Chen Hung and Chii-Ray Lin", title = "Effects of Various Substrate Openings for Electronic Cooling under Forced and Natural Convection", abstract = "This study experimentally investigates the heat transfer effects of forced convection and natural convection under different substrate openings design. A computational fluid dynamics (CFD) model was established and implemented to verify and explain the experimental results and heat transfer behavior. It is found that different opening position will destroy the growth of the boundary layer on substrates to alter the cooling ability for both forced under low Reynolds number and natural convection. Nevertheless, having too many opening may reduce heat conduction and affect the overall heat transfer performance. This study provides future researchers with a guideline on designing and electronic package manufacturing.
", keywords = "electronic cooling, experiment, opening concept,CFD.", volume = "5", number = "6", pages = "1124-8", }
