Treatment of Inorganic Filler Surface by Silane-Coupling Agent: Investigation of Treatment Condition and Analysis of Bonding State of Reacted Agent
It is well known that enhancing interfacial adhesion
between inorganic filler and matrix resin in a composite lead to
favorable properties such as excellent mechanical properties, high
thermal resistance, prominent electric insulation, low expansion
coefficient, and so on. But it should be avoided that much excess of
coupling agent is reacted due to a negative impact of their final
composite-s properties. There is no report to achieve classification of
the bonding state excepting investigation of coating layer thickness.
Therefore, the analysis of the bonding state of the coupling agent
reacted with the filler surface such as BN particles with less functional
group and silica particles having much functional group was
performed by thermal gravimetric analysis and pyrolysis GC/MS. The
reacted number of functional groups on the silane-coupling agent was
classified as a result of the analysis. Thus, we succeeded in classifying
the reacted number of the functional groups as a result of this study.
[1] E.P. Plueddemann, "Silane Coupling Agents," 2nd Ed., Plenum Press,
New York, 1990.
[2] H. Ishida and S. Rimdusit, "Effect of CaCO3 on the mechanical and
rheological properties of a ring-opening phenolic resin: polybenzoxazine,"
Polym. Comps, 5(2), 1984, pp. 101-123.
[3] K.W. Garrette, H.M. Rosenberg, Thethermal conductivity of epoxy-resin/
[4] Powder compositematerials," J. Phys. D: Appl. Phys., 7, 1974, pp.
1247-1258.
[5] P. Bujard, Proc. I-THERM 1988, Los Angles, May, IEEE, 1988, pp. 41.
[6] Y. Agari, A. Ueda, M. Tanaka, S. Nagai, "Thermal conductivity of a
polymer filled with particles in the wide range from low to super-high
volume content," J. Appl. Polym. Sci., 40(6), 1990, pp. 929-941.
[7] N. Tsutsumi, N. Takeuchi, T. Kiyotsukuri, "Measurement of thermal
diffusivity of filler-polyimide composites by flash radiometry," J. Polym.
Sci., Part B, Polym Phys. 29(8), 1991, pp. 1085-1093.
[8] M. Michael, L. Ngugen, "Effect of Mold Compound Thermal
Conductivity on IC Package Thermal Performance," Intersoc. Conf. on
Thermal Phenomena, IEEE, 1992, pp. 246.
[9] G.R. Nasr, M.M. Badawy, Polym. Degrad. Stab. 47, 1995, pp. 391-395.
[10] H. Ishida and S. Rimdusit, "Very high thermal conductivity obtained by
boron nitride-filled polybenzoxazine," Thermochim. Acta, 320, 1998, pp.
177-186.
[11] K. Wattanakul, H. Manuspiya, N. Yanumet, "The adsorption of cationic
surfactants on BN surface: Its effects on the thermal conductivity and
mechanical properties of BN-epoxy composite," Colloids and Surfaces A:
Physicochem. Eng. Aspects," 369, 2010, pp. 203-210.
[12] Y. Q. Li, T. Qiu, J. Xu and X. C. He, "Surface modification of aluminium
nitride powder," Journal of Materials Science Letters, 15(20), 1996, pp.
1758-1761.
[13] L. Sun, J.J. Aklonis, R. Salovey, "Mode Filled Polymers," Polym. Eng.
Sci., 33, 1993, pp. 1308-1319.
[14] A. C. Moloney, H. H. Kausch and H. R. Stieger, "The fracture of
particulate-filled epoxide resins," J. Mater. Sci., 18(1), 1983, pp.
208-216.
[15] Y. Xu, D.D.L. Chung, "Increasing the thermal conductivity of boron
nitride and aluminum nitride particle epoxy-matrix composites by particle
surface treatments," Composite Interfaces, 7(4), 2000, pp. 243-256.
[16] Y. Nakamura, T. Gotoh, T. Usa, A. Harada, K. Takeuchi, T. Iida, K.
Nagata, "AFM observation of a Silane Coupling Agent Layers with
Various Organic Functional Groups Deposited on a Mica Surface," J.
Network Polym. Japan, 27(4), 2006, pp. 202-209.
[17] H. Hanagasaki, T. Ohashi, H. Suenaga, "Research on the properties of
treated BN filler as material of heat releasing resin:
http://www.pref.hiroshima.lg.jp/www/contents/1190870484258/files/491
9.pdf, 46, 2006.
[18] H. Hozoji, O. Horie, M. Ogata, S. Numata, N. Kinjo, "Improvement of
Mechanical Properties for Epoxy Molding Compounds by Treatment of
Coupling Agent on Spherical Filler," Kobunshi Ronbunshu, 47(6), 1990,
pp. 483-490.
[1] E.P. Plueddemann, "Silane Coupling Agents," 2nd Ed., Plenum Press,
New York, 1990.
[2] H. Ishida and S. Rimdusit, "Effect of CaCO3 on the mechanical and
rheological properties of a ring-opening phenolic resin: polybenzoxazine,"
Polym. Comps, 5(2), 1984, pp. 101-123.
[3] K.W. Garrette, H.M. Rosenberg, Thethermal conductivity of epoxy-resin/
[4] Powder compositematerials," J. Phys. D: Appl. Phys., 7, 1974, pp.
1247-1258.
[5] P. Bujard, Proc. I-THERM 1988, Los Angles, May, IEEE, 1988, pp. 41.
[6] Y. Agari, A. Ueda, M. Tanaka, S. Nagai, "Thermal conductivity of a
polymer filled with particles in the wide range from low to super-high
volume content," J. Appl. Polym. Sci., 40(6), 1990, pp. 929-941.
[7] N. Tsutsumi, N. Takeuchi, T. Kiyotsukuri, "Measurement of thermal
diffusivity of filler-polyimide composites by flash radiometry," J. Polym.
Sci., Part B, Polym Phys. 29(8), 1991, pp. 1085-1093.
[8] M. Michael, L. Ngugen, "Effect of Mold Compound Thermal
Conductivity on IC Package Thermal Performance," Intersoc. Conf. on
Thermal Phenomena, IEEE, 1992, pp. 246.
[9] G.R. Nasr, M.M. Badawy, Polym. Degrad. Stab. 47, 1995, pp. 391-395.
[10] H. Ishida and S. Rimdusit, "Very high thermal conductivity obtained by
boron nitride-filled polybenzoxazine," Thermochim. Acta, 320, 1998, pp.
177-186.
[11] K. Wattanakul, H. Manuspiya, N. Yanumet, "The adsorption of cationic
surfactants on BN surface: Its effects on the thermal conductivity and
mechanical properties of BN-epoxy composite," Colloids and Surfaces A:
Physicochem. Eng. Aspects," 369, 2010, pp. 203-210.
[12] Y. Q. Li, T. Qiu, J. Xu and X. C. He, "Surface modification of aluminium
nitride powder," Journal of Materials Science Letters, 15(20), 1996, pp.
1758-1761.
[13] L. Sun, J.J. Aklonis, R. Salovey, "Mode Filled Polymers," Polym. Eng.
Sci., 33, 1993, pp. 1308-1319.
[14] A. C. Moloney, H. H. Kausch and H. R. Stieger, "The fracture of
particulate-filled epoxide resins," J. Mater. Sci., 18(1), 1983, pp.
208-216.
[15] Y. Xu, D.D.L. Chung, "Increasing the thermal conductivity of boron
nitride and aluminum nitride particle epoxy-matrix composites by particle
surface treatments," Composite Interfaces, 7(4), 2000, pp. 243-256.
[16] Y. Nakamura, T. Gotoh, T. Usa, A. Harada, K. Takeuchi, T. Iida, K.
Nagata, "AFM observation of a Silane Coupling Agent Layers with
Various Organic Functional Groups Deposited on a Mica Surface," J.
Network Polym. Japan, 27(4), 2006, pp. 202-209.
[17] H. Hanagasaki, T. Ohashi, H. Suenaga, "Research on the properties of
treated BN filler as material of heat releasing resin:
http://www.pref.hiroshima.lg.jp/www/contents/1190870484258/files/491
9.pdf, 46, 2006.
[18] H. Hozoji, O. Horie, M. Ogata, S. Numata, N. Kinjo, "Improvement of
Mechanical Properties for Epoxy Molding Compounds by Treatment of
Coupling Agent on Spherical Filler," Kobunshi Ronbunshu, 47(6), 1990,
pp. 483-490.
@article{"International Journal of Chemical, Materials and Biomolecular Sciences:62670", author = "Hiroshi Hirano and Joji Kadota and Toshiyuki Yamashita and Yasuyuki Agari", title = "Treatment of Inorganic Filler Surface by Silane-Coupling Agent: Investigation of Treatment Condition and Analysis of Bonding State of Reacted Agent", abstract = "It is well known that enhancing interfacial adhesion
between inorganic filler and matrix resin in a composite lead to
favorable properties such as excellent mechanical properties, high
thermal resistance, prominent electric insulation, low expansion
coefficient, and so on. But it should be avoided that much excess of
coupling agent is reacted due to a negative impact of their final
composite-s properties. There is no report to achieve classification of
the bonding state excepting investigation of coating layer thickness.
Therefore, the analysis of the bonding state of the coupling agent
reacted with the filler surface such as BN particles with less functional
group and silica particles having much functional group was
performed by thermal gravimetric analysis and pyrolysis GC/MS. The
reacted number of functional groups on the silane-coupling agent was
classified as a result of the analysis. Thus, we succeeded in classifying
the reacted number of the functional groups as a result of this study.", keywords = "Inorganic filler, boron nitride, surface treatment,
coupling agent, analysis of bonding state", volume = "6", number = "1", pages = "122-5", }
