Abstract: This paper present a circular patch microstrip array antenna operate in KU-band (10.9GHz – 17.25GHz). The proposed circular patch array antenna will be in light weight, flexible, slim and compact unit compare with current antenna used in KU-band. The paper also presents the detail steps of designing the circular patch microstrip array antenna. An Advance Design System (ADS) software is used to compute the gain, power, radiation pattern, and S11 of the antenna. The proposed Circular patch microstrip array antenna basically is a phased array consisting of 'n' elements (circular patch antennas) arranged in a rectangular grid. The size of each element is determined by the operating frequency. The incident wave from satellite arrives at the plane of the antenna with equal phase across the surface of the array. Each 'n' element receives a small amount of power in phase with the others. There are feed network connects each element to the microstrip lines with an equal length, thus the signals reaching the circular patches are all combined in phase and the voltages add up. The significant difference of the circular patch array antenna is not come in the phase across the surface but in the magnitude distribution.
Abstract: In this paper, the signal transmission analysis of the
semicircle-shaped via structure for the differential pairs is presented in
the frequency range up to 10 GHz. In order to improve the signal
transmission properties in the differential pairs, single via is separated
centrally into two semicircle-shaped sections, which are
interconnected with the traces of differential pairs respectively. This
via structure make possible to route differential pairs using only one
via. In addition, it can improve impedance discontinuity around its
region and then enhance the signal transmission properties in the
differential pairs. The electrical analysis such as S-parameter
calculation and eye diagram simulation has been performed to
investigate the improvement of the signal transmission property in the
differential pairs with new via structure.