Signal Transmission Analysis of Differential Pairs Using Semicircle-Shaped Via Structure
In this paper, the signal transmission analysis of the
semicircle-shaped via structure for the differential pairs is presented in
the frequency range up to 10 GHz. In order to improve the signal
transmission properties in the differential pairs, single via is separated
centrally into two semicircle-shaped sections, which are
interconnected with the traces of differential pairs respectively. This
via structure make possible to route differential pairs using only one
via. In addition, it can improve impedance discontinuity around its
region and then enhance the signal transmission properties in the
differential pairs. The electrical analysis such as S-parameter
calculation and eye diagram simulation has been performed to
investigate the improvement of the signal transmission property in the
differential pairs with new via structure.
[1] J. Chandrasekhar, E. Engin, M. Swaminathan, K. Uriu, T. Yamada,
"Noise Induced Jitter in Differential Signaling," in Proc. IEEE Electronic
Components and Technology Conference, 2008, pp. 1755-1761.
[2] N. Na, J. Audet, and D. Zwitter, "Discontinuity Impacts and Design
Considerations of High speed Differential Signals in FC-PBFA Packages
with High Wiring Density," in Proc. IEEE Electrical Performance of
Electronic Packaging, 2005, pp. 107-110.
[3] W. L. Yuan, H. P. Kuah, C. K. Wang, A. Y. S. Sun, W. H. Zhu, H. B. Tan,
A. D. Muhamad, "High-Speed Differential Interconnection Design for
Flip-Chip BGA Packages," in Proc. IEEE Electronics Packaging
Technology Conference, 2006, pp. 76-81.
[4] M. Cocchini, J. Fan, B. Archambeault, J. L. Knighten, X. Chang, J. L.
Drewniak, Y. Zhang, and S. Connor, "Noise Coupling Between
Power/Ground Nets Due To Differential Vias Transitions in a Multilayer
PCB," in Proc. IEEE International Symposium on Electromagnetic
Compatibility, 2008, pp. 1-6.
[5] S. C. Thierauf, High-speed Circuit Board Signal Integrity. Artech House,
Boston, 2004, pp. 149-170.
[6] J. F. Buckwalter, "Predicting microwave digital signal integrity," IEEE
Trans. Adv. Packag., vol. 32, pp. 280-289, May 2009.
[7] W. Guo, J. Lin, C. Lin, T. Huang, and R. Wu, "Fast methodology for
determining eye diagram characteristics of lossy transmission lines,"
IEEE Trans. Adv. Packag., vol. 32, pp. 175-183, Feb. 2009.
[8] M.Wang, A. Langari, and H. Hashemi, "Advanced packaging for GHz
switching applications," in Proc. Electron. Comp. Tech. Conf., 2002, pp.
634-640.
[1] J. Chandrasekhar, E. Engin, M. Swaminathan, K. Uriu, T. Yamada,
"Noise Induced Jitter in Differential Signaling," in Proc. IEEE Electronic
Components and Technology Conference, 2008, pp. 1755-1761.
[2] N. Na, J. Audet, and D. Zwitter, "Discontinuity Impacts and Design
Considerations of High speed Differential Signals in FC-PBFA Packages
with High Wiring Density," in Proc. IEEE Electrical Performance of
Electronic Packaging, 2005, pp. 107-110.
[3] W. L. Yuan, H. P. Kuah, C. K. Wang, A. Y. S. Sun, W. H. Zhu, H. B. Tan,
A. D. Muhamad, "High-Speed Differential Interconnection Design for
Flip-Chip BGA Packages," in Proc. IEEE Electronics Packaging
Technology Conference, 2006, pp. 76-81.
[4] M. Cocchini, J. Fan, B. Archambeault, J. L. Knighten, X. Chang, J. L.
Drewniak, Y. Zhang, and S. Connor, "Noise Coupling Between
Power/Ground Nets Due To Differential Vias Transitions in a Multilayer
PCB," in Proc. IEEE International Symposium on Electromagnetic
Compatibility, 2008, pp. 1-6.
[5] S. C. Thierauf, High-speed Circuit Board Signal Integrity. Artech House,
Boston, 2004, pp. 149-170.
[6] J. F. Buckwalter, "Predicting microwave digital signal integrity," IEEE
Trans. Adv. Packag., vol. 32, pp. 280-289, May 2009.
[7] W. Guo, J. Lin, C. Lin, T. Huang, and R. Wu, "Fast methodology for
determining eye diagram characteristics of lossy transmission lines,"
IEEE Trans. Adv. Packag., vol. 32, pp. 175-183, Feb. 2009.
[8] M.Wang, A. Langari, and H. Hashemi, "Advanced packaging for GHz
switching applications," in Proc. Electron. Comp. Tech. Conf., 2002, pp.
634-640.
@article{"International Journal of Electrical, Electronic and Communication Sciences:52170", author = "Moonjung Kim and Chang-Ho Hyun and Won-Ho Kim", title = "Signal Transmission Analysis of Differential Pairs Using Semicircle-Shaped Via Structure", abstract = "In this paper, the signal transmission analysis of the
semicircle-shaped via structure for the differential pairs is presented in
the frequency range up to 10 GHz. In order to improve the signal
transmission properties in the differential pairs, single via is separated
centrally into two semicircle-shaped sections, which are
interconnected with the traces of differential pairs respectively. This
via structure make possible to route differential pairs using only one
via. In addition, it can improve impedance discontinuity around its
region and then enhance the signal transmission properties in the
differential pairs. The electrical analysis such as S-parameter
calculation and eye diagram simulation has been performed to
investigate the improvement of the signal transmission property in the
differential pairs with new via structure.", keywords = "Differential pairs, signal transmission property, via,
S-parameter.", volume = "6", number = "10", pages = "1128-4", }