Abstract: Network on a chip (NoC) has been proposed as a viable solution to counter the inefficiency of buses in the current VLSI on-chip interconnects. However, as the silicon chip accommodates more transistors, the probability of transient faults is increasing, making fault tolerance a key concern in scaling chips. In packet based communication on a chip, transient failures can corrupt the data packet and hence, undermine the accuracy of data communication. In this paper, we present a comparative analysis of transient fault tolerant techniques including end-to-end, node-by-node, and stochastic communication based on flooding principle.
Abstract: This work proposes an accurate crosstalk noise estimation method in the presence of multiple RLC lines for the use in design automation tools. This method correctly models the loading effects of non switching aggressors and aggressor tree branches using resistive shielding effect and realistic exponential input waveforms. Noise peak and width expressions have been derived. The results obtained are at good agreement with SPICE results. Results show that average error for noise peak is 4.7% and for the width is 6.15% while allowing a very fast analysis.
Abstract: Timing driven physical design, synthesis, and
optimization tools need efficient closed-form delay models for
estimating the delay associated with each net in an integrated circuit
(IC) design. The total number of nets in a modern IC design has
increased dramatically and exceeded millions. Therefore efficient
modeling of interconnection is needed for high speed IC-s. This
paper presents closed–form expressions for RC and RLC
interconnection trees in current mode signaling, which can be
implemented in VLSI design tool. These analytical model
expressions can be used for accurate calculation of delay after the
design clock tree has been laid out and the design is fully routed.
Evaluation of these analytical models is several orders of magnitude
faster than simulation using SPICE.
Abstract: Fast delay estimation methods, as opposed to
simulation techniques, are needed for incremental performance
driven layout synthesis. On-chip inductive effects are becoming
predominant in deep submicron interconnects due to increasing clock
speed and circuit complexity. Inductance causes noise in signal
waveforms, which can adversely affect the performance of the circuit
and signal integrity. Several approaches have been put forward which
consider the inductance for on-chip interconnect modelling. But for
even much higher frequency, of the order of few GHz, the shunt
dielectric lossy component has become comparable to that of other
electrical parameters for high speed VLSI design. In order to cope up
with this effect, on-chip interconnect has to be modelled as
distributed RLCG line. Elmore delay based methods, although
efficient, cannot accurately estimate the delay for RLCG interconnect
line. In this paper, an accurate analytical delay model has been
derived, based on first and second moments of RLCG
interconnection lines. The proposed model considers both the effect
of inductance and conductance matrices. We have performed the
simulation in 0.18μm technology node and an error of as low as less
as 5% has been achieved with the proposed model when compared to
SPICE. The importance of the conductance matrices in interconnect
modelling has also been discussed and it is shown that if G is
neglected for interconnect line modelling, then it will result an delay
error of as high as 6% when compared to SPICE.