Abstract: Thermoelectric technology is currently being used in many industrial applications for cooling, heating and generating electricity. This research mainly focuses on using thermoelectric to cool down high-speed computer chips at different operating conditions. A previously developed and validated three-dimensional model for optimizing and assessing the performance of cascaded thermoelectric and non-cascaded thermoelectric is used in this study to investigate the possibility of decreasing the hotspot temperature of computer chip. Additionally, a test assembly is built and tested at steady-state and transient conditions. The obtained optimum thermoelectric current at steady-state condition is used to conduct a number of pulsed tests (i.e. transient tests) with different shapes to cool the computer chips hotspots. The results of the steady-state tests showed that at hotspot heat rate of 15.58 W (5.97 W/cm2), using thermoelectric current of 4.5 A has resulted in decreasing the hotspot temperature at open circuit condition (89.3 °C) by 50.1 °C. Maximum and minimum hotspot temperatures have been affected by ON and OFF duration of the electrical current pulse. Maximum hotspot temperature was resulted by longer OFF pulse period. In addition, longer ON pulse period has generated the minimum hotspot temperature.
Abstract: The growing popularity of solid state thermoelectric
devices in cooling applications has sparked an increasing diversity of
thermoelectric coolers (TECs) on the market, commonly known as
“Peltier modules”. They can also be used as generators, converting
a temperature difference into electric power, and opportunities are
plentiful to make use of these devices as thermoelectric generators
(TEGs) to supply energy to low power, autonomous embedded
electronic applications. Their adoption as energy harvesters in this
new domain of usage is obstructed by the complex thermoelectric
models commonly associated with TEGs. Low cost TECs for the
consumer market lack the required parameters to use the models
because they are not intended for this mode of operation, thereby
urging an alternative method to obtain electric power estimations
in specific operating conditions. The design of the test setup
implemented in this paper is specifically targeted at benchmarking
commercial, off-the-shelf TECs for use as energy harvesters in
domestic environments: applications with limited temperature
differences and space available. The usefulness is demonstrated by
testing and comparing single and multi stage TECs with different
sizes. The effect of a boost converter stage on the thermoelectric
end-to-end efficiency is also discussed.
Abstract: This article experimentally investigates the
thermal performance of thermoelectric air-cooling module
which comprises a thermoelectric cooler (TEC) and an
air-cooling heat sink. The influences of input current and heat
load are determined. And performances under each situation
are quantified by thermal resistance analysis. Since TEC
generates Joule heat, this nature makes construction of thermal
resistance network difficult. To simplify the analysis, this
article emphasizes on the resistance heat load might meet when
passing through the device. Therefore, the thermal resistances
in this paper are to divide temperature differences by heat load.
According to the result, there exists an optimum input current
under every heating power. In this case, the optimum input
current is around 6A or 7A. The performance of the heat sink
would be improved with TEC under certain heating power and
input current, especially at a low heat load. According to the
result, the device can even make the heat source cooler than the
ambient. However, TEC is not always effective at every heat
load and input current. In some situation, the device works
worse than the heat sink without TEC. To determine the
availability of TEC, this study figures out the effective
operating region in which the TEC air-cooling module works
better than the heat sink without TEC. The result shows that
TEC is more effective at a lower heat load. If heat load is too
high, heat sink with TEC will perform worse than without TEC.
The limit of this device is 57W. Besides, TEC is not helpful if
input current is too high or too low. There is an effective range
of input current, and the range becomes narrower when the heat
load grows.