Abstract: In this paper, we present a microcontroller-based liquid level controller which identifies the various levels of a liquid, carries out certain actions and is capable of communicating with the human being and other devices through the GSM network. This project is useful in ensuring that a liquid is not wasted. It also contributes to the internet of things paradigm, which is the future of the internet. The method used in this work includes designing the circuit and simulating it. The circuit is then implemented on a solderless breadboard after which it is implemented on a strip board. A C++ computer program is developed and uploaded into the microcontroller. This program instructs the microcontroller on how to carry out its actions. In other to determine levels of the liquid, an ultrasonic wave is sent to the surface of the liquid similar to radar or the method for detecting the level of sea bed. Message is sent to the phone of the user similar to the way computers send messages to phones of GSM users. It is concluded that the routine of observing the levels of a liquid in a tank, refilling the tank when the liquid level is too low can be entirely handled by a programmable device without wastage of the liquid or bothering a human being with such tasks.
Abstract: A flaw or drift from expected operational performance in one component (NAND, PMIC, controller, DRAM, etc.) may affect the reliability of the entire Solid State Drive (SSD) system. Therefore, it is important to ensure the required quality of each individual component through qualification testing specified using standards or user requirements. Qualification testing is time-consuming and comes at a substantial cost for product manufacturers. A highly technical team, from all the eminent stakeholders is embarking on reliability prediction from beginning of new product development, identify critical to reliability parameters, perform full-blown characterization to embed margin into product reliability and establish control to ensure the product reliability is sustainable in the mass production. The paper will discuss a comprehensive development framework, comprehending SSD end to end from design to assembly, in-line inspection, in-line testing and will be able to predict and to validate the product reliability at the early stage of new product development. During the design stage, the SSD will go through intense reliability margin investigation with focus on assembly process attributes, process equipment control, in-process metrology and also comprehending forward looking product roadmap. Once these pillars are completed, the next step is to perform process characterization and build up reliability prediction modeling. Next, for the design validation process, the reliability prediction specifically solder joint simulator will be established. The SSD will be stratified into Non-Operating and Operating tests with focus on solder joint reliability and connectivity/component latent failures by prevention through design intervention and containment through Temperature Cycle Test (TCT). Some of the SSDs will be subjected to the physical solder joint analysis called Dye and Pry (DP) and Cross Section analysis. The result will be feedbacked to the simulation team for any corrective actions required to further improve the design. Once the SSD is validated and is proven working, it will be subjected to implementation of the monitor phase whereby Design for Assembly (DFA) rules will be updated. At this stage, the design change, process and equipment parameters are in control. Predictable product reliability at early product development will enable on-time sample qualification delivery to customer and will optimize product development validation, effective development resource and will avoid forced late investment to bandage the end-of-life product failures. Understanding the critical to reliability parameters earlier will allow focus on increasing the product margin that will increase customer confidence to product reliability.
Abstract: In the operation of power transformers of 110 kV/MV from substations, these are traveled by fault current resulting from MV line damage. Defect electrical contacts are heated when they are travelled from fault currents. In the case of high temperatures when 135 °C is reached, the electrical insulating oil in the vicinity of the electrical faults comes into contact with these contacts releases gases, and activates the electrical protection. To avoid auto-flammability of electro-insulating oil, we designed a security system thermal of electrical contact defects by pouring fire-resistant polyurethane foam, mastic or mortar fire inside a cardboard electro-insulating cylinder. From practical experience, in the exploitation of power transformers of 110 kV/MT in oil electro-insulating were recorded some passing disconnecting commanded by the gas protection at internal defects. In normal operation and in the optimal load, nominal currents do not require thermal secure contacts inside electrical transformers, contacts are made at the fabrication according to the projects or to repair by solder. In the case of external short circuits close to the substation, the contacts inside electrical transformers, even if they are well made in sizes of Rcontact = 10‑6 Ω, are subjected to short-circuit currents of the order of 10 kA-20 kA which lead to the dissipation of some significant second-order electric powers, 100 W-400 W, on contact. At some internal or external factors which action on electrical contacts, including electrodynamic efforts at short-circuits, these factors could be degraded over time to values in the range of 10-4 Ω to 10-5 Ω and if the action time of protection is great, on the order of seconds, power dissipation on electrical contacts achieve high values of 1,0 kW to 40,0 kW. This power leads to strong local heating, hundreds of degrees Celsius and can initiate self-ignition and burning oil in the vicinity of electro-insulating contacts with action the gas relay. Degradation of electrical contacts inside power transformers may not be limited for the duration of their operation. In order to avoid oil burn with gas release near electrical contacts, at short-circuit currents 10 kA-20 kA, we have outlined the following solutions: covering electrical contacts in fireproof materials that would avoid direct burn oil at short circuit and transmission of heat from electrical contact along the conductors with heat dissipation gradually over time, in a large volume of cooling. Flame retardant materials are: polyurethane foam, mastic, cement (concrete). In the normal condition of operation of transformer, insulating of conductors coils is with paper and insulating oil. Ignition points of its two components respectively are approximated: 135 °C heat for oil and 200 0C for paper. In the case of a faulty electrical contact, about 10-3 Ω, at short-circuit; the temperature can reach for a short time, a value of 300 °C-400 °C, which ignite the paper and also the oil. By burning oil, there are local gases that disconnect the power transformer. Securing thermal electrical contacts inside the transformer, in cardboard tube with polyurethane foams, mastik or cement, ensures avoiding gas release and also gas protection working.
Abstract: Surface Mount Technology (SMT) is widely used in the area of the electronic assembly in which the electronic components are mounted to the surface of the printed circuit board (PCB). Most of the defects in the SMT process are mainly related to the quality of solder paste printing. These defects lead to considerable manufacturing costs in the electronics assembly industry. Therefore, the solder paste inspection (SPI) machine for controlling and monitoring the amount of solder paste printing has become an important part of the production process. So far, the setting of the SPI threshold is based on statistical analysis and experts’ experiences to determine the appropriate threshold settings. Because the production data are not normal distribution and there are various variations in the production processes, defects related to solder paste printing still occur. In order to solve this problem, this paper proposes an online machine learning algorithm, called the automatic threshold adjustment (ATA) algorithm, and closed-loop architecture in the SMT process to determine the best threshold settings. Simulation experiments prove that our proposed threshold settings improve the accuracy from 99.85% to 100%.
Abstract: Electromagnetic Interference (EMI) shielded doors made from brass extruded channels need to be welded with shielded enclosures to attain optimum shielding performance. Control of welding induced distortion is a problem in welding dissimilar metals like steel and brass. In this research, soldering of the steel-brass joint has been proposed to avoid weld distortion. The material used for brass channel is UNS C36000. The thickness of brass is defined by the manufacturing process, i.e. extrusion. The thickness of shielded enclosure material (ASTM A36) can be varied to produce joint between the dissimilar metals. Steel sections of different gauges are soldered using (91% tin, 9% zinc) solder to the brass, and strength of joint is measured by standard test procedures. It is observed that thin steel sheets produce a stronger bond with brass. The steel sections further require to be welded with shielded enclosure steel sheets through TIG welding process. Stresses and deformation in the vicinity of soldered portion is calculated through FE simulation. Crack formation in soldered area is also studied through experimental work. It has been found that in thin sheets deformation produced due to applied force is localized and has no effect on soldered joint area whereas in thick sheets profound cracks have been observed in soldered joint. The shielding effectiveness of EMI shielded door is compromised due to these cracks. The shielding effectiveness of the specimens is tested and results are compared.
Abstract: The aim of this paper is to study the effectiveness of bismuth addition in the solder alloy to retard the intermetallic compound formation and growth. In this study, three categories of solders such as Sn-4Ag-xCu (x = 0.5, 0.7, 1.0) and Sn-4Ag-0.5Cu-xBi (x = 0.1, 0.2, 0.4) were used. Ni/Au surface finish substrates were dipped into the molten solder at a temperature of 180-190 oC and allowed to cool at room temperature. The intermetallic compound (IMCs) were subjected to the characterization in terms of composition and morphology. The IMC phases were identified by energy dispersive x-ray (EDX), whereas the optical microscope and scanning electron microscopy (SEM) were used to observe microstructure evolution of the solder joint. The results clearly showed that copper concentration dependency was high during the reflow stage. Besides, only Ni3Sn4 and Ni3Sn2 were detected for all copper concentrations. The addition of Bi was found to have no significant effect on the type of IMCs formed, but yet the grain became further refined.
Abstract: Due to the higher power loss levels in electronic components, the thermal design of PCBs (Printed Circuit Boards) of an assembled device becomes one of the most important quality factors in electronics. Nonetheless, some of leading causes of the microelectronic component failures are due to higher temperatures, the leakages or thermal-mechanical stress, which is a concern, is the reliability of microelectronic packages. This article presents an experimental approach to measure the junction temperature of exposed pad packages. The implemented solution is in a prototype phase, using a temperature-sensitive parameter (TSP) to measure temperature directly on the die, validating the numeric results provided by the Mechanical APDL (Ansys Parametric Design Language) under same conditions. The physical device-under-test is composed by a Thermal Test Chip (TTC-1002) and assembly in a QFN cavity, soldered to a test-board according to JEDEC Standards. Monitoring the voltage drop across a forward-biased diode, is an indirectly method but accurate to obtain the junction temperature of QFN component with an applied power range between 0,3W to 1.5W. The temperature distributions on the PCB test-board and QFN cavity surface were monitored by an infra-red thermal camera (Goby-384) controlled and images processed by the Xeneth software. The article provides a set-up to monitorize in real-time the junction temperature of ICs, namely devices with the exposed pad package (i.e. QFN). Presenting the PCB layout parameters that the designer should use to improve thermal performance, and evaluate the impact of voids in solder interface in the device junction temperature.
Abstract: Quad Flat No-Lead (QFN) packages have become very popular for turners, converters and audio amplifiers, among others applications, needing efficient power dissipation in small footprints. Since semiconductor junction temperature (TJ) is a critical parameter in the product quality. And to ensure that die temperature does not exceed the maximum allowable TJ, a thermal analysis conducted in an earlier development phase is essential to avoid repeated re-designs process with huge losses in cost and time. A simulation tool capable to estimate die temperature of components with QFN package was developed. Allow establish a non-empirical way to define an acceptance criterion for amount of voids in solder interface between its exposed pad and Printed Circuit Board (PCB) to be applied during industrialization process, and evaluate the impact of PCB designs parameters. Targeting PCB layout designer as an end user for the application, a user-friendly interface (GUI) was implemented allowing user to introduce design parameters in a convenient and secure way and hiding all the complexity of finite element simulation process. This cost effective tool turns transparent a simulating process and provides useful outputs after acceptable time, which can be adopted by PCB designers, preventing potential risks during the design stage and make product economically efficient by not oversizing it. This article gathers relevant information related to the design and implementation of the developed tool, presenting a parametric study conducted with it. The simulation tool was experimentally validated using a Thermal-Test-Chip (TTC) in a QFN open-cavity, in order to measure junction temperature (TJ) directly on the die under controlled and knowing conditions. Providing a short overview about standard thermal solutions and impacts in exposed pad packages (i.e. QFN), accurately describe the methods and techniques that the system designer should use to achieve optimum thermal performance, and demonstrate the effect of system-level constraints on the thermal performance of the design.
Abstract: Ultrasonic metal welding has been the subject of ongoing research and development, most recently concentrating on metal joining in miniature devices, for example to allow solder-free wire bonding. As well as at the small scale, there are also opportunities to research the joining of thicker sheet metals and to widen the range of similar and dissimilar materials that can be successfully joined using this technology. This study presents the design, characterisation and test of a lateral-drive ultrasonic metal spot welding device. The ultrasonic metal spot welding horn is modelled using finite element analysis (FEA) and its vibration behaviour is characterised experimentally to ensure ultrasonic energy is delivered effectively to the weld coupon. The welding stack and fixtures are then designed and mounted on a test machine to allow a series of experiments to be conducted for various welding and ultrasonic parameters. Weld strength is subsequently analysed using tensile-shear tests. The results show how the weld strength is particularly sensitive to the combination of clamping force and ultrasonic vibration amplitude of the welding tip, but there are optimal combinations of these and also limits that must be clearly identified.
Abstract: The use of magnesium alloys is limited due to their
susceptibility to corrosion although they have many attractive
physical and mechanical properties. To increase mechanical and
corrosion properties of these alloys, many deposition method and
coating types are used. Electroless Ni–B coatings have received
considerable interest recently due to its unique properties such as
cost-effectiveness, thickness uniformity, good wear resistance,
lubricity, good ductility and corrosion resistance, excellent
solderability and electrical properties and antibacterial property. In
this study, electroless Ni-B coating could been deposited on AZ91
magnesium alloy. The obtained coating exhibited a harder and
rougher structure than the substrate.
Abstract: The temperature dependence of wettability (wetting
angle, Θ (T)) for Ag-based melts on graphite and Al2O3 substrates is
compared. Typical alloying effects are found, as the Ag host metal is
gradually replaced by various metallic elements. The essence of
alloying lies in the change of the electron/atom (e/a) ratio. This ratio
is also manifested in the shift of wetting angles on the same substrate.
Nevertheless, the effects are partially smeared by other
(metallurgical) factors, like the interaction between the oxygenalloying
elements and by the graphite substrate-oxygen interaction. In
contrast, such effects are not pronounced in the case of Al2O3
substrates. As a consequence, Θ(T) exhibits an opposite trend in the
case of two substrates. Crossovers of the Θ(T) curves were often
found. The positions of crossovers depend on the chemical character
and concentration of solute atoms. Segregation and epitaxial texture
formation after solidification were also observed in certain alloy
drops, especially in high concentration range. This phenomenon is
not yet explained in every detail.
Abstract: The effect of Yttrium addition on the microstructure and mechanical properties of Sn-Zn eutectic alloy, which has been attracting intensive focus as a Pb-free solder material, was investigated in this study. Phase equilibrium has been calculated by using FactSage® to evaluate the composition and fraction of equilibrium intermetallic compounds and construct a phase diagram. In the case of Sn-8.8Zn eutectic alloy, the as-cast microstructure was typical lamellar. With addition of 0.25wt.%Y, a large amount of pro-eutectic a phase have been observed and various YZnx intermetallic compounds were expected to successively form during cooling. Hardness of Sn-8.8Zn alloy was not affected by Y-addition and both alloys could be rolled by 90% at room temperature.
Abstract: Occurrence of popcorn in IC packages while assembling them onto the PCB is a well known moisture sensitive reliability issues, especially for surface mount packages. Commonly reflow soldering simulation process is conducted to assess the impact of assembling IC package onto PCB. A strain gauge-based instrumentation is developed to investigate the popcorn effect in surface mount packages during reflow soldering process. The instrument is capable of providing real-time quantitative information of the occurrence popcorn phenomenon in IC packages. It is found that the popcorn occur temperatures between 218 to 241°C depending on moisture soak condition, but not at the peak temperature of the reflow process. The presence of popcorn and delamination are further confirmed by scanning acoustic tomography as a failure analysis.
Abstract: The Pads have unique values of thermophysical
properties (THP) having important contribution over heat transfer
into the PCB structure.
Materials with high thermal diffusivity (TD) rapidly adjust their
temperature to that of their surroundings, because the HT is quick in
compare to their volumetric heat capacity (VHC).
In the paper is presenting the diffusivity tests (ASTM E1461 flash
method) for PCBs with different core materials. In the experiments,
the multilayer structure of PCBA was taken into consideration, an
equivalent property referring to each of experimental structure be
practically measured.
Concerning to entire structure, the THP emphasize the major
contribution of substrate in establishing of reflow soldering process
(RSP) heat transfer necessities. This conclusion offer practical
solution for heat transfer time constant calculation as function of
thickness and substrate material diffusivity with an acceptable error
estimation.
Abstract: Corrugated wire mesh laminates (CWML) are a class
of engineered open cell structures that have potential for applications
in many areas including aerospace and biomedical engineering. Two
different methods of fabricating corrugated wire mesh laminates from
stainless steel, one using a high temperature Lithobraze alloy and the
other using a low temperature Eutectic solder for joining the
corrugated wire meshes are described herein. Their implementation is
demonstrated by manufacturing CWML samples of 304 and 316
stainless steel (SST). It is seen that due to the facility of employing
wire meshes of different densities and wire diameters, it is possible to
create CWML laminates with a wide range of effective densities. The
fabricated laminates are tested under uniaxial compression. The
variation of the compressive yield strength with relative density of the
CWML is compared to the theory developed by Gibson and Ashby for
open cell structures [22]. It is shown that the compressive strength of
the corrugated wire mesh laminates can be described using the same
equations by using an appropriate value for the linear coefficient in the
Gibson-Ashby model.
Abstract: Studies have shown that the SnAgCu solder family has been widely used as a replacement for conventional Sn-Pb solders. An attractive approach is by introducing alloying additives (rare earth elements (RE), Zn, Co, Fe, Ni, Sb) into the SnAgCu solder, which helps in refining the microstructure also improving the mechanical and wetting properties of the solder. The present work focuses on the effect of additions of 0.5% Ce and Fe into Sn-3.0Ag-0.5Cu solder, in attempt to reduce the intermetallic compound (IMC) growth and reflow properties of the solder on Cu and Ni (P) surface finish, as well as effects thermal aging on the formation of intermetallic compound (IMC) on different surface finish. Excessive intermetallic compound growth may effect the interface and solder joint due to the brittle nature of the intermetallic compounds. Thus, by introducing alloying elements, IMC layer thickness can be decrease, resulting in better joint and solder reliability.
Abstract: Microstructure, wetting behavior and interfacial
reactions between Sn–0.7Cu and Sn–0.3Ag–0.7Cu (SAC0307)
solders solidified on Ni coated Al substrates were compared and
investigated. Microstructure of Sn–0.7Cu alloy exhibited a eutectic
matrix composed of primary β-Sn dendrites with a fine dispersion of
Cu6Sn5 intermetallics whereas microstructure of SAC0307 alloy
exhibited coarser Cu6Sn5 and finer Ag3Sn precipitates of IMCs with
decreased tin dendrites. Contact angles ranging from 22° to 26° were
obtained for Sn–0.7Cu solder solidified on substrate surface whereas
for SAC0307 solder alloy contact angles were found to be in the
range of 20° to 22°. Sn–0.7Cu solder/substrate interfacial region
exhibited faceted (Cu, Ni)6Sn5 IMCs protruding into the solder matrix
and a small amount of (Cu, Ni)3Sn4 intermetallics at the interface.
SAC0307 solder/substrate interfacial region showed mainly (Cu,
Ni)3Sn4 intermetallics adjacent to the coating layer and (Cu,
Ni)6Sn5 IMCs in the solder matrix. The improvement in the
wettability of SAC0307 solder alloy on substrate surface is attributed
to the formation of cylindrical shape (Cu,Ni)6Sn5 and a layer of
(Cu, Ni)3Sn4 IMCs at the interface.
Abstract: Electronics Products that achieve high levels of integrated communications, computing and entertainment, multimedia features in small, stylish and robust new form factors are winning in the market place. Due to the high costs that an industry may undergo and how a high yield is directly proportional to high profits, IC (Integrated Circuit) manufacturers struggle to maximize yield, but today-s customers demand miniaturization, low costs, high performance and excellent reliability making the yield maximization a never ending research of an enhanced assembly process. With factors such as minimum tolerances, tighter parameter variations a systematic approach is needed in order to predict the assembly process. In order to evaluate the quality of upcoming circuits, yield models are used which not only predict manufacturing costs but also provide vital information in order to ease the process of correction when the yields fall below expectations. For an IC manufacturer to obtain higher assembly yields all factors such as boards, placement, components, the material from which the components are made of and processes must be taken into consideration. Effective placement yield depends heavily on machine accuracy and the vision of the system which needs the ability to recognize the features on the board and component to place the device accurately on the pads and bumps of the PCB. There are currently two methods for accurate positioning, using the edge of the package and using solder ball locations also called footprints. The only assumption that a yield model makes is that all boards and devices are completely functional. This paper will focus on the Monte Carlo method which consists in a class of computational algorithms (information processed algorithms) which depends on repeated random samplings in order to compute the results. This method utilized in order to recreate the simulation of placement and assembly processes within a production line.
Abstract: The mechanism behind the electromigration and
thermomigration failure in flip-chip solder joints with Cu-pillar bumps
was investigated in this paper through using finite element method.
Hot spot and the current crowding occurrs in the upper corner of
copper column instead of solders of the common solder ball. The
simulation results show that the change in thermal gradient is
noticeable, which might greatly affect the reliability of solder joints
with Cu-pillar bumps under current stressing. When the average
applied current density is increased from 1×104 A/cm2 to 3×104 A/cm2
in solders, the thermal gradient would increase from 74 K/cm to 901
K/cm at an ambient temperature of 25°C. The force from thermal
gradient of 901 K/cm can nearly induce thermomigration by itself.
With the increase in applied current, the thermal gradient is growing. It
is proposed that thermomigration likely causes a serious reliability
issue for Cu column based interconnects.
Abstract: Wetting characteristics of reactive (Sn–0.7Cu solder)
and non– reactive (castor oil) wetting of liquids on Cu and Ag plated
Al substrates have been investigated. Solder spreading exhibited
capillary, gravity and viscous regimes. Oils did not exhibit noticeable
spreading regimes. Solder alloy showed better wettability on Ag
coated Al substrate compared to Cu plating. In the case of castor oil,
Cu coated Al substrate exhibited good wettability as compared to Ag
coated Al substrates. The difference in wettability during reactive
wetting of solder and non–reactive wetting of oils is attributed to the
change in the surface energies of Al substrates brought about by the
formation of intermetallic compounds (IMCs).