The Influence of Pad Thermal Diffusivity over Heat Transfer into the PCBs Structure
The Pads have unique values of thermophysical
properties (THP) having important contribution over heat transfer
into the PCB structure.
Materials with high thermal diffusivity (TD) rapidly adjust their
temperature to that of their surroundings, because the HT is quick in
compare to their volumetric heat capacity (VHC).
In the paper is presenting the diffusivity tests (ASTM E1461 flash
method) for PCBs with different core materials. In the experiments,
the multilayer structure of PCBA was taken into consideration, an
equivalent property referring to each of experimental structure be
practically measured.
Concerning to entire structure, the THP emphasize the major
contribution of substrate in establishing of reflow soldering process
(RSP) heat transfer necessities. This conclusion offer practical
solution for heat transfer time constant calculation as function of
thickness and substrate material diffusivity with an acceptable error
estimation.
[1] M. Brânzei, P. Svasta, F. Miculescu, M. Miculescu, I. Plotog,
"Correlation Between the Thermo-physical Properties, Geometry and
Microstructure of the SAC305 and SAC-X Typical Solder Joints", in
SIITME 2009, Gyula, Hungary, Conference proceedings CD, ISBN:
978-1-4244- 50330309, pp. 129-133.
[2] P. Svasta, I.Plotog, T. Cucu, A. Vasile A. Marin, "4 P Soldering Model
for Solder Joints Quality Assessment", in ISSE 2009, Brno, Czech
Republic, Abstracts Proceeding ISBN 978-80-214-3874-3, pp. 56-57.
[3] I. Plotog, P. Svasta, N. D. Codreanu, T. C. Cucu, C. Turcu, G. Varzaru,
G. Lazar, "Investigations on Assembling of Electronic Packages onto
Glass Substrates using Lead-free Technology", in ISSE 2008, Budapest,
Hungary, Conference proceedings, pp. 415-41.
[4] R. Strauss, SMT Soldering Handbook, Butterworth-Heinemann Linacre
House, Oxford, 1998, ISBN 0 7506 35894, pp. 179-189.
[5] http://thermophysical.tainstruments.com/PDF/technotes/TPN-
68%20Thermal%20Diffusivity%20by%20the%20Flash%20Method.pdf
[1] M. Brânzei, P. Svasta, F. Miculescu, M. Miculescu, I. Plotog,
"Correlation Between the Thermo-physical Properties, Geometry and
Microstructure of the SAC305 and SAC-X Typical Solder Joints", in
SIITME 2009, Gyula, Hungary, Conference proceedings CD, ISBN:
978-1-4244- 50330309, pp. 129-133.
[2] P. Svasta, I.Plotog, T. Cucu, A. Vasile A. Marin, "4 P Soldering Model
for Solder Joints Quality Assessment", in ISSE 2009, Brno, Czech
Republic, Abstracts Proceeding ISBN 978-80-214-3874-3, pp. 56-57.
[3] I. Plotog, P. Svasta, N. D. Codreanu, T. C. Cucu, C. Turcu, G. Varzaru,
G. Lazar, "Investigations on Assembling of Electronic Packages onto
Glass Substrates using Lead-free Technology", in ISSE 2008, Budapest,
Hungary, Conference proceedings, pp. 415-41.
[4] R. Strauss, SMT Soldering Handbook, Butterworth-Heinemann Linacre
House, Oxford, 1998, ISBN 0 7506 35894, pp. 179-189.
[5] http://thermophysical.tainstruments.com/PDF/technotes/TPN-
68%20Thermal%20Diffusivity%20by%20the%20Flash%20Method.pdf
@article{"International Journal of Electrical, Electronic and Communication Sciences:63794", author = "Mihai Brânzei and Ioan Plotog and Ion Pencea", title = "The Influence of Pad Thermal Diffusivity over Heat Transfer into the PCBs Structure", abstract = "The Pads have unique values of thermophysical
properties (THP) having important contribution over heat transfer
into the PCB structure.
Materials with high thermal diffusivity (TD) rapidly adjust their
temperature to that of their surroundings, because the HT is quick in
compare to their volumetric heat capacity (VHC).
In the paper is presenting the diffusivity tests (ASTM E1461 flash
method) for PCBs with different core materials. In the experiments,
the multilayer structure of PCBA was taken into consideration, an
equivalent property referring to each of experimental structure be
practically measured.
Concerning to entire structure, the THP emphasize the major
contribution of substrate in establishing of reflow soldering process
(RSP) heat transfer necessities. This conclusion offer practical
solution for heat transfer time constant calculation as function of
thickness and substrate material diffusivity with an acceptable error
estimation.", keywords = "heat transfer time constant, packaging, reflowsoldering process, thermal diffusivity.", volume = "7", number = "5", pages = "559-4", }