An Experimental Investigation of Thermoelectric Air-Cooling Module

This article experimentally investigates the thermal performance of thermoelectric air-cooling module which comprises a thermoelectric cooler (TEC) and an air-cooling heat sink. The influences of input current and heat load are determined. And performances under each situation are quantified by thermal resistance analysis. Since TEC generates Joule heat, this nature makes construction of thermal resistance network difficult. To simplify the analysis, this article emphasizes on the resistance heat load might meet when passing through the device. Therefore, the thermal resistances in this paper are to divide temperature differences by heat load. According to the result, there exists an optimum input current under every heating power. In this case, the optimum input current is around 6A or 7A. The performance of the heat sink would be improved with TEC under certain heating power and input current, especially at a low heat load. According to the result, the device can even make the heat source cooler than the ambient. However, TEC is not always effective at every heat load and input current. In some situation, the device works worse than the heat sink without TEC. To determine the availability of TEC, this study figures out the effective operating region in which the TEC air-cooling module works better than the heat sink without TEC. The result shows that TEC is more effective at a lower heat load. If heat load is too high, heat sink with TEC will perform worse than without TEC. The limit of this device is 57W. Besides, TEC is not helpful if input current is too high or too low. There is an effective range of input current, and the range becomes narrower when the heat load grows.

A New Design of Mobile Thermoelectric Power Generation System

This paper presents a compact thermoelectric power generator system based on temperature difference across the element. The system can transfer the burning heat energy to electric energy directly. The proposed system has a thermoelectric generator and a power control box. In the generator, there are 4 thermoelectric modules (TEMs), each of which uses 2 thermoelectric chips (TEs) and 2 cold sinks, 1 thermal absorber, and 1 thermal conduction flat board. In the power control box, there are 1 storing energy device, 1 converter, and 1 inverter. The total net generating power is about 11W. This system uses commercial portable gas stoves or burns timber or the coal as the heat source, which is easily obtained. It adopts solid-state thermoelectric chips as heat inverter parts. The system has the advantages of being light-weight, quite, and mobile, requiring no maintenance, and havng easily-supplied heat source. The system can be used a as long as burning is allowed. This system works well for highly-mobilized outdoors situations by providing a power for illumination, entertainment equipment or the wireless equipment at refuge. Under heavy storms such as typhoon, when the solar panels become ineffective and the wind-powered machines malfunction, the thermoelectric power generator can continue providing the vital power.

A New Design of Temperature-Controlled Chamber for OLED Panels

This paper presents an inexpensive and effective temperature-controlled chamber for temperature environment tests of Organic Light Emitting Diode (OLED) panels. The proposed chamber is a compact warmer and cooler with an exact temperature control system. In the temperature-controlled space of the chamber, thermoelectric modules (TEMs) are utilized to cool or to heat OLED panels, novel fixtures are designed to flexibly clamp the OLED panels of different size, and special connectors for wiring between the OLED panels and the test instrument are supplied. The proposed chamber has the following features. (1) The TEMs are solid semi-conductive devices, so they operate without noise and without pollution. (2) The volume of the temperature-controlled space of the chamber about 160mm*160mm*120mm, so the chamber are compact and easy to move. (3) The range of the controlled temperatures is from -10 oC to +80 oC, and the precision is ?0.5 oC. (4) The test instrument can conveniently and easily measure the OLED panels via the novel fixtures and special connectors. In addition to a constant temperature being maintained in the chamber, a temperature shock experiments can run for a long time. Therefore, the chamber will be convenient and useful for temperature environment tests of OLED panels.

Synthesis and Thermoelectric Behavior in Nanoparticles of Doped Co Ferrites

Samples of CoFe2-xCrxO4 where x varies from 0.0 to 0.5 were prepared by co-precipitation route. These samples were sintered at 750°C for 2 hours. These particles were characterized by X-ray diffraction (XRD) at room temperature. The FCC spinel structure was confirmed by XRD patterns of the samples. The crystallite sizes of these particles were calculated from the most intense peak by Scherrer formula. The crystallite sizes lie in the range of 37-60 nm. The lattice parameter was found decreasing upon substitution of Cr. DC electrical resistivity was measured as a function of temperature. The room temperature thermoelectric power was measured for the prepared samples. The magnitude of Seebeck coefficient depends on the composition and resistivity of the samples.

Silicon Nanowire for Thermoelectric Applications: Effects of Contact Resistance

Silicon nanowire (SiNW) based thermoelectric device (TED) has potential applications in areas such as chip level cooling/ energy harvesting. It is a great challenge however, to assemble an efficient device with these SiNW. The presence of parasitic in the form of interfacial electrical resistance will have a significant impact on the performance of the TED. In this work, we explore the effect of the electrical contact resistance on the performance of a TED. Numerical simulations are performed on SiNW to investigate such effects on its cooling performance. Intrinsically, SiNW individually without the unwanted parasitic effect has excellent cooling power density. However, the cooling effect is undermined with the contribution of the electrical contact resistance.